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HomeProductsDiscrete Semiconductor ProductsDiodes - Rectifiers - SingleSS14T3G
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SS14T3G - onsemi

Manufacturer Part Number
SS14T3G
Manufacturer
onsemi
Allelco Part Number
32D-SS14T3G
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
4,450 pcs available, New & Original
Parts Description
DIODE SCHOTTKY 40V 1A SMA
Package
SMA
Data sheet
SS14T3G.pdf

Datasheets

SS12,14.pdf

Environmental Information

onsemi REACH.pdf onsemi RoHS.pdf

PCN Obsolescence/ EOL

Multiple Devices 01/Jul/2005.pdf
RoHs Status
 
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In stock: 4450

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Specifications

SS14T3G Tech Specifications
onsemi - SS14T3G technical specifications, attributes, parameters and parts with similar specifications to onsemi - SS14T3G

Product Attribute Attribute Value
Manufacturer onsemi
Voltage - Forward (Vf) (Max) @ If 470 mV @ 1 A
Voltage - DC Reverse (Vr) (Max) 40 V
Technology Schottky
Supplier Device Package SMA
Speed Fast Recovery =< 500ns, > 200mA (Io)
Series -
Package / Case DO-214AC, SMA
Product Attribute Attribute Value
Package Tape & Reel (TR)
Operating Temperature - Junction -55°C ~ 150°C
Mounting Type Surface Mount
Current - Reverse Leakage @ Vr 100 µA @ 40 V
Current - Average Rectified (Io) 1A
Capacitance @ Vr, F -
Base Product Number SS14

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99

Frequently Asked Questions(FAQ)

How does the SS14T3G compare to standard silicon rectifier diodes in terms of forward voltage drop and switching performance for low-power DC-DC converter applications?
The SS14T3G exhibits a maximum forward voltage of 470 mV at 1 A, which is significantly lower than typical silicon rectifiers that often exceed 700 mV under similar conditions. This reduced conduction loss translates to improved efficiency in power conversion stages. Additionally, its Schottky construction enables fast recovery characteristics with a switching time under 500 ns, making it suitable for high-frequency switching environments where reverse recovery losses dominate. These attributes make the SS14T3G preferable over conventional PN-junction diodes in compact, efficient designs such as buck converters operating above 200 kHz.
What are the thermal limitations and junction temperature considerations when using the SS14T3G in continuous conduction mode power supplies?
The SS14T3G operates reliably across a junction temperature range of -55°C to 150°C, allowing deployment in harsh environments without derating beyond manufacturer specifications. However, sustained operation near the upper limit requires careful PCB layout and thermal management due to increased leakage current and potential shifts in Vf over time. For continuous 1 A loads, power dissipation can reach approximately 0.47 W if Vf reaches 470 mV, necessitating adequate copper area or airflow to maintain junction temperatures below 125°C for long-term reliability.
Can the SS14T3G be used interchangeably with B140-E3/5AT in existing circuit designs, and what design adjustments might be necessary?
While both the SS14T3G and B140-E3/5AT are Schottky diodes rated for 40 V and 1 A, differences in package dimensions and lead configurations may require board-level changes. The SS14T3G uses the SMA (DO-214AC) footprint, which has slightly different pad spacing than some variants of the B140 series. Electrical performance is generally comparable, but designers should verify thermal performance under identical load profiles and confirm compatibility with automated assembly processes before substituting components.
What impact does reverse leakage current have on system efficiency in battery-powered devices using the SS14T3G?
At 40 V reverse bias, the SS14T3G exhibits a leakage current of 100 µA—lower than many alternative Schottky diodes—which minimizes quiescent power loss in sleep-mode circuits. In a typical battery backup scenario drawing less than 1 mA average current, this leakage contributes only about 4 µW of wasted power, preserving runtime. However, in ultra-low-power systems with nanoampere-level supply currents, even this level of leakage could represent a non-negligible percentage of total consumption and may warrant evaluation of newer-generation devices with sub-10 µA leakage at Vr = 40 V.
How does capacitance variation affect the SS14T3G’s performance in RF signal path protection circuits?
Although capacitance values are not explicitly specified for the SS14T3G, Schottky diodes like this typically exhibit junction capacitances in the tens of picofarads at zero bias. In high-impedance or sensitive analog front ends, even small capacitance can cause signal attenuation or phase shift, especially above 1 MHz. Designers should assume moderate capacitive loading and include sufficient guard traces or impedance-matching networks if integrating the SS14T3G into precision signal routing paths.
Are there any known reliability concerns related to moisture sensitivity or packaging integrity for the SS14T3G during reflow soldering?
The SS14T3G has an MSL rating of Level 1, indicating it is not moisture-sensitive and can withstand unlimited exposure to ambient humidity prior to reflow. This simplifies handling during manufacturing compared to higher-MSL components. As a surface-mount device in SMA packaging, it conforms to standard JEDEC reflow profiles, including peak temperatures up to 260°C for short durations, ensuring compatibility with most industrial SMT lines without special precautions.
What are the key substitution options for the SS14T3G, and how do they differ in terms of cost, availability, and electrical behavior?
Common substitutes include B240AQ-13-F, B140Q-13-F, and STPS140A, all offering similar ratings but varying in packaging and performance nuances. The B-series parts often come in equivalent SMA packages but may exhibit slightly higher leakage currents or less consistent Vf matching. STPS140A is another candidate, though it typically features slightly higher forward drop (~550 mV). When substituting, engineers should validate thermal performance, leakage under full reverse voltage, and mechanical fit within the target PCB layout to avoid unintended failures or yield issues.
What design trade-offs should be considered when selecting between multiple 40V Schottky diodes for high-temperature automotive applications?
Operating environment plays a critical role; for instance, the SS14T3G maintains stability up to 150°C, aligning well with automotive under-hood requirements. However, other parameters like surge current capability, package robustness, and supplier qualification status must also align with AEC-Q101 standards. While the SS14T3G meets basic criteria, designers must assess whether additional margin in transient tolerance or improved thermal cycling resistance justifies alternative choices despite marginally higher cost.
How does the absence of specified junction capacitance affect high-speed switching circuit analysis involving the SS14T3G?
Lack of explicit capacitance data means designers must either estimate based on similar devices or perform empirical measurement. In boost converters switching faster than 1 MHz, stray parasitics and diode charge storage can distort waveform edges and increase EMI. Assuming a conservative value in the 20–50 pF range allows preliminary simulation, but final validation through prototype testing remains essential to ensure switching integrity and minimize ringing in gate drivers or control loops.

Parts with Similar Specifications

The three parts on the right have similar specifications to onsemi SS14T3G

Product Attribute SS14T3 SS14MHRSG SS14_R1_00001 SS14W_R1_00001
Part Number SS14T3 SS14MHRSG SS14_R1_00001 SS14W_R1_00001
Manufacturer onsemi Taiwan Semiconductor Corporation Panjit International Inc. Panjit International Inc.
Voltage - DC Reverse (Vr) (Max) - - - -
Voltage - Forward (Vf) (Max) @ If - - - -
Speed - - - -
Capacitance @ Vr, F - - - -
Operating Temperature - Junction - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Technology - - - -
Current - Average Rectified (Io) - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Current - Reverse Leakage @ Vr - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -

SS14T3G Datasheet PDF

Download SS14T3G pdf datasheets and onsemi documentation for SS14T3G - onsemi.

Datasheets
SS12,14.pdf
Environmental Information
onsemi REACH.pdf onsemi RoHS.pdf
PCN Obsolescence/ EOL
Multiple Devices 01/Jul/2005.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

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Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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SS14T3G Image

SS14T3G

onsemi
32D-SS14T3G

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