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HomeProductsSensors, TransducersOptical Sensors - Image Sensors, CameraMT9V111IA7ATC-DR
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MT9V111IA7ATC-DR - onsemi

Manufacturer Part Number
MT9V111IA7ATC-DR
Manufacturer
onsemi
Allelco Part Number
32D-MT9V111IA7ATC-DR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
5,200 pcs available, New & Original
Parts Description
SENSOR IMAGE VGA COLOR 44IBGA
Package
52-IBGA (9x9)
Data sheet
MT9V111IA7ATC-D.pdf

Datasheets

MT9V111.pdf

Environmental Information

onsemi RoHS.pdf

PCN Obsolescence/ EOL

Cylindrical Battery Holders.pdf

PCN Assembly/Origin

Update 05/Nov/2020.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 5200
  • Unit Price: $8.86
  • Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $8.86 $8.86
200+ $3.429 $685.80
500+ $3.308 $1,654.00
1000+ $3.249 $3,249.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MT9V111IA7ATC-DR Tech Specifications
onsemi - MT9V111IA7ATC-DR technical specifications, attributes, parameters and parts with similar specifications to onsemi - MT9V111IA7ATC-DR

Product Attribute Attribute Value
Manufacturer onsemi
Voltage - Supply 2.55V ~ 3.05V
Type CMOS with Processor
Supplier Device Package 52-IBGA (9x9)
Series -
Pixel Size 5.6µm x 5.6µm
Product Attribute Attribute Value
Package / Case 52-BGA
Package Tray
Operating Temperature -20°C ~ 60°C
Frames per Second 30
Base Product Number MT9V111
Active Pixel Array 640H x 480V

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.49.9500

Frequently Asked Questions(FAQ)

How does the MT9V111IA7ATC-DR perform in low-light conditions compared to other VGA-resolution CMOS sensors with integrated image processors, and what design considerations should be made when integrating it into a vision system operating under variable ambient lighting?
The MT9V111IA7ATC-DR features a 5.6µm x 5.6µm pixel pitch and operates at up to 30 fps, providing sufficient sensitivity for moderate low-light environments typical in industrial inspection applications. However, due to its fixed pixel size and lack of global shutter capability, dynamic range and noise performance may be limited compared to larger-pixel or specialized low-light sensors. In scenarios requiring extended exposure or high signal-to-noise ratios, external illumination or supplemental lighting should be considered. Its integrated processor reduces external logic load but offers minimal control over analog front-end gain or digital gain boosting, which constrains fine-tuned low-light optimization.
What are the key differences between the MT9V111IA7ATC-DR and similar VGA sensors like the OV5640 or AR0130 in terms of interface flexibility, power consumption, and integration complexity for embedded vision systems?
Unlike the MT9V111IA7ATC-DR, which uses a parallel digital output with limited data bandwidth and no I²C configuration interface, the OV5640 supports MIPI CSI-2 and higher frame rates with programmable settings via I²C, offering greater flexibility for system-level tuning. The AR0130 also provides higher resolution (720p) and better low-light performance with dual conversion gain pixels. Power consumption of the MT9V111IA7ATC-DR ranges from 20–25 mW at 30 fps, which is lower than many modern competitors but comes with reduced configurability. For designs prioritizing simplicity and cost over performance scalability, the MT9V111IA7ATC-DR may offer faster time-to-market despite its narrower feature set.
Can the MT9V111IA7ATC-DR be used in automotive applications, and what limitations must be addressed given its specified operating temperature range and packaging?
The MT9V111IA7ATC-DR is rated for -20°C to 60°C, which falls short of standard automotive AEC-Q100 Grade 2 (up to +85°C) requirements. While it might function in non-critical infotainment or interior sensing roles with thermal management, it is not suitable for primary driver-assistance or safety-related imaging tasks. Additionally, the 52-IBGA package has an MSL4 rating, requiring assembly within 72 hours after exposure—this demands careful handling during PCB manufacturing. Without qualification testing per AEC standards, deploying the MT9V111IA7ATC-DR in production vehicles introduces reliability risks related to thermal cycling and humidity-induced delamination.
What is the impact of the MT9V111IA7ATC-DR’s 52-IBGA (9x9 mm) package on mechanical stress and board-level reliability, especially in vibration-prone environments?
The small form factor of the 52-IBGA package improves space efficiency but concentrates solder joints and thermal mass in a limited area. Under repeated thermal excursions (-20°C to 60°C), differential expansion between the sensor die and PCB can induce shear stress at BGA ball connections. In vibration-intensive applications such as robotics or mobile platforms, this increases the risk of intermittent opens or shorts if the PCB layout lacks adequate standoff or damping. Designers should implement robust land pattern geometry, use low-stress solder alloys, and consider conformal coating to enhance mechanical resilience. Reliability simulations using JEDEC JESD22-B103B drop tests are recommended before deployment.
How does the MT9V111IA7ATC-DR handle rolling shutter artifacts, and what mitigation strategies exist when capturing fast-moving objects in industrial automation contexts?
As a rolling-shutter CMOS sensor, the MT9V111IA7ATC-DR exposes rows sequentially rather than all at once, leading to motion distortion when capturing high-speed objects. For example, a conveyor belt moving at 1 meter per second may exhibit skew or tilt across a 640-pixel-wide image if exposure exceeds ~2 ms. To minimize artifacts, reduce shutter speed through external triggering or internal frame rate adjustment—though the latter may limit usable light levels. Synchronization with object detection triggers and using shorter exposure times are effective workarounds. If absolute motion fidelity is required, consider alternative sensors with global shutter capabilities despite higher cost and complexity.
What are the typical power sequencing and initialization requirements when integrating the MT9V111IA7ATC-DR with an FPGA or microcontroller, and how do these affect system boot-up time?
The MT9V111IA7ATC-DR requires stable VDD (2.55V–3.05V) prior to asserting reset and clock signals. Power-on reset circuitry should ensure VDD reaches 90% of nominal voltage before applying the pixel clock. Initialization typically involves configuring registers via parallel interface within the first few frames; however, this model lacks documented register maps, implying fixed operational parameters. Consequently, system designers must rely on timing diagrams and empirical validation. Total startup latency—from power-up to first valid frame—can exceed 100 ms depending on external logic delays. This makes the MT9V111IA7ATC-DR less ideal for real-time control loops demanding rapid response, though acceptable for periodic monitoring tasks.
Is the MT9V111IA7ATC-DR compatible with 3.3V logic levels, or does interfacing require level shifting given its supply range of 2.55V to 3.05V?
The MT9V111IA7ATC-DR operates within 2.55V to 3.05V, which partially overlaps with standard 3.3V TTL logic thresholds but does not guarantee reliable compatibility. Input high voltage minimum (VIH) for most outputs may not meet 3.3V CMOS high-state requirements without margin. Therefore, bidirectional level shifting or resistive dividers are often needed when connecting directly to 3.3V microcontrollers. Alternatively, selecting a host device that operates at ≤3.0V simplifies integration. Signal integrity should be verified at maximum data rates (~120 Mbps aggregate bandwidth) to avoid setup/hold violations due to impedance mismatches in long traces.
What environmental factors beyond temperature could affect long-term performance of the MT9V111IA7ATC-DR, and how can they be mitigated during PCB assembly and field operation?
Beyond temperature, humidity ingress poses risks due to the MSL4 classification, necessitating dry storage and controlled atmosphere during reflow. Moisture accumulation can cause popcorning during soldering, compromising hermeticity and potentially accelerating corrosion of bond wires. Operating near condensation points (e.g., sudden warm-up in cold climates) may also degrade optical coupling if the lens assembly isn't sealed. Mitigation includes baking parts before use, using moisture barrier bags, avoiding exposed pads in humid environments, and selecting lenses with hydrophobic coatings. Regular visual inspection for discoloration or delamination helps detect early degradation signs in deployed units.

Parts with Similar Specifications

The three parts on the right have similar specifications to onsemi MT9V111IA7ATC-DR

Product Attribute MT9V111IA7ATC-DR1 MT9V111IA7ATC-DP MT9V111IA7ATC-TR MT9V111IA7ATC-TP
Part Number MT9V111IA7ATC-DR1 MT9V111IA7ATC-DP MT9V111IA7ATC-TR MT9V111IA7ATC-TP
Manufacturer onsemi onsemi onsemi onsemi
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Frames per Second - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Pixel Size - - - -
Voltage - Supply - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Type - - - -
Series - - - -
Active Pixel Array - - - -

MT9V111IA7ATC-DR Datasheet PDF

Download MT9V111IA7ATC-DR pdf datasheets and onsemi documentation for MT9V111IA7ATC-DR - onsemi.

Datasheets
MT9V111.pdf
Environmental Information
onsemi RoHS.pdf
PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf
PCN Assembly/Origin
Update 05/Nov/2020.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
MT9V111IA7ATC-DR Image

MT9V111IA7ATC-DR

onsemi
32D-MT9V111IA7ATC-DR

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