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Home Products Integrated Circuits (ICs)Embedded - System On Chip (SoC)~~XCVC1502-2MLIVSVA2197~~

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XCVC1502-2MLIVSVA2197 - AMD

Manufacturer Part Number: XCVC1502-2MLIVSVA2197

Manufacturer: AMD Xilinx

Allelco Part Number: 98D-XCVC1502-2MLIVSVA2197

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 48,334 pcs available, New & Original

Parts Description: IC VERSAL AI-CORE FPGA 2197BGA

Package: 2197-FCBGA (45x45)

Data sheet: -

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Specifications

XCVC1502-2MLIVSVA2197 Tech Specifications
AMD - XCVC1502-2MLIVSVA2197 technical specifications, attributes, parameters and parts with similar specifications to AMD - XCVC1502-2MLIVSVA2197

Product Attribute	Attribute Value
Manufacturer	AMD Xilinx
Supplier Device Package	2197-FCBGA (45x45)
Speed	600MHz, 1.4GHz
Series	Versal™ AI Core
RAM Size	256KB
Primary Attributes	Versal™ AI Core FPGA, 800k Logic Cells
Peripherals	DDR, DMA, PCIe
Package / Case	2197-BFBGA, FCBGA

Product Attribute	Attribute Value
Package	Tray
Operating Temperature	-40°C ~ 110°C (TJ)
Number of I/O	586
Flash Size	-
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MPU, FPGA

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	4 (72 Hours)

Frequently Asked Questions(FAQ)

What are the key architectural components of the XCVC1502-2MLIVSVA2197 and how do they contribute to system-level performance in embedded applications?: The XCVC1502-2MLIVSVA2197 integrates a dual ARM® Cortex®-A72 MPCore™ processor subsystem alongside a dual ARM® Cortex™-R5F configuration, all unified within a Versal™ AI Core FPGA fabric. This heterogeneous architecture enables concurrent execution of high-throughput compute tasks via the A72 cores while maintaining deterministic real-time control through the R5F processors. The integration allows software-defined flexibility across multiple operational domains without requiring external microcontrollers or separate processing units, effectively reducing board complexity and power consumption in edge AI and industrial automation systems.

How does the 800k logic cell count of the XCVC1502-2MLIVSVA2197 influence resource allocation when implementing both programmable logic and hardened IP blocks simultaneously?: With 800k logic cells available, designers must strategically partition resources between soft logic implementations and hard IP utilization such as PCIe, DDR memory controllers, and DSP slices. For example, deploying four high-speed transceivers at full line rate consumes significant portions of the fabric, leaving fewer cells for custom algorithmic acceleration. Real-world designs often allocate 60–70% of logic capacity to accelerator functions, reserving the remainder for glue logic, state machines, and interface bridging. Oversubscription can lead to timing closure issues or require multi-die partitioning, increasing design risk.

In what scenarios would the XCVC1502-2MLIVSVA2197 be preferred over a traditional FPGA with embedded processors, and what trade-offs does this entail?: The XCVC1502-2MLIVSVA2197 is advantageous in applications demanding tight hardware-software co-design, such as vision-based robotics or adaptive signal processing, where latency-critical algorithms benefit from FPGA reconfigurability alongside ARM processing. Compared to discrete FPGA + MCU solutions, it reduces interconnect delays and simplifies firmware development. However, the shared memory architecture introduces potential contention points during simultaneous access by A72 and R5F clusters, necessitating careful use of DMA engines and memory protection units to maintain data integrity under load.

How should designers approach thermal management given the operating junction temperature range of -40°C to 110°C for the XCVC1502-2MLIVSVA2197?: While the device supports industrial-grade temperatures, sustained operation near 110°C significantly impacts reliability margins due to electromigration effects and reduced carrier mobility in advanced nodes. Designers must ensure adequate airflow or conduction paths to keep die temperature below 85°C under full computational load—especially when combining GPU-like processing on the A72s with FPGA-intensive tasks. Thermal simulation using IBIS models or 3D CFD analysis is recommended to validate PCB stackup and heatsink selection before mass production.

What considerations apply when interfacing the XCVC1502-2MLIVSVA2197 with DDR memory subsystems, particularly regarding bandwidth and signal integrity?: The chip supports DDR4/LPDDR4 interfaces with configurable channel widths, but achieving peak bandwidth requires careful attention to trace length matching, impedance control, and termination schemes. At typical clock speeds exceeding 1600 Mbps per pin, even minor discontinuities can cause bit errors during burst transfers. Additionally, the integrated PHY consumes substantial power proportional to data rate squared, so dynamic frequency scaling should be used judiciously based on workload demands to balance performance and thermal envelope.

Can the XCVC1502-2MLIVSVA2197 support real-time operating systems (RTOS) alongside Linux, and what inter-core communication mechanisms are optimized for this configuration?: Yes, the dual A72 cluster typically runs Linux for application hosting, while the R5F pair executes an RTOS like FreeRTOS or Zephyr for time-sensitive operations. Communication occurs primarily through shared SRAM regions mapped into both core address spaces, augmented by hardware mailboxes and semaphore units managed by the Interconnect Fabric. Latency between R5F and A72 via these channels averages 20–50 cycles depending on cache state, making them suitable for sub-millisecond response requirements common in motor control or sensor fusion pipelines.

How does the Moisture Sensitivity Level (MSL) rating of 4 affect handling procedures during PCB assembly for boards populated with the XCVC1502-2MLIVSVA2197?: As an MSL 4 component with a 72-hour floor life window after dry pack removal, the XCVC1502-2MLIVSVA2197 mandates strict adherence to JEDEC J-STD-033 guidelines. Boards must undergo bake-out if stored beyond 72 hours at ambient conditions, otherwise popcorn cracking risks increase during reflow. Automated optical inspection (AOI) post-reflow helps detect such defects early, but proactive storage in climate-controlled environments remains essential, especially in high-volume manufacturing where batch tracking becomes critical.

What role does the 586 I/O pins play in enabling system connectivity, and which protocols benefit most from their distribution across the 2197-pin FCBGA package?: The 586 general-purpose I/Os provide extensive routing flexibility for parallel buses (EBI/EMI), serial interfaces (SPI, UART), and high-speed transceivers (PCIe Gen3/4). Their placement follows a quadrant-based scheme that minimizes cross-talk between differential pairs while supporting up to six PCIe lanes or four 10GbE links concurrently. However, simultaneous use of maximum-speed interfaces may exhaust available SERDES resources, forcing designers to prioritize based on application needs—for instance, choosing Gigabit Ethernet over USB 3.0 in space-constrained industrial gateways.

How does the absence of onboard flash impact boot sequence design when using the XCVC1502-2MLIVSVA2197 as a primary controller?: Since the XCVC1502-2MLIVSVA2197 lacks internal flash memory, external non-volatile storage (e.g., eMMC, SPI NOR) is mandatory for storing boot code and application firmware. This adds cost and complexity compared to self-booting SoCs but enables firmware updates and larger program sizes. BootROM relies exclusively on quad-SPI or SDIO interfaces, so signal integrity on those traces is paramount; failure here results in unbootable systems even with correct software.

What are the implications of the 600MHz and 1.4GHz speed grades on power consumption and performance headroom when selecting variants of the XCVC1502-2MLIVSVA2197?: The lower-speed variant (600MHz) trades peak throughput for reduced dynamic power, making it ideal for battery-powered or thermally constrained applications. Conversely, the 1.4GHz grade maximizes computational density but increases leakage current and thermal output by 30–40%. Designers should profile worst-case workloads to avoid over-provisioning clock speed, which wastes energy without proportional benefit. Adaptive voltage-frequency scaling (DVFS) implemented via PMICs tied to the PMBus interface offers a middle ground by dynamically adjusting supply rails according to load.

How does the integration of CoreSight debug infrastructure simplify validation workflows involving the XCVC1502-2MLIVSVA2197?: CoreSight provides coherent visibility into both ARM and FPGA domains through standardized ETM/PTM tracing and embedded ICE functionality. Engineers can correlate software execution paths with hardware events like DMA completions or interrupt latencies without invasive instrumentation, accelerating bring-up phases. This is particularly valuable when debugging complex interactions between the A72’s virtual memory system and FPGA-accessed peripherals over shared AMBA buses.

What precautions should be taken when designing power delivery networks (PDN) for the XCVC1502-2MLIVSVA2197 to prevent voltage droop during FPGA reconfiguration?: Reconfiguration events trigger brief but large current surges due to block-by-block loading of configuration frames. PDN impedance must remain below 5mΩ above 100kHz across the core voltage rails to suppress droop below 50mV thresholds required for stable operation. Distributed decoupling using 0201 MLCCs placed within 1mm of each power pin, combined with bulk capacitors rated for ≥10A ripple current, forms an effective defense against transient collapse during partial reconfiguration bursts.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCVC1502-2MLIVSVA2197

Product Attribute
Part Number	XCVC1502-2MLEVSVA2197	XCVC1502-2MSIVSVA2197	XCVC1502-2LLEVSVA2197	XCVC1502-2MLIVSVA1596
Manufacturer	AMD	AMD	AMD	AMD
Architecture	-	Current Source	R-2R	Pipelined
Speed	-	-	-	-
Connectivity	-	-	-	-
Primary Attributes	-	-	-	-
Number of I/O	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
RAM Size	-	-	-	-
Series	-	-	-	-
Flash Size	-	-	-	-
Core Processor	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Peripherals	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C

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Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
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	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

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Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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