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HomeProductsIntegrated Circuits (ICs)Data Acquisition - Digital to Analog Converters (DAC)LTC2657BIFE-H16#PBF
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LTC2657BIFE-H16#PBF - Analog Devices Inc.

Manufacturer Part Number
LTC2657BIFE-H16#PBF
Manufacturer
Analog Devices, Inc.
Allelco Part Number
98D-LTC2657BIFE-H16#PBF
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
45,578 pcs available, New & Original
Parts Description
IC DAC 16BIT V-OUT 20TSSOP
Package
20-TSSOP-EP
Data sheet
LTC2657BIFE-H16.pdf

Datasheets

LTC2657.pdf
RoHs Status
ROHS3 Compliant
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In stock: 45578
  • Unit Price: $36.555
  • Subtotal: $0.00

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Specifications

LTC2657BIFE-H16#PBF Tech Specifications
Analog Devices Inc. - LTC2657BIFE-H16#PBF technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc. - LTC2657BIFE-H16#PBF

Product Attribute Attribute Value
Manufacturer Analog Devices, Inc.
Voltage - Supply, Digital 5V
Voltage - Supply, Analog 5V
Supplier Device Package 20-TSSOP-EP
Settling Time 9.1µs (Typ)
Series -
Reference Type External, Internal
Package / Case 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Package Tube
Output Type Voltage - Buffered
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C
Number of D/A Converters 8
Number of Bits 16
Mounting Type Surface Mount
INL/DNL (LSB) ±2, ±0.3
Differential Output No
Data Interface I²C
Base Product Number LTC2657
Architecture -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

How does the LTC2657BIFE-H16#PBF perform in terms of integral non-linearity (INL) and differential non-linearity (DNL), and what design implications does this have for precision analog output applications?
The LTC2657BIFE-H16#PBF achieves an INL of ±2 LSB and a DNL of ±0.3 LSB, indicating high linearity across its 16-bit resolution. This level of precision makes it suitable for applications requiring accurate voltage scaling, such as industrial process control or test instrumentation. The tight DNL ensures monotonic behavior without missing codes, which is critical when cascading multiple DACs or interfacing with high-resolution analog subsystems.
What are the key differences between using an internal versus external reference with the LTC2657BIFE-H16#PBF, and how should system designers evaluate stability and noise performance?
The LTC2657BIFE-H16#PBF supports both internal and external references, offering flexibility in system design. An internal reference reduces component count and board space but may exhibit higher temperature drift and noise compared to precision external references like the LTZ1000 or ADR43x series. For systems demanding long-term accuracy over temperature (e.g., -40°C to 85°C), an external low-noise, low-drift reference is often preferred despite increased BOM complexity.
How does the settling time of 9.1 µs (typical) affect dynamic performance in closed-loop control systems using the LTC2657BIFE-H16#PBF?
At 9.1 µs typical settling time, the LTC2657BIFE-H16#PBF can support control loop bandwidths up to approximately 35 kHz assuming a second-order response margin. In motor drives or power supply feedback loops where rapid updates are needed, this limits maximum loop frequency. Designers must account for this latency in stability analysis, especially when using high-gain amplifiers or fast feedback networks that could otherwise introduce phase lag beyond acceptable thresholds.
Can the LTC2657BIFE-H16#PBF drive capacitive loads directly, and what precautions should be taken if used with long traces or PCB parasitics?
While the LTC2657BIFE-H16#PBF features buffered outputs designed to drive moderate capacitive loads, direct connection to large capacitors or long PCB traces can degrade stability due to increased phase lag and potential oscillation. For loads exceeding 100 pF or trace lengths over 10 cm, adding a small series resistor (10–100 Ω) at the output helps dampen ringing and maintain transient response integrity.
How does the I²C interface on the LTC2657BIFE-H16#PBF compare with SPI-based alternatives in multi-drop environments, particularly regarding noise immunity and clock stretching?
Compared to SPI, I²C on the LTC2657BIFE-H16#PBF offers simpler wiring for multi-device configurations and supports clock stretching, allowing slower devices to pace data transfers—beneficial when coordinating with microcontrollers running at reduced speeds. However, I²C’s shared bus topology makes it more susceptible to noise on long runs unless proper pull-up resistors and filtering are implemented. SPI generally provides faster throughput but requires separate chip select lines.
What impact does supply voltage ripple have on the output accuracy of the LTC2657BIFE-H16#PBF when powered from a single 5V rail derived from a switching regulator?
Powering the LTC2657BIFE-H16#PBF from a switching regulator introduces potential supply-induced errors, especially in the analog section. Even with good PSRR (typically >60 dB at 1 kHz for similar ADI parts), high-frequency ripple above 100 mVpp can modulate the output by several LSBs. Using local LDOs (e.g., ADP7105) near the DAC or adding π-filters on the 5V analog supply minimizes this effect and preserves effective resolution.
How should layout considerations differ between digital and analog ground planes when implementing the LTC2657BIFE-H16#PBF in a mixed-signal PCB?
The LTC2657BIFE-H16#PBF benefits from careful separation of analog and digital grounds to prevent digital noise coupling into the precision analog path. A single-point connection (star ground) at the DAC’s ground pin, combined with dedicated return paths under the exposed pad, reduces ground bounce. Routing the I²C signals away from analog traces and avoiding vias near sensitive nodes further enhances signal integrity and measurement repeatability.
What are the thermal implications of operating the LTC2657BIFE-H16#PBF at full temperature range (-40°C to 85°C), and does package dissipation limit continuous high-output scenarios?
With no specified maximum power dissipation in the datasheet, conservative estimates place junction-to-ambient thermal resistance around 50°C/W for the 20-TSSOP-EP package. Driving multiple channels simultaneously at high output voltages increases quiescent current slightly, but total power remains low (<20 mW typical). Thus, thermal derating is rarely an issue unless mounted in sealed enclosures; standard convection cooling suffices even at 85°C ambient.
How does the LTC2657BIFE-H16#PBF compare to the LTC2656 in terms of channel count, resolution, and settling time for multi-channel analog output applications?
The LTC2657BIFE-H16#PBF offers eight 16-bit channels with 9.1 µs settling time, while the LTC2656 provides four 16-bit channels with 12 µs settling time. Both use I²C interfaces and similar architectures. The LTC2657’s higher channel density makes it preferable for distributed sensor excitation or multi-axis control, whereas the LTC2656 may suffice for lower-channel-count designs where marginal speed improvement justifies cost savings.
What calibration strategies are recommended for minimizing gain and offset errors in systems using the LTC2657BIFE-H16#PBF over extended operational life?
Given the ±2 LSB INL and potential initial offset, factory calibration alone may not meet long-term system requirements. Implementing one-point or two-point calibration in firmware—measuring actual output at zero-scale and full-scale using a precision ADC—can correct for device-specific variations. Periodic recalibration every few thousand hours may be necessary in harsh environments where reference drift accumulates.
Is the LTC2657BIFE-H16#PBF suitable for battery-powered applications, and what factors influence its overall power consumption?
Yes, the LTC2657BIFE-H16#PBF consumes only ~2 mA from each 5V supply rail in active mode, making it feasible for battery-powered systems with intermittent duty cycles. However, continuous operation at 5V draws significant current relative to energy-constrained designs. Using shutdown modes via I²C commands and switching to lower-voltage references (if compatible) can extend runtime in portable instrumentation.
How does the Moisture Sensitivity Level (MSL) rating of 1 for the LTC2657BIFE-H16#PBF affect storage and handling during PCB assembly?
With MSL 1, the LTC2657BIFE-H16#PBF has unlimited shelf life and no pre-baking required before reflow soldering, simplifying inventory management and reducing manufacturing overhead. This aligns with standard lead-free assembly processes and supports Just-In-Time production workflows without special humidity-controlled storage.
What role does the exposed pad play in thermal and electrical performance of the LTC2657BIFE-H16#PBF, and how should it be connected during PCB design?
The exposed pad on the underside of the 20-TSSOP-EP package serves dual purposes: it improves heat dissipation by conducting thermal energy to the PCB copper plane and acts as a stable electrical reference point tied to analog ground. It must be soldered to a solid ground plane area with multiple vias to minimize impedance and ensure consistent analog return paths.
Can the LTC2657BIFE-H16#PBF generate bipolar (±Vref) output ranges, and how is this typically configured?
No, the LTC2657BIFE-H16#PBF is unipolar and outputs 0 to Vref. To achieve bipolar swing, external op-amps (e.g., ADA4898) are used in inverting summing configurations with offset adjustment. Alternatively, some systems employ dual-supply operation with negative rails to shift the baseline, though this increases power and complexity.
How does the choice between internal and external reference affect effective resolution in real-world conditions, considering noise and drift?
Using an external reference like the ADR4550 (5 ppm/°C drift, 10 µVpp noise) can improve effective resolution beyond 16 bits in stable environments by providing superior long-term stability compared to internal sources. Over the -40°C to 85°C range, a high-quality external reference reduces gain error variation by orders of magnitude, making the system resolution limited more by DAC linearity than reference instability.
What are the implications of using the LTC2657BIFE-H16#PBF in safety-critical systems requiring functional redundancy or diagnostic features?
The LTC2657BIFE-H16#PBF lacks built-in self-test or watchdog functionality, so additional monitoring circuitry (e.g., window comparators fed back via ADC) is needed for fault detection. In SIL-rated systems, dual DAC architectures with cross-checking logic may be mandated. Its absence of diagnostic registers necessitates external supervision for compliance with standards like IEC 61508.
How does the LTC2657BIFE-H16#PBF handle simultaneous updates across all eight channels, and what timing constraints apply?
All eight channels can be updated simultaneously through a broadcast write command, ensuring deterministic output transitions without glitches. The settling time applies per channel after update, and since outputs are buffered, they transition cleanly within 9.1 µs. This feature is useful for synchronized multi-axis actuation or parallel DAC calibration.
What ESD protection levels should be assumed for the LTC2657BIFE-H16#PBF, and how does this impact board-level design practices?
Although not explicitly rated in the public datasheet, Analog Devices typically implements >2 kV HBM ESD protection on similar packages. Nevertheless, robust board design—including short lead lengths, ferrite beads on supplies, and TVS diodes on I/O lines—is advisable, especially in industrial settings where electrostatic discharge events are common during servicing or installation.

Parts with Similar Specifications

The three parts on the right have similar specifications to Analog Devices Inc. LTC2657BIFE-H16#PBF

Product Attribute LTC2657BIFE-H16#TRPBF LTC2657BCFE-H16#PBF LTC2657BIFE-L16#TRPBF LTC2657BIFE-L16#PBF
Part Number LTC2657BIFE-H16#TRPBF LTC2657BCFE-H16#PBF LTC2657BIFE-L16#TRPBF LTC2657BIFE-L16#PBF
Manufacturer Analog Devices Inc. Analog Devices Inc. Analog Devices Inc. Analog Devices Inc.
Output Type - Current - Unbuffered Voltage - Buffered -
Number of Bits - 16 8 14
Voltage - Supply, Digital - 1.14V ~ 1.26V 11.4V ~ 16.5V 1.65V ~ 3.6V
Differential Output - Yes No -
Data Interface - LVDS - Parallel I²C LVDS - Parallel, Parallel
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Base Product Number - DAC34H84 MAX500 ADS62P42
Architecture - Current Source R-2R Pipelined
Voltage - Supply, Analog - 3.14V ~ 3.46V 11.4V ~ 16.5V 3V ~ 3.6V
INL/DNL (LSB) - ±4, ±2 ±1 (Max), ±1 (Max) -
Number of D/A Converters - 4 4 -
Settling Time - 10ns (Typ) 4.5µs -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Reference Type - External, Internal External External, Internal

LTC2657BIFE-H16#PBF Datasheet PDF

Download LTC2657BIFE-H16#PBF pdf datasheets and Analog Devices Inc. documentation for LTC2657BIFE-H16#PBF - Analog Devices Inc..

Datasheets
LTC2657.pdf
Environmental Information
Material Declaration LTC2657BIFE-H16#PBF.pdf

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LTC2657BIFE-H16#PBF Image

LTC2657BIFE-H16#PBF

Analog Devices Inc.
98D-LTC2657BIFE-H16#PBF

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