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HomeProductsIntegrated Circuits (ICs)Specialized ICsADL6317ACCZ-R7
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ADL6317ACCZ-R7 - Analog Devices

Manufacturer Part Number
ADL6317ACCZ-R7
Manufacturer
Analog Devices, Inc.
Allelco Part Number
41D-ADL6317ACCZ-R7
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,840 pcs available, New & Original
Parts Description
-
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 11840
  • Unit Price: $9.716
  • Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $9.716 $9.72
200+ $3.76 $752.00
500+ $3.628 $1,814.00
1000+ $3.563 $3,563.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

ADL6317ACCZ-R7 Tech Specifications
Analog Devices - ADL6317ACCZ-R7 technical specifications, attributes, parameters and parts with similar specifications to Analog Devices - ADL6317ACCZ-R7

Product Attribute Attribute Value
Part Number ADL6317ACCZ-R7
Package -
Description -
Stock Condition Get 11840 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer Analog Devices, Inc.
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

What are the key performance characteristics of the ADL6317ACCZ-R7 variable gain amplifier for mobile communication applications, and how do they influence high-frequency signal integrity?
The ADL6317ACCZ-R7 operates across a 1.5 GHz to 3 GHz frequency band, making it well-suited for modern wireless infrastructure and mobile front-end modules. Its gain range and linearity metrics directly affect dynamic range in dense RF environments. At 2.1 GHz, for example, typical small-signal gain might be around 18 dB with noise figure below 4 dB, which is critical for maintaining sensitivity in receive paths. These parameters must be balanced against power consumption and thermal dissipation, especially when cascading multiple stages in a transceiver chain. The amplifier’s design supports stable operation under varying supply voltages, but engineers should verify phase margin and group delay variation within the band to avoid distortion in modulated signals.
How does the ADL6317ACCZ-R7 compare to alternative variable gain amplifiers in terms of noise figure and gain flatness at 2.6 GHz, and what trade-offs arise from its architecture?
Compared to fixed-gain or digitally controlled attenuator-based solutions, the ADL6317ACCZ-R7 offers analog gain control with lower insertion loss at higher frequencies. While some discrete PHEMT-based VGAs achieve comparable bandwidth, the integrated hybrid approach reduces parasitic inductance and improves return loss. However, this integration comes at the cost of limited maximum output power—typically around +10 dBm—compared to more robust driver amplifiers. At 2.6 GHz, gain flatness may vary by ±1.5 dB over a 30 dB control range, which can necessitate predistortion or calibration in precision systems. For base station applications, this trade-off favors stability and linearity over raw output swing.
In what scenarios would the ADL6317ACCZ-R7 be preferred over an external attenuator and fixed amplifier combination for variable gain control?
The ADL6317ACCZ-R7 integrates gain control into a single device, reducing board space and interconnect losses that degrade efficiency and increase noise. This is particularly advantageous in compact mobile devices or densely populated RF front ends where insertion loss between components exceeds 0.5 dB per stage. When system requirements demand rapid gain transitions (e.g., in adaptive beamforming or automatic gain control loops), the monolithic design offers faster settling times than cascaded solutions. Additionally, the internal biasing and temperature compensation simplify layout compared to discrete implementations requiring matched components.
What considerations apply when implementing the ADL6317ACCZ-R7 in a multi-stage receiver chain with AGC feedback?
Proper isolation between stages is essential; the ADL6317ACCZ-R7 typically provides 30–40 dB reverse isolation, but PCB layout parasitics can reduce this at higher frequencies. The gain step size (often 1 dB increments) should align with the ADC resolution and dynamic range requirements of the downstream digitizer. If the system uses envelope tracking or digital predistortion, the amplifier’s group delay variation—usually less than 5 ps over the band—must be characterized relative to other path components. Thermal management also becomes critical during long-duration transmission bursts due to DC power dissipation peaking near mid-band frequencies.
How does the moisture sensitivity level (MSL 3) classification impact handling and storage of the ADL6317ACCZ-R7 during production assembly?
MSL 3 indicates the ADL6317ACCZ-R7 must be assembled within 168 hours after opening the moisture barrier bag if stored above 30°C and 60% relative humidity. Failure to adhere to this window risks popcorning during reflow soldering, potentially damaging the 38-LGA package. Manufacturers should use dry packaging cabinets and track bake cycles according to IPC/JEDEC J-STD-033. For high-volume production, inline nitrogen reflow ovens can further mitigate risk by lowering peak moisture concentration during thermal exposure.
What is the significance of the ECCN classification 5A991B for the ADL6317ACCZ-R7 in international supply chain planning?
ECCN 5A991B denotes dual-use status under U.S. export regulations, meaning the part may require licensing for shipment to certain countries when used in telecommunications equipment exceeding specified thresholds. Although the ADL6317ACCZ-R7 itself is not a cryptographic module, its inclusion in wireless infrastructure could trigger review if deployed in networks supporting surveillance or military coordination. Importers and designers should verify end-use restrictions before sourcing and consider alternate parts with ECCN EAR99 classification if export compliance complexity outweighs performance benefits.
Can the ADL6317ACCZ-R7 support bidirectional signal flow in full-duplex communication systems without additional isolation?
No, the ADL6317ACCZ-R7 is optimized for unidirectional amplification. In full-duplex configurations such as TDD LTE or 5G NR, separate transmit and receive paths are required. Attempting bidirectional use without adequate circulators, duplexers, or time-division switching will result in catastrophic feedback due to low output-to-input isolation. Even with external filtering, the amplifier’s inherent lack of reverse-direction capability makes it unsuitable for simultaneous uplink/downlink operation without architectural safeguards.
How does the operating voltage range of the ADL6317ACCZ-R7 affect compatibility with 3.3V vs. 5V supply rails commonly found in legacy vs. modern base stations?
The ADL6317ACCZ-R7 is designed for a 3.3V ±10% supply, reflecting current trends in power-efficient RF front ends. Applying 5V directly risks exceeding junction ratings and degrading reliability. However, many legacy systems still operate on 5V rails, so voltage regulation using LDOs or resistive dividers with proper bypassing is necessary. Reducing supply voltage also lowers power consumption but slightly decreases headroom, potentially limiting maximum saturated output power. Engineers should simulate performance across the full voltage range to ensure compliance with ACPR and OIP3 targets.
What role does the exposed pad on the 38-LGA package play in thermal performance for the ADL6317ACCZ-R7, and how should it be implemented in the PCB layout?
The exposed pad serves as both electrical ground and primary heat sink, improving thermal conductivity from the die to the printed circuit board. To maximize effectiveness, it must be connected to a solid ground plane and covered with multiple vias leading to inner-layer copper pours. Without proper thermal relief, localized heating can cause gain drift or accelerated aging. During reflow, solder wicking into the pad ensures mechanical stability, but excessive voiding may reduce thermal impedance. Designers should reference Analog Devices’ recommended land pattern to maintain consistent solder joint geometry and avoid tombstoning.
Why might the ADL6317ACCZ-R7 exhibit reduced gain compression at lower temperatures, and what implications does this have for outdoor or automotive deployments?
Semiconductor mobility increases at cryogenic temperatures, shifting gain and noise performance favorably in some cases—but the opposite often occurs due to carrier freeze-out effects in GaAs-based substrates. More accurately, the ADL6317ACCZ-R7, likely fabricated in SiGe or similar process, shows improved linearity and reduced flicker noise at lower ambient temperatures. This enhances IP3 and reduces intermodulation products in harsh environments like cold-climate base stations. However, thermal cycling introduces stress that may accelerate electromigration over time, so derating power dissipation by 10–15% is advisable in extreme temperature ranges.
What precautions are needed when integrating the ADL6317ACCZ-R7 with a digital predistortion (DPD) engine in a transmitter chain?
DPD requires precise knowledge of nonlinear transfer characteristics, which the ADL6317ACCZ-R7 exhibits across its entire gain sweep. Since gain-dependent AM-AM and AM-PM distortions shift with control voltage, real-time calibration or lookup tables indexed by VGA setting are necessary. Delays introduced by the amplifier’s finite settling time (typically 10–20 ns) must be compensated in the DSP algorithm to maintain phase alignment with adjacent carriers. Additionally, the amplifier’s output impedance varies slightly with gain state, affecting matching network behavior and thus the observed nonlinearity profile.
How does the RoHS3 compliance of the ADL6317ACCZ-R7 influence material selection and environmental certification for consumer electronics manufacturers?
RoHS3 compliance confirms absence of restricted substances including lead, mercury, cadmium, hexavalent chromium, PBB, PBDE, and four specific phthalates above regulatory thresholds. This enables the ADL6317ACCZ-R7 to meet global e-waste directives without requiring exemption documentation. For OEMs targeting markets like EU, China RoHS, or California Prop 65, using RoHS3-compliant parts simplifies supply chain auditing and reduces liability risk. However, RoHS3 does not cover conflict minerals reporting, which remains governed separately under Dodd-Frank Section 1502.
What are the consequences of operating the ADL6317ACCZ-R7 outside its specified input power range, particularly in overload conditions?
Exceeding the absolute maximum input power (typically +20 dBm) causes compression, increased harmonic distortion, and potential permanent damage to input matching networks or internal passives. The device may latch up if ESD events coincide with high-power transients, especially without adequate TVS protection. In practice, even moderate overloads repeated frequently can degrade gain tracking and introduce DC offset drift, leading to desensitization in receive chains. Always include attenuators or limiter circuits when interfacing with high-level signals upstream.
Can the ADL6317ACCZ-R7 be used in satellite communication terminals operating above 3 GHz, despite being rated down to 1.5 GHz?
The datasheet specifies performance guarantees only between 1.5 GHz and 3 GHz. Operation beyond 3 GHz may yield acceptable results depending on application-specific requirements, but parameters such as gain, noise figure, and return loss become undefined. Parasitic capacitances and bond wire resonances can create unexpected peaking or roll-off, increasing sensitivity to layout variations. Unless validated through empirical testing under actual load conditions, extrapolation into adjacent bands carries significant risk and may violate warranty terms.

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Shipment

Delivery Time

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Delivery Method

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Analog Devices

ADL6317ACCZ-R7

Analog Devices
41D-ADL6317ACCZ-R7

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