The XC3S2000-4FGG676I is a model from AMD Xilinx's Spartan-3 FPGA series, designed specifically for high-volume, budget-friendly electronic products. This FPGA is equipped with about 2 million system gates and 46,080 logic cells, which provide the necessary infrastructure to manage intricate digital systems. Additionally, it includes 737,280 bits of internal RAM to support various operations and data handling requirements. This device is encased in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package, ensuring durable and reliable connections in electronic assemblies. It also features a wide operational temperature range of -40°C to +100°C, making it exceptionally well-suited for tough industrial environments where equipment must perform under extreme conditions. These characteristics make the XC3S2000-4FGG676I a robust and versatile component, ideal to integrate advanced features into electronics projects while keeping costs low.
If you're looking to place a bulk order, now's the perfect time, so don't miss out.
• System Gates: The FPGA offers approximately 2,000,000 system gates.
• Logic Cells: Contains 46,080 logic cells that provide the basic functional elements for digital operations.
• Configurable Logic Blocks (CLBs): Includes 5,120 CLBs that can be programmatically configured to perform a wide range of logical functions.
• Internal RAM: Equipped with 737,280 bits of internal RAM, which facilitates efficient data handling and storage within the FPGA, supporting complex digital processing tasks.
• Number of I/O Pins: Provides up to 489 I/O pins, allowing for extensive interfacing with other digital systems and peripherals, enhancing the FPGA's integration capabilities in multi-component systems.
• Supply Voltage: Operates within a supply voltage range of 1.14V to 1.26V.
• Speed Grade: The -4 speed grade denotes a specific performance level, optimizing the device for high-speed digital applications.
• Package Type: Housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package.
• Operating Temperature: Designed to function reliably within an industrial temperature range from -40°C to +100°C, making it ideal for use in harsh environmental conditions.
XC3S2000-4FGG676I Symbol
XC3S2000-4FGG676I Footprint
XC3S2000-4FGG676I 3D Model
The block diagram for the XC3S2000-4FGG676I FPGA showcases its internal structure and organization, emphasizing the functional blocks and interconnects. At its core are the Configurable Logic Blocks (CLBs), the units used for implementing digital logic circuits. These CLBs are arranged in a grid-like structure, providing a large amount of programmable logic resources. Surrounding the CLBs are Input/Output Blocks (IOBs), which facilitate communication between the FPGA and external devices. These IOBs are strategically placed along the perimeter of the FPGA to ensure efficient data transfer. Block RAM is distributed across the chip to offer on-chip storage, ideal for implementing memory functions and buffering data. The multipliers are specialized components designed to handle arithmetic operations, especially useful for applications requiring fast and efficient digital signal processing (DSP). The presence of a Digital Clock Manager (DCM) is also evident, responsible for managing and distributing clock signals to ensure synchronization across various components. This block diagram effectively illustrates the XC3S2000-4FGG676I's modular architecture, which combines flexibility and performance. The interconnection network ties these components together, allowing for customized and efficient designs to a wide range of applications.
Type |
Parameter |
Manufacturer |
AMD Xilinx |
Series |
Spartan®-3 |
Packaging |
Tray |
Part Status |
Obsolete |
Number of LABs/CLBs |
5120 |
Number of Logic Elements/Cells |
46080 |
Total RAM Bits |
737280 |
Number of I/O |
489 |
Number of Gates |
2000000 |
Voltage - Supply |
1.14V ~ 1.26V |
Mounting Type |
Surface Mount |
Operating Temperature |
-40°C ~ 100°C (TJ) |
Package / Case |
676-BGA |
Supplier Device Package |
676-FBGA (27x27) |
Base Product Number |
XC3S2000 |
The FPGA is ideal for integration into digital televisions, set-top boxes, gaming consoles, and other multimedia devices due to its high logic density and I/O capabilities. These applications benefit from the FPGA's ability to handle complex graphical operations and interface with multiple peripherals.
Suited for harsh industrial environments, this FPGA can be used in control systems, robotics, and automated test equipment, where reliable performance under extreme temperatures and precise control are required. Its robust design ensures stable operation in demanding industrial settings.
The XC3S2000-4FGG676I is capable of high-speed data processing and has numerous I/O pins, making it suitable for communications hardware such as routers, switches, and network interface cards. It supports the complex algorithms needed for data packet processing and network traffic management.
In the automotive sector, the FPGA can be integrated into infotainment systems, advanced driver-assistance systems (ADAS), and electronic control units (ECUs). Its capacity to function reliably across a wide temperature range and its processing power are advantageous for managing multiple real-time automotive applications.
The device is applicable in medical technology, particularly in medical imaging systems, diagnostic equipment, and patient monitoring systems. Its high-performance capabilities allow for the processing and analysis of complex medical data, contributing to more accurate diagnostics and monitoring.
The FPGA is equipped with approximately 2,000,000 system gates and 46,080 logic cells. This high logic density allows for the implementation of more complex algorithms and processes within a single chip, making it highly effective for sophisticated digital applications that require extensive logic operations.
With up to 489 I/O pins, this FPGA can handle multiple inputs and outputs simultaneously, enabling it to connect and communicate with a wide range of peripheral devices and other parts of a system. This feature is great for applications that require extensive data exchange and connectivity, such as telecommunications and industrial control systems.
Designed to operate reliably in extreme temperatures, the XC3S2000-4FGG676I functions within an industrial temperature range of -40°C to +100°C. This capability ensures stable performance in environments that are too harsh for standard components, making it ideal for outdoor, automotive, and industrial applications.
The Spartan-3 family, to which this FPGA belongs, is tailored for high-volume, cost-sensitive markets. This model offers an optimal balance of cost and performance, providing value for applications like consumer electronics keeping costs low without compromising on the system's capabilities.
The XC3S2000-4FGG676I has been discontinued and is no longer being produced. This status makes it difficult to obtain for new projects or replacements, potentially leading to challenges in maintaining or expanding existing systems that rely on this specific model.
Compared to more recent FPGA models, the XC3S2000-4FGG676I lacks several modern features such as high-speed transceivers, advanced DSP (Digital Signal Processing) capabilities, and more robust security features. This limitation can hinder the FPGA's applicability in cutting-edge applications that require these advanced functionalities.
With a speed grade of -4, this FPGA may not satisfy the performance needs of newer applications that demand higher processing speeds and reduced latency. Its performance metrics might fall short in handling intensive computational tasks efficiently in today's technology landscape.
Built on older semiconductor process technology, the XC3S2000-4FGG676I tends to consume more power compared to newer FPGAs that utilize advanced, low-power processes. This higher power consumption can be a drawback in applications where energy efficiency is required.
As newer FPGA families take precedence in the market, the availability of updated development tools, software support, and community resources for the XC3S2000-4FGG676I diminishes. This reduction can complicate the development process, from initial design through troubleshooting and optimization, making it less attractive to designers and engineers.
Xilinx, a leader in programmable logic devices, was acquired by Advanced Micro Devices (AMD) in 2021. This move was strategic for AMD, aiming to expand beyond its traditional CPU and GPU markets into the growing areas of FPGA and adaptive computing. The merger of Xilinx into AMD is expected to spark innovation by combining their expertise, possibly leading to new products that utilize both CPU and FPGA technologies. This integration strengthens AMD's position in the semiconductor industry, preparing it to meet future technological challenges. Additionally, this acquisition shifts the industry dynamics, potentially affecting future technological collaborations and advancements.
The XC3S2000-4FGG676I is a strong and versatile chip, built to work well in tough conditions and handle detailed digital tasks. Although it's no longer being made, it's still important for many systems out there because it can do a lot at once, connect with many devices, and work in very hot or cold places. This article explained what makes this chip good, its downsides, and how it fits into the bigger picture of electronic components. Knowing about chips like this helps people make better choices in their electronic projects, especially as technology keeps changing.
Please send an inquiry, we will respond immediately.
Yes, the XC3S2000-4FGG676I is particularly effective in cost-sensitive, high-volume industries like consumer electronics and industrial automation, where the environmental robustness and high I/O pin count are more important than cutting-edge speed or advanced DSP capabilities.
The XC3S2000-4FGG676I's ability to operate in temperatures ranging from -40°C to +100°C makes it exceptionally suitable for outdoor or industrial applications that require durable components that can withstand extreme conditions.
With around 2 million system gates and over 46,000 logic cells, the XC3S2000-4FGG676I can handle complex algorithms and processes. This makes it ideal for applications requiring extensive logical operations and data processing.
The XC3S2000-4FGG676I, built on older technology, may have higher power consumption compared to newer FPGAs. This factor could limit its use in battery-operated mobile devices where energy efficiency is required. Evaluating power management strategies or opting for lower-power FPGAs might be necessary for portable applications.
The XC3S2000-4FGG676I is supported by Xilinx ISE Design Suite for program development. While newer tools like Vivado do not support this model, ISE provides comprehensive capabilities for coding, simulation, and debugging FPGA designs.
on February 4th
on February 3th
on February 9th 8636
on February 9th 6589
on January 1th 5779
on January 1th 5679
on January 1th 5224
on January 1th 4958
on January 1th 4836
on January 1th 4786
on February 9th 4777
on January 1th 4683