XCV1000E-7BG560I - AMD

Manufacturer Part Number

XCV1000E-7BG560I

Manufacturer

xilinx

Introduction

The XCV1000E-7BG560I is part of the Virtex®-E series, an Embedded FPGA designed for high-performance applications requiring a substantial number of logic gates and I/O options.

Product Features and Performance

High number of logic elements/cells: 27648

Large number of LABs/CLBs: 6144

Extensive RAM capacity: 393216 total RAM bits

Ample I/O options: 404

High gate count: 1569178 gates

Operational voltage range of 1.71V to 1.89V

Built for surface mount technology

Extended operating temperature range: -40°C to 100°C (TJ)

Encased in a 560-LBGA Exposed Pad, Metal package

Product Advantages

Suitable for complex digital logic operations given its large number of gates

Provides extensive interfacing capabilities with 404 I/O

Supports robust data handling and processing with significant internal RAM

Durable and reliable operation in extreme temperature environments

Key Technical Parameters

Logic Elements/Cells: 27648

LABs/CLBs: 6144

RAM Bits: 393216

I/O Count: 404

Gate Count: 1569178

Voltage Supply: 1.71V ~ 1.89V

Operating Temperature: -40°C ~ 100°C (TJ)

Quality and Safety Features

Rigorous quality assurance for temperature and voltage operation ranges

Implemented in a secure, exposed pad metal package to enhance thermal dissipation

Compatibility

Designed for integration with systems requiring high gate and I/O demands

Compatible with various digital and mixed-signal components due to flexible I/O and voltage specifications

Application Areas

Advanced digital signal processing

Complex programmable logic controllers

High-speed network infrastructure equipment

Aerospace and defense electronics requiring high reliability

Product Lifecycle

Status: Obsolete

Currently no direct replacements or upgrades provided by the manufacturer

Several Key Reasons to Choose This Product

Exceptional logic and memory resources suitable for high-complexity algorithims and data-intensive tasks

Ability to operate under a wide range of environmental conditions, ensuring reliability

High I/O availability allows for versatile system designs and expansions

Advanced thermal management offered by the exposed pad metal package design

Backed by the technical and innovative pedigree of Xilinx, a leader in digital configurable technology.