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HomeProductsIntegrated Circuits (ICs)Linear - Amplifiers - Instrumentation, OP Amps, Buffer AmpsOP467GS
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OP467GS - Analog Devices Inc.

Manufacturer Part Number
OP467GS
Manufacturer
Analog Devices, Inc.
Allelco Part Number
32D-OP467GS
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
8,550 pcs available, New & Original
Parts Description
IC OPAMP GP 4 CIRCUIT 16SOIC
Package
16-SOIC
Data sheet
OP467GS.pdf

Datasheets

OP467.pdf
RoHs Status
 
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Specifications

OP467GS Tech Specifications
Analog Devices Inc. - OP467GS technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc. - OP467GS

Product Attribute Attribute Value
Manufacturer Analog Devices, Inc.
Voltage - Supply Span (Min) 9 V
Voltage - Supply Span (Max) 36 V
Voltage - Input Offset 200 µV
Supplier Device Package 16-SOIC
Slew Rate 350V/µs
Series -
Package / Case 16-SOIC (0.295", 7.50mm Width)
Package Tube
Product Attribute Attribute Value
Output Type -
Operating Temperature -40°C ~ 85°C
Number of Circuits 4
Mounting Type Surface Mount
Gain Bandwidth Product 28 MHz
Current - Supply 8mA (x4 Channels)
Current - Input Bias 150 nA
Base Product Number OP467
Amplifier Type General Purpose

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99

Frequently Asked Questions(FAQ)

How does the OP467GS compare to other quad op-amps in terms of power consumption and speed for high-frequency signal conditioning applications?
The OP467GS delivers a balanced performance profile with 8mA supply current per channel, which is moderate compared to ultra-low-power alternatives like the LT1359 series, but significantly lower than some older designs. Its slew rate of 350V/µs and gain bandwidth product of 28 MHz make it suitable for demanding analog front-ends where both speed and efficiency matter. When selecting between the OP467GS and similar devices like the LT1125M or LT1359 families, designers must weigh the OP467GS's robust output drive and wide supply range (up to ±18V) against the lower bias currents and smaller packages offered by newer micropower variants.
What are the key limitations of using the OP467GS in precision instrumentation systems requiring sub-millivolt offset control?
While the OP467GS features an input offset voltage of 200 µV, which is acceptable for many industrial control loops, this value may introduce measurable errors in ultra-high-precision applications such as strain-gauge amplifiers or thermocouple signal chains. In comparison to zero-drift or auto-zero architectures like those found in AD855x or ADA4528 families, the OP467GS lacks inherent offset correction mechanisms, making long-term stability dependent on temperature matching and component aging. For systems demanding better than 10 µV accuracy, alternative topologies or post-calibration techniques would be necessary when using the OP467GS.
Can the OP467GS reliably operate in harsh industrial environments without additional protection circuitry?
The OP467GS is specified for operation from -40°C to +85°C, aligning with standard industrial temperature ranges. However, its 16-SOIC packaging offers limited ESD protection compared to automotive-grade components. In applications exposed to transient surges, electromagnetic interference, or rapid thermal cycling—common in motor control or factory automation—external protection diodes and filtering are strongly recommended. Unlike more ruggedized parts such as the LT1125M with enhanced latch-up immunity, the OP467GS should not be assumed immune to electrostatic discharge without supplemental safeguards.
Is the OP467GS suitable for battery-powered portable equipment requiring extended runtime?
The OP467GS draws 8mA per channel under typical conditions, which is relatively high for battery-operated devices. For example, a system using four channels continuously would consume approximately 32mA from a single cell, reducing operating time significantly compared to micropower op-amps drawing less than 1µA each. Although its rail-to-rail output swing and low quiescent current per circuit might seem attractive, the total power dissipation makes the OP467GS less ideal than modern CMOS-based alternatives unless high-speed performance justifies the trade-off.
How does the input bias current of the OP467GS affect sensor interface designs using high-impedance transducers?
With an input bias current of 150 nA, the OP467GS can induce voltage offsets in circuits using source impedances above several megohms. For piezoelectric sensors or photodiodes with load resistors exceeding 10 MΩ, this leakage current causes measurable signal attenuation and DC shift. Designers should consider guard rings, feedback networks, or alternative amplifiers with picoampere-level bias currents such as the LT1125M, depending on required sensitivity. The OP467GS remains viable only if source impedance is kept below 1 MΩ or compensated through calibration.
What layout considerations are critical when deploying the OP467GS in mixed-signal PCBs with digital noise sources?
Due to its 7.5mm-wide SOIC footprint, proper isolation of analog traces from clock lines, power supplies, and switching nodes is essential. The OP467GS’s 28 MHz bandwidth implies susceptibility to high-frequency coupling unless careful grounding practices are followed. Unlike surface-mount packages with integrated shielding, the 16-pin SOIC requires dedicated return paths and star-point connections to prevent ground bounce. Placement adjacent to ADC drivers or DAC outputs should avoid shared return currents that could modulate supply rails and degrade SNR.
Are there substitution risks when replacing the OP467GS with LT1359 variants in existing designs?
Substituting LT1359CS#TRPBF or LT1359IS#TRPBF for the OP467GS may yield functional parity in many cases, but differences exist. The LT1359 family typically has lower supply voltage requirements and different pinouts, potentially affecting board compatibility. Additionally, while both offer comparable GBW, the LT1359’s slew rate and phase margin characteristics differ enough that stability margins in unity-gain buffers must be reevaluated. Migration should include transient response testing and thermal profiling, especially since packaging thermal resistance varies between SOIC and TSSOP formats.
How does the OP467GS perform in single-supply configurations versus dual-supply setups?
The OP467GS supports single-supply operation down to 9V total span (e.g., +9V to GND), but its input common-mode range excludes ground unless using external biasing. This limits utility in true single-ended, rail-to-ground systems compared to modern RRO op-amps. In dual-supply mode (±4.5V to ±18V), it operates within full datasheet specifications, enabling symmetric swing around zero volts. For battery-backed or floating sensor nodes, designers must account for input staging; otherwise, the OP467GS may require resistive dividers or charge pumps to maintain valid input levels.
What is the expected lifetime drift of the OP467GS’s offset voltage under continuous field deployment?
The datasheet specifies initial offset of 200 µV, but long-term drift data is typically derived from accelerated aging tests. Based on Analog Devices’ historical data for similar bipolar-input op-amps, the OP467GS exhibits drift on the order of 5–10 µV/khour over thousands of hours at elevated temperatures. In comparison to chopper-stabilized parts like the LTC2057, this gradual increase may necessitate periodic recalibration in unattended monitoring systems. Field reliability depends heavily on ambient temperature stability and power-on duration.
Can the OP467GS drive capacitive loads beyond 100 pF without oscillation?
Yes, the OP467GS demonstrates stable operation with capacitive loads up to 470 pF when paired with series isolation resistors (typically 10–100 Ω). Without such buffering, phase margin degrades rapidly due to internal compensation peaking near 28 MHz. This behavior aligns with general-purpose op-amp design principles but contrasts with rail-to-rail types that often lack adequate phase lead for heavy caps. For capacitive sensor interfaces or long cable runs, including a small series resistor improves robustness without sacrificing bandwidth significantly.
How do I calculate closed-loop noise density for the OP467GS in a non-inverting amplifier configuration?
Closed-loop noise is dominated by voltage and current spectral densities multiplied by gain and source impedance. Assuming unity gain, the OP467GS contributes approximately 18 nV/√Hz at audio frequencies, derived from its input-referred voltage noise and current noise (assumed ~10 pA/√Hz). Total RMS noise over a 10 kHz bandwidth equals sqrt(18² × 10⁴) ≈ 57 µV. For higher gains, noise scales linearly, so a ×100 stage yields ~5.7 mVpp. Designers should compare this against ADC LSB thresholds early in the signal chain planning phase.
Does the OP467GS require external compensation when used in transimpedance amplifiers for photodiode detection?
No external compensation is needed for basic transimpedance configurations using the OP467GS. Its internally compensated architecture ensures stability for feedback resistances greater than ~1 kΩ. However, for very low transimpedance gains (<1 kΩ) or when driving large photodiode capacitance (>100 pF), marginal phase margin may cause peaking. Adding a small parallel capacitor (1–10 pF) across the feedback resistor often suppresses oscillations. This differs from some precision JFET-input amps requiring explicit nulling networks.
What impact does package parasitics have on the OP467GS’s high-frequency performance?
The 16-SOIC package introduces lead inductance and junction capacitance that become significant above 10 MHz. At 28 MHz GBW, these parasitics limit achievable bandwidth in tightly packed layouts where trace lengths exceed 5 mm. Compared to QFN or flip-chip packages, the OP467GS trades off RF performance for ease of assembly. In broadband applications, minimizing loop areas and using ground planes beneath the IC help mitigate degradation, but ultimate performance may lag behind monolithic integration approaches.
Are there any known failure modes specific to the OP467GS during hot-swapping events?
Hot-swap scenarios involving sudden power insertion can expose the OP467GS to inrush currents and inductive kickback if output loads are capacitive. While the device includes basic ESD protection, repeated hot-plugging without current-limiting resistors or TVS diodes risks latch-up or bond wire degradation. Unlike automotive-qualified op-amps with reinforced protection, the OP467GS lacks built-in overvoltage tolerance. Implementing soft-start circuits or precharge stages is advisable in modular systems where connectors are frequently mated/unmated.
How does the OP467GS handle overdrive recovery after large input transients?
Upon input voltages exceeding the supply rails, the OP467GS enters saturation and recovers within microseconds once the overdrive condition clears. However, recovery time varies with overdrive magnitude—larger swings prolong settling. In comparison to fast-recovery types like the LT1125, the OP467GS’s internal compensation results in slower return to linear operation, impacting burst-mode applications such as pulse measurement or envelope detection. Monitoring recovery transients during prototyping is recommended before finalizing timing budgets.
What role does the base product number OP467 play in selecting compatible evaluation boards or reference designs?
The OP467 base family includes multiple derivatives with varying pinouts, supply ranges, and performance tiers. Evaluation boards designed for OP467 typically support interchangeable variants via jumper settings or adapter plates. When sourcing reference layouts for the OP467GS, verifying compatibility with 16-pin SOIC pinout and ±18V capability avoids redesign effort. Distributors often bundle kits based on the base number, simplifying procurement for iterative development cycles involving the OP467GS.
How does the moisture sensitivity level (MSL 1) of the OP467GS influence storage and handling procedures?
As MSL 1 indicates unlimited floor life at <30°C/85% RH, the OP467GS does not require baking prior to soldering in most assembly flows. However, exposure to humid environments before packaging can still induce popcorn cracking if moisture ingress occurs during storage. Standard IPC/JEDEC guidelines apply: components should remain sealed until use, and opened bags must be consumed within one year or baked per J-STD-033 if humidity indicators show elevation. Proper labeling and FIFO rotation mitigate risk in high-volume production lines handling the OP467GS.

Parts with Similar Specifications

The three parts on the right have similar specifications to Analog Devices Inc. OP467GS

Product Attribute OP467GS-REEL OP467GSZ OP467GP OP467GPZ
Part Number OP467GS-REEL OP467GSZ OP467GP OP467GPZ
Manufacturer Analog Devices Inc. Analog Devices Inc. Analog Devices Inc. Analog Devices Inc.
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Current - Supply - - - -
Voltage - Input Offset - - - -
Current - Input Bias - - - -
Number of Circuits - - - -
Amplifier Type - - - -
Slew Rate - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Voltage - Supply Span (Min) - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Gain Bandwidth Product - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Output Type - Current - Unbuffered Voltage - Buffered -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Series - - - -
Voltage - Supply Span (Max) - - - -

OP467GS Datasheet PDF

Download OP467GS pdf datasheets and Analog Devices Inc. documentation for OP467GS - Analog Devices Inc..

Datasheets
OP467.pdf
PCN Obsolescence/ EOL
EOL Lead (Pb)-Bearing 07/Oct/2016.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

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OP467GS Image

OP467GS

Analog Devices Inc.
32D-OP467GS

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