Please refer to the English Version as our Official Version.

Europe: France~~(Français)~~ Germany~~(Deutsch)~~ Italy~~(Italia)~~ Russian~~(русский)~~ Poland~~(polski)~~ Czech~~(Čeština)~~ Luxembourg~~(Lëtzebuergesch)~~ Netherlands~~(Nederland)~~ Iceland~~(íslenska)~~ Hungarian~~(Magyarország)~~ Spain~~(español)~~ Portugal~~(Português)~~ Turkey~~(Türk dili)~~ Bulgaria~~(Български език)~~ Ukraine~~(Україна)~~ Greece~~(Ελλάδα)~~ Israel~~(עִבְרִית)~~ Sweden~~(Svenska)~~ Finland~~(Svenska)~~ Finland~~(Suomi)~~ Romania~~(românesc)~~ Moldova~~(românesc)~~ Slovakia~~(Slovenská)~~ Denmark~~(Dansk)~~ Slovenia~~(Slovenija)~~ Slovenia~~(Hrvatska)~~ Croatia~~(Hrvatska)~~ Serbia~~(Hrvatska)~~ Montenegro~~(Hrvatska)~~ Bosnia and Herzegovina~~(Hrvatska)~~ Lithuania~~(lietuvių)~~ Spain~~(Português)~~ Switzerland~~(Deutsch)~~ United Kingdom~~(English)~~

Asia/Pacific: Japan~~(日本語)~~ Korea~~(한국의)~~ Thailand~~(ภาษาไทย)~~ Malaysia~~(Melayu)~~ Singapore~~(Melayu)~~ Vietnam~~(Tiếng Việt)~~ Philippines~~(Pilipino)~~

Africa, India and Middle East: United Arab Emirates~~(العربية)~~ Iran~~(فارسی)~~ Tajikistan~~(فارسی)~~ India~~(हिंदी)~~ Madagascar~~(malaɡasʲ)~~

South America / Oceania: New Zealand~~(Maori)~~ Brazil~~(Português)~~ Angola~~(Português)~~ Mozambique~~(Português)~~

North America: United States~~(English)~~ Canada~~(English)~~ Haiti~~(Ayiti)~~ Mexico~~(español)~~

Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~XC6VLX240T-3FF1759C~~

Image may be representation.
See specifications for product details.

~~Favorite~~

EXPRESS OPTION

Payment method

XC6VLX240T-3FF1759C - AMD

Manufacturer Part Number: XC6VLX240T-3FF1759C

Manufacturer: AMD Xilinx

Allelco Part Number: 98D-XC6VLX240T-3FF1759C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 43,698 pcs available, New & Original

Parts Description: IC FPGA 720 I/O 1759FCBGA

Package: 1759-FCBGA (42.5x42.5)

Data sheet: XC6VLX240T-3FF1.pdf

PCN Design/Specification
Cross-Ship Lead-Free Notice 31/Oct/2016.pdf Mult Dev Material Chg 16/Dec/2019.pdf

Environmental Information
Xilinx REACH211 Cert.pdf

RoHs Status

~~Compare~~

Our certification

In stock: 43698

Unit Price: $6,771.15
Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity	Unit Price	Ext. Price
1+	$6,771.15	$6,771.15

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

XC6VLX240T-3FF1759C Tech Specifications
AMD - XC6VLX240T-3FF1759C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC6VLX240T-3FF1759C

Product Attribute	Attribute Value
Manufacturer	AMD Xilinx
Voltage - Supply	0.95V ~ 1.05V
Total RAM Bits	15335424
Supplier Device Package	1759-FCBGA (42.5x42.5)
Series	Virtex®-6 LXT
Package / Case	1759-BBGA, FCBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	241152
Number of LABs/CLBs	18840
Number of I/O	720
Mounting Type	Surface Mount
Base Product Number	XC6VLX240

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	4 (72 Hours)
REACH Status	REACH Unaffected
ECCN	3A001A7A
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the XC6VLX240T-3FF1759C compare to other Virtex-6 FPGAs in terms of logic density and power efficiency for high-performance embedded systems?: The XC6VLX240T-3FF1759C offers 241,152 logic elements and 18,840 LABs within a single-chip configuration, positioning it as one of the higher-density devices in the Virtex-6 LXT family. When compared to mid-range variants like the XC6VLX75T or XC6VLX130T, this device provides approximately 2–2.5× more programmable resources, making it suitable for complex digital signal processing or large-state machine implementations. However, its core operating voltage range of 0.95V to 1.05V necessitates careful power delivery design due to sensitivity to supply variations. While it delivers superior logic capacity, engineers should evaluate thermal and power budget constraints early in system planning, as the 1759-pin FCBGA package increases parasitic capacitance and routing complexity at this scale.

What are the implications of using the XC6VLX240T-3FF1759C in a high-reliability industrial application where long-term stability and environmental resilience are critical?: Although the XC6VLX240T-3FF1759C operates over an industrial temperature range of 0°C to 85°C (TJ), its RoHS non-compliant status raises concerns about lead content and outgassing under prolonged thermal stress. In applications requiring strict compliance with international safety standards—such as automotive or medical systems—this limitation may necessitate additional screening or qualification steps. Furthermore, while the FPGA itself is not inherently unreliable, the use of a high-pin-count FCBGA like the 1759-FCBGA demands rigorous PCB layout practices to avoid solder joint fatigue or interposer cracking during thermal cycling. Designers must also consider that higher logic utilization on such a dense device can accelerate aging effects, particularly if dynamic power consumption exceeds 15W under typical configurations.

Can the XC6VLX240T-3FF1759C be effectively used in a multi-FPGA system architecture, and what interface considerations should be addressed?: Yes, the XC6VLX240T-3FF1759C supports high-speed transceivers and gigabit Ethernet interfaces, enabling it to serve as a central processing node in distributed FPGA clusters. With up to 64 GTX transceiver lanes available depending on pinout, it can implement point-to-point or mesh topologies for parallel computation. However, routing these high-speed signals across multiple boards introduces challenges such as skew control, return loss management, and synchronization overhead. Careful attention to reference clock distribution and protocol selection (e.g., PCIe Gen2 vs. Aurora) is essential to maintain data integrity. Additionally, the large number of I/O pins (720 total) allows flexible partitioning, but signal integrity analysis becomes non-negotiable above 3 Gbps per lane.

What trade-offs arise when selecting the XC6VLX240T-3FF1759C versus a smaller FPGA for a power-constrained embedded application?: Choosing the XC6VLX240T-3FF1759C typically results in higher static and dynamic power consumption due to increased transistor count and switching activity. For instance, even at 1.0V core voltage, idle power can reach several watts, which may exceed thermal limits in compact enclosures. Compared to lower-end models like the XC6VLX30, this FPGA trades off energy efficiency for computational throughput, making it better suited for compute-heavy tasks rather than low-power control loops. Engineers must weigh this against the risk of undersizing the FPGA, which could lead to redesign delays. In battery-powered or thermally restricted environments, partial reconfiguration or clock gating strategies become necessary to mitigate unnecessary dissipation.

How does the XC6VLX240T-3FF1759C handle timing closure in designs involving large memory blocks and DSP slices?: The device includes 153,354,24 bits of block RAM and numerous hardened DSP48E slices optimized for arithmetic operations. This architecture enables efficient implementation of wide-word FIR filters or matrix multipliers without external SRAM. However, achieving tight timing closure requires careful floorplanning: block RAMs should be placed near DSP units to minimize interconnect delay, and global clock buffers must drive skewed domains with precision. Given the 3 ns speed grade (XC6VLX240T-3), even modest routing congestion can cause setup violations in deep pipelines. Static timing analysis tools must account for worst-case process-voltage-temperature (PVT) corners, and designers often reserve 10–15% slack for iterative refinement.

Is the XC6VLX240T-3FF1759C compatible with modern FPGA toolchains, and what migration considerations exist from older Virtex generations?: The XC6VLX240T-3FF1759C is fully supported by AMD/Xilinx Vivado Design Suite, including synthesis, place-and-route, and bitstream generation. However, legacy projects migrated from Virtex-5 may require updates to constraint files and IP core versions due to differences in I/O banking and transceiver calibration logic. Notably, the 1759-pin package uses advanced flip-chip technology, so legacy footprint libraries might need revision. Additionally, the shift from 1.2V to 1.0V core voltage affects I/O standard compatibility; LVCMOS18 and LVDS25 are common choices, but termination schemes must align with the selected bank voltages.

What precautions should be taken when handling the XC6VLX240T-3FF1759C due to its Moisture Sensitivity Level (MSL) rating?: With an MSL of 4 (72 hours), the XC6VLX240T-3FF1759C must remain stored in dry conditions prior to reflow soldering. Once removed from sealed packaging, it has a maximum exposure window of three days at ≤30°C/60% RH. After this period, baking at 125°C for 24 hours is required before assembly. Failure to follow this guideline risks popcorning during thermal stress, potentially damaging the fine-pitch BGA joints. Assembly facilities should maintain real-time humidity logging and track lot-specific bake schedules to ensure reliability compliance.

How does the XC6VLX240T-3FF1759C perform in radiation-hardened or space-based applications despite lacking official qualification?: While the XC6VLX240T-3FF1759C is not certified for aerospace use, some commercial-off-the-shelf (COTS) variants are used in low-earth orbit missions with mitigation techniques such as triple modular redundancy (TMR) and scrubbing. Single-event upsets (SEUs) can still occur in sensitive configuration memory cells, requiring periodic reloads from external flash. The lack of built-in SEU protection means designers must implement software-level error detection and recovery, increasing development time. For mission-critical payloads, radiation-tested alternatives from vendors like Microchip’s RTG4 or Microsemi’s PolarFire should be considered instead.

What role does the XC6VLX240T-3FF1759C play in accelerating software-defined networking (SDN) infrastructure?: The XC6VLX240T-3FF1759C is well-suited for SDN acceleration due to its massive parallelism and integrated transceivers. It can host custom pipeline stages for packet classification, flow table lookups, and metering—tasks traditionally handled by CPUs or ASICs. Its high internal bandwidth (via crossbar switches and block RAM) allows sub-microsecond latency decisions, crucial for real-time forwarding. However, programming such pipelines demands expertise in P4 or NetFPGA frameworks, and resource partitioning between control and data planes must be carefully balanced to avoid headroom loss during peak traffic.

How do supply chain factors influence the adoption of the XC6VLX240T-3FF1759C in long-lifecycle products?: The XC6VLX240T-3FF1759C, part of the Virtex-6 generation, faces potential end-of-life risks due to AMD’s strategic focus on newer families like Versal or UltraScale+. Suppliers may discontinue allocations, and second-source availability is limited. For systems expected to operate beyond 10 years, engineers should assess alternative architectures or plan for FPGA migration paths. Additionally, its REACH unaffected status simplifies chemical compliance, but RoHS non-compliance complicates procurement in EU-regulated markets, possibly requiring exemption documentation for leaded solder compatibility.

What design techniques optimize power consumption in the XC6VLX240T-3FF1759C without sacrificing performance?: Dynamic power reduction in the XC6VLX240T-3FF1759C can be achieved through selective clock gating, where unused logic blocks are disabled via enable signals routed to BUFGCE primitives. Voltage scaling is constrained by the tight 0.95–1.05V window, but brown-out detection circuits can trigger safe shutdowns if supplies dip below threshold. Partial reconfiguration allows loading only required functionality into active regions, reducing leakage in idle areas. Thermal-aware placement further helps by clustering high-activity modules together to improve heat spreading. These methods collectively help contain total power below 20W in many operational modes.

Can the XC6VLX240T-3FF1759C support DDR3 memory interfaces natively, and what performance expectations should designers set?: Yes, the XC6VLX240T-3FF1759C includes integrated Memory Controller Blocks (MCBs) supporting DDR3 up to 400 MHz (800 MT/s). These controllers map directly onto regional I/O banks, minimizing latency compared to soft-IP solutions. However, achieving full bandwidth requires careful timing calibration and adherence to JEDEC specifications for DQS alignment and ODT settings. Latency typically ranges from 15–20 ns depending on burst length and page policy. For optimal performance, designers should allocate sufficient block RAM as cache and avoid frequent small transfers that amplify command overhead.

How does the XC6VLX240T-3FF1759C compare to ASICs in terms of time-to-market and cost-effectiveness for medium-volume production?: The XC6VLX240T-3FF1759C offers significantly faster prototyping and shorter iteration cycles than ASIC development, which involves months of tape-out and fabrication. At volumes under 10,000 units, FPGA NRE costs dominate, but per-unit costs remain competitive due to no mask sets. However, unit pricing scales unfavorably above 5,000 pieces compared to custom silicon, especially for simple control logic. Thus, it excels in R&D, pre-production validation, or niche applications where flexibility outweighs unit economics.

What debugging challenges are unique to the XC6VLX240T-3FF1759C in large-scale designs?: Debugging the XC6VLX240T-3FF1759C becomes complex due to its size: visibility into internal signals requires extensive insertion of ILA cores, consuming precious logic and triggering routing congestion. Signal naming conflicts increase with hierarchical depth, and real-time trace buffers may overflow during infrequent error events. Effective strategies include modular verification, boundary scan testing, and leveraging ChipScope Pro’s advanced triggers. Post-implementation simulation remains impractical, so formal equivalence checking and linting are recommended early in the flow.

Does the XC6VLX240T-3FF1759C support partial reconfiguration, and how does it affect system reliability?: Yes, the XC6VLX240T-3FF1759C supports partial reconfiguration (PR) using ICAP or PCAP interfaces, allowing dynamic swapping of functional blocks without resetting the entire device. This feature enhances system availability in telecom or avionics roles. However, PR introduces risks such as configuration corruption during write cycles or timing mismatches between static and reconfigurable regions. Robust state machines and CRC checks are essential to validate successful transitions, and power sequencing must prevent glitches that could latch unintended states.

What are the key considerations when integrating the XC6VLX240T-3FF1759C with external processors like ARM Cortex-A9 or PowerPC?: The XC6VLX240T-3FF1759C often connects to embedded processors via AXI4 or OPB buses, enabling tight co-processing of control and data paths. Processor-local memory controllers map to FPGA fabric for shared access, but arbitration logic must prevent contention during concurrent reads/writes. Clock domain crossing (CDC) protocols are mandatory for asynchronous handshakes, and FIFO depths should accommodate worst-case latency spikes. Additionally, boot code must initialize both processor and FPGA configuration memory correctly, usually from an external SPI flash.

How does thermal management impact the performance stability of the XC6VLX240T-3FF1759C in continuous operation?: Sustained operation near 85°C (TJ max) reduces mean time between failures (MTBF) and increases leakage current, indirectly raising dynamic power. Without adequate heatsinking, junction temperatures may exceed safe thresholds during heavy DSP loads, causing thermal throttling or erratic behavior. Designers should model power dissipation under worst-case workloads and incorporate airflow or conduction paths to keep TJ < 70°C. Monitoring thermal sensors embedded in select tiles provides runtime feedback for adaptive frequency scaling if supported by the design.

Why might a designer choose the XC6VLX240T-3FF1759C over newer FPGA families despite obsolescence concerns?: Legacy systems with established tool flows, IP cores, and certification records may justify continued use of the XC6VLX240T-3FF1759C. If existing designs already leverage its DSP48E architecture or specific I/O features unavailable elsewhere, migration would incur significant rework. Moreover, certain analog peripherals or board footprints tied to earlier packages resist easy replacement. In such cases, lifecycle extension plans—including inventory buffering and firmware portability studies—can sustain operations until a controlled transition occurs.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC6VLX240T-3FF1759C

Product Attribute
Part Number	XC6VLX240T-L1FF1759C	XC6VLX240T-2FFG1759C	XC6VLX240T-2FFG1759I	XC6VLX240T-3FFG1156C
Manufacturer	Xilinx Inc.	AMD	AMD	AMD
Voltage - Supply	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of Logic Elements/Cells	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Number of LABs/CLBs	-	-	-	-
Series	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Number of I/O	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Total RAM Bits	-	-	-	-

XC6VLX240T-3FF1759C Datasheet PDF

Download XC6VLX240T-3FF1759C pdf datasheets and AMD documentation for XC6VLX240T-3FF1759C - AMD.

PCN Design/Specification: Cross-Ship Lead-Free Notice 31/Oct/2016.pdf Mult Dev Material Chg 16/Dec/2019.pdf
Environmental Information: Xilinx REACH211 Cert.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

ECUb***h

Sep 22, 2026

Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
RS48***ieldTech

Sep 16, 2026

Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
Logi***b_Chris

Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
Circ***FixerTom

Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
Andr***PCBLab

Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
Leat***O'Keefe

Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
Indu***ialPower

Aug 17, 2026

Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.
Nikh***ech

Aug 13, 2026

Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

Use your express account for shipment if you have one.
Use our account for the shipment. Refer to the table below for the approximate charges.

(Different time frame / countries / package size has different price.)

Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
Payment Support
Packaging
Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.

Strict quality inspection builds a solid foundation for electronic component quality.

Visual inspection
Performance testing and reliability verification
Standardized full-process testing
Precise control of every parameter

We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Quality Inspection

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner

Efficient Supply Management
Cost-Saving Procurement
Fast Sourcing & Delivery

Contact us if you have any questions.

Phone: +00852 9146 4856
Email: info@allelco.com

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification

ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
GB/T 27922-2011

SMTA
IPC
ESD
PSMA