SK Hynix Showcases Next-Generation NAND Flash Product Strategy at OCP 2025 Summit
On October 27, 2025, SK Hynix announced that it showcased its next-generation NAND flash product strategy at the “2025 OCP Global Summit” (hereinafter referred to as the “Summit”), held in San Jose, California, USA, from October 13 to 16 local time.
The company stated: “With the rapid growth of the AI inference market, industry demand for NAND flash products capable of swiftly and efficiently processing massive data volumes is surging. To address this, we will establish the ‘AIN (AI-NAND) Family’ product portfolio—a suite of solutions optimized for the AI era to comprehensively meet diverse customer needs.”
During the executive session on the second day of the summit, Kim Cheon-sung, Vice President of Enterprise SSD (eSSD) Product Development at SK hynix, presented the AIN Family portfolio as a keynote speaker.
The AIN Family comprises NAND flash solutions optimized for Performance, Bandwidth, and Density, aiming to accelerate data processing speeds while maximizing storage capacity.
AIN P (Performance) is a high-efficiency solution engineered for massive data input/output in large-scale AI inference environments. By minimizing bottlenecks between AI computation and storage, it significantly boosts processing speed and energy efficiency. To achieve this, the company is redesigning NAND flash and controllers with a new architecture, planning to release samples by the end of 2026.
Conversely, AIN D (Density) is a high-capacity solution designed for massive data storage at low power and cost, particularly suited for AI data storage. Compared to existing TB-class SSDs based on QLC*, AIN D can scale storage capacity up to the PB level while balancing the high-speed performance of SSDs with the cost-effectiveness of HDDs, positioning it as a tiered storage product.
Finally, AIN B (Bandwidth) is a solution that expands bandwidth by stacking NAND flash memory. This product utilizes the company's proprietary ‘HBF*’ technology.