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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~XC6SLX45-2FGG676C~~

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XC6SLX45-2FGG676C - AMD

Name: AMD XC6SLX45-2FGG676C
Brand: AMD
SKU: XC6SLX45-2FGG676C
Availability: InStock
Rating: 5 (9 reviews)

Manufacturer Part Number: XC6SLX45-2FGG676C

Manufacturer: AMD Xilinx

Allelco Part Number: 32D-XC6SLX45-2FGG676C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 14,871 pcs available, New & Original

Parts Description: IC FPGA 358 I/O 676FBGA

Package: 676-FBGA (27x27)

Data sheet: XC6SLX45-2FGG67.pdf

Environmental Information
Xilinx REACH211 Cert.pdf

RoHs Status: ROHS3 Compliant

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Our certification

In stock: 14871

Specifications

XC6SLX45-2FGG676C Tech Specifications
AMD - XC6SLX45-2FGG676C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC6SLX45-2FGG676C

Product Attribute	Attribute Value
Manufacturer	AMD Xilinx
Voltage - Supply	1.14V ~ 1.26V
Total RAM Bits	2138112
Supplier Device Package	676-FBGA (27x27)
Series	Spartan®-6 LX
Package / Case	676-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	43661
Number of LABs/CLBs	3411
Number of I/O	358
Mounting Type	Surface Mount
Base Product Number	XC6SLX45

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991D
HTSUS	8542.39.0001

Parts Introduction

XC6SLX45-2FGG676C (1)

Manufacturer Part Number

XC6SLX45-2FGG676C

Manufacturer

Xilinx

Introduction

The XC6SLX45-2FGG676C is part of the Spartan-6 LX series and is designed for optimal performance in embedded systems requiring a Field Programmable Gate Array (FPGA).

Product Features and Performance

Embedded FPGA optimized for low power applications

High density with 43661 logic cells

Total RAM bits of 2138112

Support for 358 input/output ports

Engineered for advanced DSP applications

Product Advantages

High logic-to-pin ratio

Improved system performance due to low-power operation

Wide range of input and output support

Key Technical Parameters

Number of LABs/CLBs: 3411

Number of Logic Elements/Cells: 43661

Total RAM Bits: 2138112

Number of I/O: 358

Voltage Supply: 1.14V ~ 1.26V

Operating Temperature Range: 0°C ~ 85°C (TJ)

Quality and Safety Features

Rugged 676-BGA package ensuring durable and reliable operation

Manufactured under stringent standards for quality assurance

Compatibility

Compatible with multiple design software and programming environments for FPGA

Application Areas

Telecommunication

Industrial control

Automotive systems

Consumer electronics

Product Lifecycle

Currently active

Long-term availability is ensured, and potential future upgrades or replacements are anticipated

Several Key Reasons to Choose This Product

High number of configurable logic cells enable complex designs

Extensive I/O support eases system expansion and integration

Low voltage operations reduce power consumption, enhancing system efficiency

Suitable for high-temperature environments ranging up to 85°C, ensuring reliability in varying conditions

Broad application scope due to versatile feature set and compatibility

Frequently Asked Questions(FAQ)

What are the key differences between the XC6SLX45-2FGG676C and similar FPGA devices in terms of logic capacity and power characteristics for industrial control applications?: The XC6SLX45-2FGG676C offers 43,661 logic elements and 3,411 LABs within a Spartan®-6 LX series architecture, providing sufficient granularity for complex state machines and parallel processing tasks. Compared to entry-level FPGAs, this device delivers approximately 2.8x more logic resources than smaller variants like the XC6SLX9, making it suitable for multi-axis motion control or sensor fusion algorithms. However, its 1.14V–1.26V core voltage range requires careful power supply design to maintain efficiency—especially important when operating across the full -40°C to +85°C commercial temperature range.

How does the XC6SLX45-2FGG676C handle timing closure challenges in designs requiring high-speed data acquisition at 10 MSPS?: The XC6SLX45-2FGG676C supports internal clock frequencies up to approximately 400 MHz using built-in PLLs, which enables efficient sampling rates around 10 MSPS with proper pipeline staging. Its 2.14 Mbit block RAM (distributed as 2,138,112 total bits) allows for FIFO buffering without external memory overhead. However, achieving reliable timing at these speeds demands careful placement of critical paths near dedicated routing resources and adherence to Xilinx’s recommended I/O delay models for LVCMOS interfaces.

Can the XC6SLX45-2FGG676C be safely used in automotive environments, and what modifications might be necessary?: While the XC6SLX45-2FGG676C is rated for 0°C to +85°C junction temperature, automotive systems often require extended temperature operation (-40°C to +125°C) and enhanced reliability. This device lacks built-in ECC protection on configuration memory, so designs must implement external watchdog logic or use soft error mitigation techniques if deployed beyond industrial grade. For true automotive compliance, additional qualification steps such as AEC-Q100 testing would be required beyond standard datasheet specifications.

What are the implications of selecting the XC6SLX45-2FGG676C versus an ASIC alternative for low-volume production runs?: The XC6SLX45-2FGG676C provides rapid prototyping capability with pre-verified IP cores and no mask costs, reducing time-to-market by several months compared to ASIC development. At volumes below 10,000 units, FPGA NRE is amortized quickly, especially given its 676-pin FBGA footprint which simplifies PCB layout. However, power consumption may exceed 1 W under full utilization—unacceptable in battery-powered designs—whereas custom silicon could reduce dynamic power by over 60% through optimized logic synthesis.

How should termination strategies be approached when connecting the 358 I/O pins of the XC6SLX45-2FGG676C to DDR2 memory interfaces?: For DDR2 signaling at 1.8 V swing levels, series termination resistors (~22 Ω) placed close to driver endpoints minimize reflections on unterminated traces. The XC6SLX45-2FGG676C includes programmable drive strengths and slew rate control via IOB settings, allowing fine-tuning of signal integrity. Additionally, its global clock network supports ±50 ppm jitter performance, critical for meeting DDR2 setup/hold margins at speeds exceeding 400 MT/s. Careful layer stackup planning is essential due to the 27×27 mm package size and dense BGA ball pitch.

Is it feasible to cascade multiple XC6SLX45-2FGG676C devices for higher logic density, and what bottlenecks should be anticipated?: Direct cascading of multiple XC6SLX45-2FGG676C devices introduces significant challenges: limited dedicated inter-chip communication channels, increased latency from routing through shared interconnect, and potential skew issues in clock distribution. Moreover, each additional device adds ~50 mW of static power even at idle states due to configuration flash memory retention circuits. Instead, designers typically partition functionality across fewer larger FPGAs or migrate to newer families like Kintex or Artix when exceeding 50k logic cells per function block.

What impact does the Moisture Sensitivity Level 3 (MSL 3) rating have on handling and storage of XC6SLX45-2FGG676C components?: As an MSL 3 component with a 168-hour floor life, the XC6SLX45-2FGG676C must remain in sealed moisture barrier bags until board assembly. After opening, it can only tolerate 168 hours at <60% relative humidity before requiring baking at 125°C for 24 hours to prevent popcorning during reflow soldering. These constraints necessitate strict inventory turnover practices and real-time tracking of exposure duration, particularly in high-volume manufacturing lines where lead times exceed two weeks.

How does the XC6SLX45-2FGG676C compare to CPLDs in terms of reconfigurability and non-volatile storage requirements?: Unlike CPLDs that use flash-based configuration with instant-on capabilities, the XC6SLX45-2FGG676C relies on SRAM-based configuration requiring an external PROM such as a Platform Flash XL. This means system boot-up takes milliseconds longer and consumes extra current during startup—critical drawbacks in always-on applications. However, SRAM enables partial reconfiguration and bitstream updates over JTAG, offering greater flexibility absent in traditional CPLD architectures unless supplemented with external firmware storage.

What considerations apply when integrating the XC6SLX45-2FGG676C into a safety-critical system requiring ISO 26262 compliance?: The XC6SLX45-2FGG676C itself is not inherently certified for functional safety; however, its hardened configuration logic blocks and support for triple modular redundancy (TMR) enable developers to implement fault-tolerant architectures. External mechanisms such as periodic configuration scrubbing, error-correcting code (ECC) on user logic, and runtime self-test sequences must be added manually to meet ASIL-D requirements. Documentation must include failure mode analysis showing coverage of single-event upsets induced by cosmic radiation, especially relevant for avionics applications.

How does the 2.14 Mbit block RAM in the XC6SLX45-2FGG676C influence design choices for image processing pipelines?: The distributed and block RAM resources totaling 2,138,112 bits allow efficient implementation of line buffers and coefficient storage in vision algorithms like Sobel edge detection or FFT windowing. For example, capturing VGA resolution (640×480) at 30 fps requires ~921 KB of frame buffer—far exceeding available on-chip memory—so external DDR controllers become mandatory. Nevertheless, intermediate pixel processing stages benefit significantly from embedded memory, reducing off-chip bandwidth demands and improving throughput predictability.

What are the trade-offs involved in choosing the XC6SLX45-2FGG676C over a mid-range FPGA like the Artix-7 for cost-sensitive embedded systems?: The XC6SLX45-2FGG676C typically commands a premium due to legacy status and lack of advanced features like GTP transceivers or hardened DSP slices found in Artix-7. Yet, it remains viable where analog mixed-signal integration isn't required and legacy toolchain familiarity exists. Its 1.2 V core voltage aligns better with older process nodes, potentially easing interfacing with legacy sensors or microcontrollers lacking 3.3 V tolerance. Ultimately, total system cost depends more on peripheral selection than die size alone.

Are there known limitations in using the XC6SLX45-2FGG676C for PCIe endpoint implementations compared to modern FPGAs?: The XC6SLX45-2FGG676C lacks native PCIe hard IP blocks, forcing software emulation of protocol layers using soft logic. This approach consumes excessive logic resources—often >70% of available CLBs—and yields poor performance (<100 MB/s effective throughput) unsuitable for high-bandwidth applications. Modern alternatives like Kintex UltraScale+ integrate hardened PCIe Gen3/Gen4 cores enabling full x4 lane operation at 8 GT/s, making them preferable unless legacy compatibility outweighs raw speed requirements.

How does the XC6SLX45-2FGG676C perform under accelerated aging tests simulating ten years of continuous operation?: Based on Xilinx field data, the XC6SLX45-2FGG676C exhibits minimal degradation after 10-year equivalent stress conditions involving elevated temperature and voltage. Static power increases by less than 5%, and timing margins remain within specification due to negative bias temperature instability (NBTI) resilience in 65 nm CMOS technology. Nevertheless, users should still incorporate margining strategies in timing budgets to accommodate long-term drift, particularly in aerospace or medical equipment requiring decades of operational life.

What precautions are necessary when routing power rails feeding the core logic of the XC6SLX45-2FGG676C in compact PCBs?: The 1.14 V to 1.26 V core supply demands ultra-low noise delivery (<20 mVpp ripple) to avoid metastability in flip-flops. Use dedicated power planes with decoupling capacitors every 100 mil along the rail, including 10 µF bulk capacitance and 0.1 µF ceramic caps near VCCINT pins. Given the 676-ball grid array layout, via stitching around power pins reduces inductance spikes during switching transients common in high-fanout nets like reset or clock enables.

Can the XC6SLX45-2FGG676C support dynamic partial reconfiguration while maintaining real-time performance?: Yes, the XC6SLX45-2FGG676C supports partial reconfiguration via ICAP_PRIMITIVE, enabling selective update of specific regions without halting global clock networks. However, reconfiguration latency ranges from 1 ms to 10 ms depending on bitstream size, which may violate hard real-time deadlines in safety-critical loops. Designers must isolate reconfigurable modules and schedule updates during safe idle periods, often requiring external state machines to manage context switching overhead.

What role does the ECCN classification 3A991D play in international shipping of XC6SLX45-2FGG676C devices?: ECCN 3A991D indicates the XC6SLX45-2FGG676C is subject to export controls under U.S. regulations due to its use in telecommunications and information security systems. Shipments outside the Wassenaar Arrangement member countries require formal license exceptions or government approvals, especially when destined for entities on denied party lists. Importers should verify local regulations, as some jurisdictions impose additional restrictions regardless of export classification.

How does the HTSUS code 8542.39.0001 affect customs valuation and tariff calculations for XC6SLX45-2FGG676C imports?: HTSUS 8542.39.0001 classifies the XC6SLX45-2FGG676C as "Electronic integrated circuits: processors and controllers," applying a base duty rate of 2.5% ad valorem in most cases. Accurate classification avoids underpayment penalties and ensures compliance with anti-dumping measures targeting certain Asian-manufactured semiconductors. Exporters must provide detailed technical descriptions matching the 676-FBGA package and FPGA functionality to support correct tariff treatment during clearance.

What strategies mitigate single-event latchup (SEL) risks when deploying XC6SLX45-2FGG676C in satellite or avionics applications?: SEL susceptibility arises from parasitic thyristor structures in standard CMOS processes. Mitigation involves limiting total ionizing dose (TID) through shielding, selecting parts with guard rings and substrate contacts, and implementing current-limiting resistors (>10 Ω) on all VCC pins. Operational voltage should stay below 1.2 V to reduce triggering probability. Additionally, periodic power cycling disrupts latchup pathways, though this conflicts with mission continuity—hence why space-qualified versions of similar devices exist with radiation-hardened layouts.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC6SLX45-2FGG676C

Product Attribute
Part Number	XC6SLX45-2FGG676I	XC6SLX45-2FG676C	XC6SLX45-3FG676C	XC6SLX45-2FG676I
Manufacturer	AMD	Xilinx	Xilinx	AMD
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Total RAM Bits	-	-	-	-
Series	-	-	-	-
Number of Logic Elements/Cells	-	-	-	-
Number of I/O	-	-	-	-
Voltage - Supply	-	-	-	-
Number of LABs/CLBs	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad

XC6SLX45-2FGG676C Datasheet PDF

Download XC6SLX45-2FGG676C pdf datasheets and AMD documentation for XC6SLX45-2FGG676C - AMD.

Environmental Information: Xilinx REACH211 Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

ECUb***h

Sep 22, 2026

Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
RS48***ieldTech

Sep 16, 2026

Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
Logi***b_Chris

Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
Circ***FixerTom

Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
Andr***PCBLab

Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
Leat***O'Keefe

Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
Indu***ialPower

Aug 17, 2026

Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.
Nikh***ech

Aug 13, 2026

Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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America	United States	5
America	Brazil	7
Europe	Germany	5
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	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

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1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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