Micron starts construction of new HBM advanced packaging factory in Singapore
On January 8th, Micron started construction on a new high bandwidth memory (HBM) advanced packaging factory next to its existing factory in Singapore, and the company held a groundbreaking ceremony.
The new HBM advanced packaging factory will be the first of its kind in Singapore, with plans to commence operations in 2026. Micron's total advanced packaging capacity will significantly expand from 2027 to meet the growing demand for artificial intelligence. In addition, the factory will also support the long-term manufacturing needs of NAND.
Sanjay Mehrotra, President and CEO of Micron, said, "As the application of artificial intelligence continues to expand in various industries, the demand for advanced memory and storage solutions will continue to grow strongly. With the continued support of the Singapore government, our investment in this HBM advanced packaging factory enhances our position to respond to the expanding opportunities of artificial intelligence in the future
It is reported that Micron's investment in HBM advanced packaging is about 7 billion US dollars, and it is expected to create about 1400 job opportunities by 2020 and beyond. The factory expansion plan is expected to create about 3000 job opportunities in the future, including packaging development, assembly, and testing operations.
Previously, Micron announced the latest developments in the next-generation HBM4 and HBM4E processes, and the company expects to begin mass production in 2026. HBM4 is expected to bring the most advanced performance and efficiency data, which is precisely the way to enhance the computing power of artificial intelligence.
Sanjay Mehrotra, President and CEO of Micron, said, "As the application of artificial intelligence continues to expand in various industries, the demand for advanced memory and storage solutions will continue to grow strongly. With the continued support of the Singapore government, our investment in this HBM advanced packaging factory enhances our position to respond to the expanding opportunities of artificial intelligence in the future
It is reported that Micron's investment in HBM advanced packaging is about 7 billion US dollars, and it is expected to create about 1400 job opportunities by 2020 and beyond. The factory expansion plan is expected to create about 3000 job opportunities in the future, including packaging development, assembly, and testing operations.
Previously, Micron announced the latest developments in the next-generation HBM4 and HBM4E processes, and the company expects to begin mass production in 2026. HBM4 is expected to bring the most advanced performance and efficiency data, which is precisely the way to enhance the computing power of artificial intelligence.