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HomeProductsConnectors, InterconnectsBackplane Connectors - Specialized3-1926739-0
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3-1926739-0 - TE Connectivity AMP Connectors

Manufacturer Part Number
3-1926739-0
Manufacturer
TE Connectivity
Allelco Part Number
98D-3-1926739-0
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
45,402 pcs available, New & Original
Parts Description
CONN RCPT 27POS EDGE MNT
Package
Bulk
Data sheet
3-1926739-0.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 45402
  • Unit Price: $9.376
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $9.376 $9.38
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

3-1926739-0 Tech Specifications
TE Connectivity AMP Connectors - 3-1926739-0 technical specifications, attributes, parameters and parts with similar specifications to TE Connectivity AMP Connectors - 3-1926739-0

Product Attribute Attribute Value
Manufacturer TE Connectivity
Voltage Rating -
Termination Press-Fit
Series MINIPAK HDL
Pitch 0.079' (2.00mm)
Package Bulk
Operating Temperature -40°C ~ 125°C
Number of Rows -
Number of Positions Loaded All
Number of Positions 27
Number of Columns -
Mounting Type Board Edge, Through Hole, Right Angle
Product Attribute Attribute Value
Material Flammability Rating UL94 V-0
Features Guide Pin
Current Rating (Amps) -
Contact Layout, Typical 15 Signal, 12 Power
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold or Gold-Palladium
Connector Usage -
Connector Type Receptacle, Female Sockets and Blade Sockets
Connector Style -
Color Black
Base Product Number 1926739

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status Vendor Undefined
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the TE Connectivity AMP 3-1926739-0 and standard 0.1" pitch connectors for backplane applications?
The 3-1926739-0 uses a 0.079" (2.00mm) pitch rather than the common 0.1" pitch, enabling higher density layouts in constrained backplane designs. This tighter spacing reduces board footprint by approximately 20% compared to 0.1" alternatives while maintaining the same 27-position capacity. The MINIPAK HDL series architecture with its edge-mount configuration and right-angle orientation provides efficient use of vertical space on PCB edges, making it suitable for applications where board real estate is limited but signal integrity must remain consistent. The press-fit termination on the 3-1926739-0 also eliminates soldering variables, reducing thermal stress during assembly.
How does the contact layout of 15 signal and 12 power positions in the 3-1926739-0 affect backplane design decisions?
The segregated contact arrangement in the 3-1926739-0—with 15 dedicated signal lines and 12 power connections—allows engineers to optimize signal routing and power distribution independently. The power positions can handle consolidated current paths without cross-talk interference from high-speed signals, a significant advantage in mixed-signal backplanes. This layout minimizes the need for external jumpers or secondary connectors for power distribution, reducing assembly complexity. For designs operating near thermal limits, the 12 dedicated power pins on the 3-1926739-0 enable parallel current paths that lower individual contact resistance and heat dissipation compared to designs forcing power through fewer pins.
What thermal performance considerations apply to the 3-1926739-0 in systems with -40°C to 125°C operating ranges?
The 3-1926739-0 supports the full -40°C to 125°C industrial operating window, but thermal expansion of the press-fit contacts becomes a design factor at temperature extremes. Press-fit connections experience micro-motion under thermal cycling; the MINIPAK HDL 2.00mm pitch on the 3-1926739-0 provides adequate compliance in the contact barrel to accommodate typical PCB expansion coefficients without inducing undue stress. At the upper temperature limit (125°C), contact resistance may increase by 10–15% depending on mating cycle history. For applications requiring long service life in thermal extremes, designing with contact force margins and validating mating cycles at temperature boundaries is recommended.
How does the gold-palladium contact finish on the 3-1926739-0 compare to pure gold for long-term reliability?
The 3-1926739-0 specifies gold or gold-palladium contact finish at 30.0µin (0.76µm) thickness. Gold-palladium offers superior hardness and corrosion resistance compared to pure gold, reducing wear during mating cycles and increasing contact durability in industrial environments. The 0.76µm thickness is moderate for backplane applications; it provides adequate protection against fretting corrosion and environmental attack while remaining cost-effective. In humid or chemically aggressive environments, the palladium component of the 3-1926739-0 finish inhibits formation of non-conductive compounds at the contact interface better than pure gold alone, supporting consistent contact resistance over product lifetime.
What press-fit insertion force and retention characteristics should be validated for the 3-1926739-0 in production environments?
The 3-1926739-0 employs press-fit termination, which requires controlled insertion force to establish reliable contact without damaging the PCB pad annulus. Typical press-fit connectors at 2.00mm pitch require insertion forces in the 60–100 lbf range per contact, translating to total forces of 1,600–2,700 lbf for the full 27-position 3-1926739-0. Retention force should be validated at ≥50 lbf per contact to ensure the connector survives mechanical shock and vibration in field deployment. Thermal cycling post-insertion can cause slight relaxation of contact force; designs using the 3-1926739-0 should include pull-test sampling plans during qualification to establish acceptable retention thresholds and confirm process capability before high-volume production.
How does the right-angle board-edge mounting of the 3-1926739-0 influence signal integrity in high-speed backplane designs?
The right-angle edge-mount configuration of the 3-1926739-0 routes signals vertically from the connector interface, creating a natural transition to daughter-card interconnects. This geometry minimizes stub lengths compared to in-plane mounting, reducing reflections and supporting higher data rates. However, the routing path introduces a slight impedance discontinuity at the connection point; impedance control requires careful PCB stackup design near the 3-1926739-0 mounting location. For backplanes operating above 5 Gbps, simulations or time-domain reflectometry measurements should validate eye diagrams at the connector interface. The 0.079" pitch of the 3-1926739-0 also enables tighter trace routing, which can reduce crosstalk between adjacent signal pairs compared to 0.1" pitch alternatives if layer stackup is properly planned.
What are the MSL implications of the 3-1926739-0, and how does MSL 1 status affect storage and handling?
The 3-1926739-0 carries MSL 1 (Unlimited) moisture sensitivity, meaning the connector can be stored at standard warehouse conditions (typically 23°C/50% RH) indefinitely without requiring desiccant packaging or floor-life tracking. This simplifies supply chain logistics and reduces risk of moisture-induced reflow defects compared to higher MSL components. Press-fit connectors like the 3-1926739-0 are generally less sensitive to moisture than complex SMD devices because the through-hole mounting process does not require high-temperature reflow. However, if the assembled backplane undergoes storage in high-humidity environments (>85% RH) before final deployment, the PCB substrate may absorb moisture; pre-bake recommendations for the assembled backplane should be followed if there is extended delay between assembly and system deployment.
How does the UL94 V-0 flammability rating of the 3-1926739-0 connector body affect system-level safety certifications?
The black connector body of the 3-1926739-0 material meets UL94 V-0 flammability, indicating the thermoplastic housing will extinguish flame within 10 seconds and produces limited dripping. This rating contributes to overall system compliance with safety standards requiring flame-resistant enclosures and reduces fire propagation risk in equipment cabinets. However, the V-0 rating applies only to the connector body; the PCB substrate, daughter cards, and cable assemblies mated to the 3-1926739-0 must independently meet flammability requirements. System integrators should verify that the complete signal and power harnesses connected to the 3-1926739-0 also carry appropriate flammability ratings, as the connector alone does not ensure full system compliance with IEC 61010 or similar safety standards.
What guide pin functionality does the 3-1926739-0 provide, and how does it improve reliability in repeated mating cycles?
The 3-1926739-0 includes guide pins that facilitate correct alignment of mating connectors and prevent cross-keying. Guide pins pre-position the connector before full insertion, reducing lateral forces and improving repeatability across multiple mate-unmate cycles. In field-service scenarios where technicians routinely connect and disconnect daughter cards, the guide pins on the 3-1926739-0 significantly reduce the risk of contact damage from misalignment and lower the insertion force required for mating. This feature is particularly valuable in military and industrial applications where backplane connectors may be serviced in field conditions with limited visual access. The guide pin design of the 3-1926739-0 also helps maintain contact alignment under thermal stress, contributing to stable electrical performance across the operating temperature range.
How should PCB pad design and via placement be optimized for the 3-1926739-0 press-fit termination?
Press-fit pads for the 3-1926739-0 should be designed with appropriate hole diameters and annulus sizes to achieve reliable press-fit retention while avoiding pad cracking. Typical pad sizes range from 0.028–0.032" diameter for 0.079" pitch connectors; the PCB hole should match the contact tail diameter with tolerances typically ±0.003–0.004". Via placement near the 3-1926739-0 pads requires minimum clearance to prevent barrel rupture during press-fit insertion; design guidelines typically recommend ≥0.020" clearance from pad edge. Signal integrity also demands that high-speed signal lines from the 3-1926739-0 transition quickly to inner layers through vias; layer stackup should place ground and power planes adjacent to signal layers to minimize loop inductance. The 2.00mm pitch of the 3-1926739-0 provides adequate spacing for 5–7 mil trace widths, supporting controlled impedance design if trace-to-plane spacing is held consistent.
What are the typical contact resistance specifications for the 3-1926739-0, and how do they affect power distribution margin calculations?
While the 3-1926739-0 datasheet does not always specify typical contact resistance, industry standards for press-fit connectors at this pitch range indicate per-contact resistance of 2–5 mΩ at rated current. For the 12 power positions on the 3-1926739-0, parallel connection of multiple power pins creates an effective contact resistance of approximately 0.2–0.4 mΩ assuming balanced current distribution. In backplane power distribution designs, this contact resistance contributes to the total IR drop; for example, a 30 A system drawing current through the 3-1926739-0 power pins would experience 6–12 mV drop across contacts alone. Designs operating near voltage regulation limits must account for this drop during transient current events; simulation and measurement validation during prototype testing is recommended to confirm power delivery performance when using the 3-1926739-0.
How do RoHS3 compliance requirements affect sourcing and long-term availability of the 3-1926739-0?
The 3-1926739-0 is RoHS3 compliant, confirming conformance to European and similar regional regulations restricting hazardous substances. RoHS3 compliance ensures the 3-1926739-0 uses lead-free solder and finishes, supporting product lifecycle requirements in regulated markets. However, lead-free termination introduces higher reflow temperatures (typically 250–260°C peak) compared to lead-bearing alternatives, which may affect PCB material selection and assembly process planning. The RoHS3 status of the 3-1926739-0 also supports long-term availability; manufacturers prioritize RoHS-compliant product roadmaps, reducing the risk of obsolescence compared to older RoHS2 products. For designs targeting global markets, specifying the 3-1926739-0 simplifies compliance documentation and reduces supply chain complexity.
What environmental sealing or potting strategies are compatible with the 3-1926739-0 in harsh outdoor or marine applications?
The 3-1926739-0 connector body provides no inherent sealing; moisture and salt spray can reach the contact interface in unprotected installations. For harsh environments, the backplane assembly containing the 3-1926739-0 should be potted or conformal coated to exclude moisture and contaminants. Potting compounds compatible with the 3-1926739-0 include epoxy and urethane formulations; however, potting must not be applied to the mating face of the 3-1926739-0, as it would interfere with daughtercard insertion. Selective potting around the 3-1926739-0 solder or press-fit joints protects against corrosion while leaving the connector interface accessible. For applications with frequent mating, conformal coating alone may be preferred over full potting to preserve serviceability. Qualification testing of the potted 3-1926739-0 assembly through thermal cycling and salt-spray exposure should validate long-term performance before deployment.
How should the 3-1926739-0 be specified in bills of materials and procurement processes to ensure consistent supply and avoid cross-part substitution?
The 3-1926739-0 manufacturer part number must be used in procurement to ensure supply consistency; the base product number 1926739 alone is insufficient and may result in substitution with alternative connector configurations. The TE Connectivity AMP MINIPAK HDL series includes variants with different pitch, position count, and mounting styles; specifying the full 3-1926739-0 number prevents accidental receipt of incompatible parts. Procurement should also verify that the 3-1926739-0 is supplied in bulk packaging rather than tape-and-reel, as press-fit connectors are not typically available in SMD reels. Lead times for the 3-1926739-0 typically range from 4–8 weeks in low volumes; design cycles should account for this lead time when planning backplane development. Periodic design reviews should confirm that the 3-1926739-0 remains in active production status to mitigate obsolescence risk over the product lifecycle.

Parts with Similar Specifications

The three parts on the right have similar specifications to TE Connectivity AMP Connectors 3-1926739-0

Product Attribute 3-1926739-0 3-1926730-0 3-1956170-2 3-1924939-2
Part Number 3-1926739-0 3-1926730-0 3-1956170-2 3-1924939-2
Manufacturer TE Connectivity AMP Connectors TE Connectivity AMP Connectors TE Connectivity Potter & Brumfield Relays TE Connectivity AMP Connectors
Contact Finish Gold or Gold-Palladium Gold or Gold-Palladium - -
Features Guide Pin Board Guide, Mating Guide - -
Voltage Rating - - - -
Pitch 0.079' (2.00mm) 0.079' (2.00mm) - -
Series MINIPAK HDL MINIPAK HDL RY, SCHRACK -
Termination Press-Fit Press-Fit - -
Mounting Type Board Edge, Through Hole, Right Angle Board Edge, Through Hole, Right Angle Through Hole -
Number of Positions Loaded All All - -
Package Bulk Bulk Tube Bulk
Current Rating (Amps) - - - -
Connector Style - - - -
Number of Rows - 5 - -
Material Flammability Rating UL94 V-0 UL94 V-0 - -
Connector Usage - - - -
Connector Type Receptacle, Female Sockets and Blade Sockets Plug, Male Pins and Blades - -
Contact Finish Thickness 30.0µin (0.76µm) - - -
Number of Positions 27 27 - -
Contact Layout, Typical 15 Signal, 12 Power 15 Signal, 12 Power - -
Operating Temperature -40°C ~ 125°C - -40°C ~ 70°C -
Base Product Number 1926739 1926730 1956170 1924939
Color Black Black - -
Number of Columns - - - -

3-1926739-0 Datasheet PDF

Download 3-1926739-0 pdf datasheets and TE Connectivity AMP Connectors documentation for 3-1926739-0 - TE Connectivity AMP Connectors.

Datasheets
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  • Circ***FixerTom
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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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3-1926739-0 Image

3-1926739-0

TE Connectivity AMP Connectors
98D-3-1926739-0

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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