TSMC Raises CoWoS Production Capacity Targets for 2026–2027 Across the Board
January 29th, according to the STAR Market Daily, TSMC will comprehensively ramp up CoWoS production capacity over the next two years. With NVIDIA already its largest client and ASIC chip customers like Google frequently placing urgent orders to secure capacity, TSMC has recently finalized plans to comprehensively raise its 2026-2027 CoWoS production targets and is re-evaluating its original advanced packaging expansion blueprint. Supply chain sources indicate that TSMC's AP8 facility in Southern Taiwan Science Park will add a new P2 plant, with both facilities primarily focused on CoWoS production. Meanwhile, the AP7 facility in Chiayi—originally dedicated to WMCM, SoIC, and CoPoS—will shift its SoIC production to CoWoS.