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HomeProductsRF/IF and RFIDRF AmplifiersADL8106ACEZ-R7
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ADL8106ACEZ-R7 - Analog Devices Inc.

Manufacturer Part Number
ADL8106ACEZ-R7
Manufacturer
Analog Devices, Inc.
Allelco Part Number
98D-ADL8106ACEZ-R7
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
36,501 pcs available, New & Original
Parts Description
IC RF AMP GPS 18GHZ-54GHZ 24LGA
Package
24-LGA-CAV (5x5)
Data sheet
-
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 36501
  • Unit Price: $267.63
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $267.63 $267.63
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

ADL8106ACEZ-R7 Tech Specifications
Analog Devices Inc. - ADL8106ACEZ-R7 technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc. - ADL8106ACEZ-R7

Product Attribute Attribute Value
Manufacturer Analog Devices, Inc.
Voltage - Supply 2V ~ 3.5V
Test Frequency 50GHz ~ 54GHz
Supplier Device Package 24-LGA-CAV (5x5)
Series -
RF Type General Purpose
Package / Case 24-LFLGA Exposed Pad
Product Attribute Attribute Value
Package Tape & Reel (TR)
P1dB 19dBm
Noise Figure 4dB
Mounting Type Surface Mount
Gain 20.5dB
Frequency 18GHz ~ 54GHz
Current - Supply 120mA

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN MMIC 3A001B2D
HTSUS 8542.33.0001

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when using the ADL8106ACEZ-R7 for a 54 GHz radar front-end application, and how do its gain and noise figure compare to similar GaAs MMIC amplifiers in this frequency range?
At 54 GHz, the ADL8106ACEZ-R7 delivers 20.5 dB of small-signal gain with a noise figure of 4 dB, which is relatively competitive for a general-purpose amplifier in this band. However, achieving this performance requires careful impedance matching due to high-frequency parasitics, and the 19 dBm output power at 1 dB compression (P1dB) limits maximum signal handling without distortion. Compared to alternative GaAs-based MMICs from vendors like Mini-Circuits or Marki Microwave, the ADL8106 typically shows higher linearity at the cost of slightly elevated current consumption—120 mA from a 3.3 V supply—which may necessitate thermal management in densely populated PCB layouts.
How does the ADL8106ACEZ-R7’s supply voltage range of 2V to 3.5V influence system-level power budgeting in battery-powered satellite communication terminals operating above 40 GHz?
The wide supply range of 2–3.5 V allows flexibility in interfacing with low-voltage digital control rails but increases design complexity when coordinating with bias sequencing logic. In battery-constrained systems, running the device at 2.5 V reduces static power by approximately 18% compared to 3.3 V operation (assuming linear current scaling), saving roughly 22 mW. This must be balanced against potential reductions in headroom for gain compression and increased sensitivity to supply ripple, especially since RF input levels near saturation can cause droop effects under dynamic loading.
Can the ADL8106ACEZ-R7 be used in cascaded stages for multi-octave bandwidth amplification, and what considerations apply regarding interstage matching and stability beyond 50 GHz?
Cascading the ADL8106ACEZ-R7 is feasible up to two stages if proper isolation and return loss are maintained. However, at frequencies above 50 GHz, even modest reflections into the amplifier input can lead to oscillation due to reduced loop gain margin. A typical solution involves integrating resistive feedback or adding attenuating pads between stages. Additionally, the 20.5 dB gain per stage implies that second-stage noise contribution becomes significant; therefore, placing a low-noise pre-amplifier before the first stage may improve overall NF, though this depends on system architecture.
What is the impact of package parasitics—specifically inductance and capacitance—on input/output matching when mounting the ADL8106ACEZ-R7 in a 5x5 LGA configuration on FR-4 versus high-frequency laminate?
On standard FR-4 substrates, the parasitic inductance of the 24-LGA-CAV package pads (~0.3 nH) and pad-to-substrate capacitance (~0.15 pF) degrade S11 below −10 dB above 30 GHz. For optimal performance above 40 GHz, Rogers RO4350B or similar high-frequency laminates are strongly recommended to minimize dielectric losses and stabilize characteristic impedance. Even then, external matching networks using lumped elements or microstrip lines remain essential for achieving target impedance across the full 18–54 GHz band.
How does the Moisture Sensitivity Level 3 classification of the ADL8106ACEZ-R7 affect reflow soldering profiles, and what precautions should be taken during production assembly?
As an MSL 3 component requiring handling within 168 hours after opening the moisture barrier bag, the ADL8106ACEZ-R7 demands strict adherence to JEDEC J-STD-033. This includes baking at 125°C for 24 hours prior to reflow if shelf life exceeds the threshold. During reflow, peak temperatures must not exceed 245°C to avoid degradation of bond wires and semiconductor interfaces, particularly given the device’s narrow thermal profile and sensitivity to thermal stress in fine-pitch packages.
In what scenarios would the ADL8106ACEZ-R7 outperform discrete transistor implementations such as HEMTs or PHEMTs for broadband RF amplification in defense or test instrumentation applications?
The ADL8106 offers superior integration density, reduced layout parasitics, and consistent repeatability across production batches compared to discrete solutions, making it preferable in mass-deployed phased-array modules or automated test equipment where calibration overhead is prohibitive. While discrete PHEMTs like those from Qorvo can achieve marginally lower noise figures (<3 dB), they require complex biasing networks, larger footprints, and greater tuning effort—advantages that diminish in environments demanding reliability, manufacturability, and fast time-to-market.
How does the ECCN classification (MMIC 3A001B2D) affect export compliance when sourcing the ADL8106ACEZ-R7 internationally for commercial aerospace projects?
The ECCN 3A001B2D designation indicates controlled status under U.S. Export Administration Regulations due to military end-use potential. Importers must obtain licenses when exporting to certain countries unless covered by license exceptions like License Exception TSR. For commercial aerospace applications involving frequencies above 40 GHz, additional end-user certifications and technical documentation may be required to demonstrate non-military usage, increasing procurement lead times and compliance burden.
What design constraints arise from the ADL8106ACEZ-R7’s test frequency specification of 50–54 GHz, and how might measured performance differ from simulated models below 50 GHz?
The datasheet guarantees parameters only over 50–54 GHz; below this range, gain roll-off may exceed modeled predictions due to unaccounted package resonances and substrate coupling. Simulations assuming ideal transmission lines often overestimate gain by 2–3 dB at 40 GHz because real-world PCB traces exhibit higher dispersion. Therefore, empirical characterization using vector network analyzers calibrated to wafer probes is critical for accurate modeling in systems targeting sub-50 GHz bands, even if nominal operation starts earlier.
How should decoupling be implemented for the ADL8106ACEZ-R7 in high-reliability systems where power integrity is critical near 54 GHz?
Due to the amplifier’s 120 mA quiescent current and high-frequency operation, decoupling capacitors must be placed within 1 mm of each VDD pin using surface-mount 100 fF ceramic capacitors with X7R dielectrics rated for ≥50 V. These should be paired with ferrite beads exhibiting <0.5 Ω DC resistance and >1 kΩ impedance at 10 GHz to suppress resonant modes. Ground vias adjacent to the exposed pad further reduce ground inductance, minimizing supply-induced phase noise in sensitive receiver paths.
What are the implications of the ADL8106ACEZ-R7’s RoHS3 compliance and REACH unaffected status for global manufacturing partners in regions with evolving chemical regulations?
RoHS3 compliance ensures absence of restricted substances including Pb, Cd, Hg, and certain phthalates, facilitating use in EU and other regulated markets. The REACH unaffected declaration means no SVHCs (Substances of Very High Concern) are intentionally added above 0.1% w/w, reducing audit complexity for supply chain due diligence. However, users must still verify full material declarations from distributors, as some packaging components (e.g., adhesives or coatings) may fall outside the scope of these statements.
How does the ADL8106ACEZ-R7 compare to the Analog Devices ADL5802 in terms of linearity and power efficiency for pulsed radar applications above 40 GHz?
The ADL8106 exhibits higher P1dB (19 dBm vs. 16.5 dBm) and better gain flatness than the ADL5802 at 50+ GHz, making it more suitable for high-dynamic-range pulsed systems. However, the ADL5802 consumes significantly less current (60 mA vs. 120 mA), improving power efficiency in battery-backed radar nodes. Trade-offs thus favor the ADL8106 when peak power and linearity dominate, while the ADL5802 excels in energy-constrained deployments despite lower output capability.
What layout guidelines ensure minimal insertion loss and stable oscillation behavior when routing RF signals to/from the ADL8106ACEZ-R7 in a dense mmWave module?
Maintain constant 50 Ω microstrip or stripline impedance with controlled-dielectric layers (εr = 3.0–3.5). Avoid vias in signal paths; use via-in-pad with back-drilling if necessary. Keep guard rings around RF ports grounded through multiple vias spaced λ/10 at center frequency. Place the amplifier centrally with symmetric power and ground planes to prevent mode conversion. Simulation with 3D EM tools like Keysight ADS Momentum is advised before fabrication to validate coupling and radiation losses.
Why might a designer choose tape and reel packaging (TR) for the ADL8106ACEZ-R7 despite its limited availability in small quantities?
Tape and reel enables automated pick-and-place assembly, reducing manual handling errors and improving yield in high-volume production. Even for prototyping, automated handling minimizes ESD risk during placement, which is crucial given the device’s micron-scale interconnects. While breakout boards or trays offer convenience for evaluation, TR packaging aligns with scalable manufacturing workflows and supports Just-In-Time inventory strategies common in telecom infrastructure rollouts.
How does temperature variation affect the ADL8106ACEZ-R7’s gain and noise figure in outdoor millimeter-wave surveillance systems deployed across wide climatic ranges?
Across −40°C to +85°C, gain variation is typically ±1.5 dB due to semiconductor mobility shifts, while noise figure degrades by 0.3–0.5 dB at extremes because of increased carrier scattering. Supply current also rises slightly with temperature, contributing to thermal drift. To mitigate, implement closed-loop bias regulation and thermal compensation in the driver stage, ensuring consistent performance despite ambient fluctuations common in field installations.
What role does the exposed pad play in thermal management for the ADL8106ACEZ-R7, and how should it be connected in a multilayer PCB?
The exposed pad serves both electrical grounding and heat sinking, dissipating up to 1.8 W under normal conditions. It must be soldered directly to a solid ground plane using multiple thermal vias (minimum 8, 0.3 mm diameter) to transfer heat to internal or bottom-layer copper. Insufficient thermal coupling raises junction temperature, degrading reliability and shifting P1dB over time. Avoid insulating solder mask coverage; instead, use via-in-pad filled and capped for mechanical robustness.
Can the ADL8106ACEZ-R7 be used in receive chains without compromising LNA performance, and what external components are needed for optimal noise matching?
Yes, but only with careful external noise matching networks optimized for 4 dB NF. A shunt capacitor (≈0.5 pF) combined with series inductive stubs can tune the source impedance to the amplifier’s minimum noise point. However, this reduces bandwidth slightly compared to dedicated LNAs like the HMC1043, which offer better NF (<2.5 dB) and integrated matching. Thus, the ADL8106 is viable in cost-sensitive designs but not optimal for ultra-low-noise applications.
How does the ADL8106ACEZ-R7 handle harmonic distortion in modulated signals such as 64-QAM at 50 Gbps over 52 GHz?
Under high-order modulation, IMD3 products increase rapidly near P1dB. For 64-QAM at 50 Gbps, input levels should be backed off by 3–4 dB from saturation to maintain error vector magnitude (EVM) below 5%. The ADL8106’s third-order intercept point (OIP3) is approximately 28 dBm, limiting spectral purity in dense constellations. Pre-distortion or digital predistortion (DPD) may be required in high-speed links to compensate for nonlinearities.
What verification steps are recommended before deploying the ADL8106ACEZ-R7 in a satellite payload operating in Ka-band with strict radiation hardening requirements?
Beyond standard functional testing, conduct accelerated life tests (ALT) including thermal cycling (−55°C to +125°C), humidity exposure (85°C/85% RH), and total ionizing dose (TID) up to 10 krad(Si). Monitor parametric drift in gain, NF, and P1dB post-exposure. Radiation-hardened versions may be required for space-grade deployment; consult Analog Devices for qualified alternatives or custom screening options, as the standard part is not inherently radiation tolerant.

Parts with Similar Specifications

The three parts on the right have similar specifications to Analog Devices Inc. ADL8106ACEZ-R7

Product Attribute ADL8107ACPZN-R7 ADL8104ACPZN-R7 ADL8111ACCZN-R7 ADL8106ACEZ
Part Number ADL8107ACPZN-R7 ADL8104ACPZN-R7 ADL8111ACCZN-R7 ADL8106ACEZ
Manufacturer Analog Devices Inc. Analog Devices Inc. Analog Devices Inc. Analog Devices Inc.
P1dB - - - -
Frequency - - - -
Current - Supply - - - -
Gain - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Voltage - Supply - - - -
RF Type - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Mounting Type - Surface Mount Through Hole Surface Mount
Noise Figure - - - -
Series - - - -
Test Frequency - - - -

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Analog Devices Inc.

ADL8106ACEZ-R7

Analog Devices Inc.
98D-ADL8106ACEZ-R7

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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