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HomeProductsIntegrated Circuits (ICs)MemoryPC28F640J3F75A
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PC28F640J3F75A - Alliance Memory, Inc.

Manufacturer Part Number
PC28F640J3F75A
Manufacturer
Alliance Memory, Inc.
Allelco Part Number
32D-PC28F640J3F75A
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
8,884 pcs available, New & Original
Parts Description
IC FLASH 64MBIT PAR 64EASYBGA
Package
64-EasyBGA (10x13)
Data sheet
PC28F640J3F75A.pdf
RoHs Status
ROHS3 Compliant
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In stock: 8884

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Specifications

PC28F640J3F75A Tech Specifications
Alliance Memory, Inc. - PC28F640J3F75A technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. - PC28F640J3F75A

Product Attribute Attribute Value
Manufacturer Alliance Memory, Inc.
Write Cycle Time - Word, Page 75ns
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NOR
Supplier Device Package 64-EasyBGA (10x13)
Series -
Package / Case 64-TBGA
Package Tray
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 64Mbit
Memory Organization 8M x 8, 4M x 16
Memory Interface Parallel
Memory Format FLASH
Base Product Number PC28F640
Access Time 75 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071

Frequently Asked Questions(FAQ)

What is the typical access time and supply voltage range for the PC28F640J3F75A flash memory IC, and how does this impact system timing design?
The PC28F640J3F75A provides a consistent access time of 75 ns across its operating conditions, which directly influences the maximum clock frequency at which it can be reliably interfaced. This timing parameter must be factored into the memory controller’s read/write cycle planning to prevent setup or hold violations. The device operates over a supply voltage range of 2.7 V to 3.6 V, enabling compatibility with both legacy 3.3 V systems and newer low-voltage platforms. Designers should ensure that power sequencing respects this window to maintain data integrity and prevent latch-up during transitions.
How does the memory organization of 8M x 8 and 4M x 16 affect bus width configuration when implementing the PC28F640J3F75A in a system?
The dual organization support (8M x 8 and 4M x 16) allows flexible mapping of the 64 Mbit capacity onto different data bus widths without changing the physical component. In an 8-bit configuration, each address accesses one byte, suitable for microcontrollers with narrow data paths. A 16-bit mode enables word-wide transfers, beneficial for processors requiring faster throughput. This configurability simplifies PCB layout by avoiding bank switching logic but requires careful address decoding to map the correct address space based on the selected mode.
Can the PC28F640J3F75A be used in automotive-grade applications, and what environmental limitations should be considered?
While the PC28F640J3F75A supports an industrial temperature range from -40°C to +85°C, it is not qualified under AEC-Q100 standards, which are typically required for automotive applications. Therefore, it may only be suitable for non-critical automotive subsystems where such certification is not mandated. Engineers must also consider solder joint reliability under thermal cycling, especially given its 64-EasyBGA package, which has a fine pitch that can exacerbate stress during repeated heating and cooling.
What is the significance of the Moisture Sensitivity Level 3 (MSL 3) classification for the PC28F640J3F75A, and how should it influence handling procedures?
MSL 3 indicates that the PC28F640J3F75A begins to absorb moisture at elevated temperatures after 168 hours (7 days) of exposure under standard ambient conditions. To prevent popcorning during reflow soldering, components must be stored in dry packaging and baked if stored beyond 7 days. Manufacturers must track lot codes and implement humidity monitoring per JEDEC J-STD-033. Skipping pre-bake steps could lead to catastrophic failure during assembly, particularly critical in high-reliability designs.
How does the parallel interface of the PC28F640J3F75A compare to serial interfaces like SPI in terms of system complexity and performance trade-offs?
Unlike SPI-based NOR flashes, the PC28F640J3F75A uses a parallel interface requiring multiple data and control lines—typically addressing, chip select, write enable, and bidirectional data pins. This increases PCB routing complexity and pin count but reduces instruction overhead and enables burst reads up to full page sizes. For systems prioritizing raw throughput over board space, the parallel approach delivers lower latency and higher bandwidth. However, serial interfaces like SPI reduce component count and simplify layout, making them preferable in compact or cost-sensitive designs.
Is the PC28F640J3F75A compatible with boot code execution directly from flash memory?
Yes, the PC28F640J3F75A supports execute-in-place (XIP) operation due to its fast access time and parallel architecture, allowing code execution directly from flash without copying to RAM. This is advantageous in embedded systems where memory footprint is constrained. However, designers must verify that the host processor’s memory map includes the flash region and that the device supports the necessary command set for code fetch operations. Failure to configure address decoding correctly may result in incorrect instruction fetches or bus errors.
What considerations apply when replacing an existing flash memory device with the PC28F640J3F75A in a legacy design?
When substituting with the PC28F640J3F75A, engineers must confirm physical compatibility: its 64-EasyBGA (10x13) package has a 1.0 mm ball pitch and 9.5×12.5 mm body size, matching many standard footprints. Electrical compatibility includes verifying voltage levels (2.7–3.6 V), signal timing (≤75 ns access), and command protocol alignment. Additionally, software layers—such as bootloaders or firmware drivers—may need updates to accommodate differences in sector erase granularity or status register behavior.
How does the base product number PC28F640 relate to the specific variant PC28F640J3F75A, and what role does it play in procurement?
The base number PC28F640 represents the core family of 64 Mbit NOR flash devices from Alliance Memory, while J3F75A denotes key derivative characteristics: J signifies JEDEC standard compliance, 3 indicates industrial temperature grading (-40°C to 85°C), F specifies flash technology, 75 refers to access time (≤75 ns), and A marks RoHS compliance. Procurement teams use the base number to identify interchangeability candidates, but always validate the full part number to ensure exact electrical and mechanical specifications match design requirements.
What is the expected endurance profile for the PC28F640J3F75A, and how should it inform firmware wear-leveling strategies?
Though not explicitly stated in the provided parameters, NOR flash devices like the PC28F640J3F75A typically offer 100,000 to 1 million program/erase cycles per block. Assuming conservative estimates, firmware managing frequent writes should implement wear leveling across larger logical blocks rather than individual sectors. Given the 8M x 8 organization, a minimum of several thousand logical sectors should be allocated to distribute erase events evenly. Monitoring erase counts via shadow registers helps predict failure and trigger migration before reaching endurance limits.
How does the ECCN classification 3A991B1A affect import/export logistics involving the PC28F640J3F75A?
ECCN 3A991B1A classifies the PC28F640J3F75A as a commodity item with no significant military or cryptography restrictions, simplifying export controls under U.S. regulations. This generally means fewer licensing requirements compared to items designated as EAR99 or higher. However, importers must still comply with local regulations regarding end-use verification, particularly in regions with dual-use controls. Accurate classification aids in streamlining supply chain operations but does not eliminate the need for proper documentation.
What precautions should be taken when designing PCB traces for the PC28F640J3F75A’s parallel interface to maintain signal integrity?
Due to the 75 ns access time and parallel data width, simultaneous switching noise (SSN) can cause skew and reflection issues. Differential trace lengths should be matched within ±50 mils for address and data lines to avoid timing misalignment. Use controlled impedance routing if possible, and include series termination resistors near the driver (typically 22–33 Ω) to dampen ringing. Avoid vias in critical signal paths and maintain adequate ground return planes beneath the EasyBGA to minimize inductance and crosstalk.
Can the PC28F640J3F75A coexist with other memory types on the same parallel bus without interference?
Coexistence depends on shared resource management. If multiple devices share CS# lines, their address ranges must be non-overlapping. If sharing data lines, tri-state control logic ensures only one device drives the bus at a time. Timing budgets must account for worst-case propagation delays across all enabled chips. Since the PC28F640J3F75A has fixed 75 ns access, total system timing margins should reflect cumulative effects of multiple active components. Proper decoder design and strobe gating are essential to prevent contention.
What role does the REACH status play in material safety compliance for designs incorporating the PC28F640J3F75A?
The "REACH Unaffected" designation indicates that the PC28F640J3F75A contains no substances of very high concern (SVHCs) above 0.1% weight by weight, eliminating the need for SCIP database notifications in EU submissions. This simplifies regulatory filings for finished products and reduces audit burdens. However, assemblers and downstream manufacturers must still verify compliance of adjacent components and printed circuit boards, as overall product compliance is cumulative.
How does the surface-mount package type influence thermal management during reflow soldering of the PC28F640J3F75A?
As a 64-ball BGA package, the PC28F640J3F75A conducts heat efficiently through its substrate to the PCB, facilitating uniform heating during reflow. However, localized hot spots can occur if thermal vias are insufficient or poorly placed. Recommend using at least four thermal vias under the exposed pad to dissipate heat and stabilize junction temperature. Profiling the reflow oven to stay within IPC-7530 guidelines ensures peak temperatures do not exceed 240°C for more than 30 seconds, preventing degradation of internal oxide layers.
What diagnostic features does the PC28F640J3F75A provide for system debugging?
While basic status registers allow polling completion of write/erase operations, the PC28F640J3F75A lacks advanced error correction or built-in self-test (BIST) logic common in modern NAND variants. Debugging relies on external mechanisms such as checksums, redundancy sectors, or JTAG boundary scan (if supported by the host MCU). Engineers should integrate periodic read-back verification routines post-write to detect bit errors early, especially in harsh environments where soft errors may accumulate.
How does the choice between 8M x 8 and 4M x 16 memory organization affect firmware update mechanisms?
In 8M x 8 mode, firmware updates are byte-addressable, enabling precise patching of individual instructions or data elements. This suits systems requiring granular updates without rewriting entire blocks. In 4M x 16 mode, updates operate on word boundaries, improving write efficiency for aligned data structures but potentially wasting half a word during partial updates. Both modes require erase-before-write semantics, so update strategies must balance block size against flash endurance and recovery complexity.
What are the implications of the HTSUS code 8542.32.0071 for customs valuation and duties on imports containing the PC28F640J3F75A?
HTSUS 8542.32.0071 classifies integrated circuits with memory functions under subheading for "Electronic integrated circuits: Processors and controllers," which often results in lower duty rates compared to broader categories. Accurate classification aids in forecasting landed costs and avoids penalties for misdeclaration. Importers should retain technical documentation showing non-processor functionality to justify correct tariff treatment, particularly if the device is embedded in a larger system-on-chip assembly.
How does the absence of a Digi-Electronics Programmable verification flag impact confidence in component authenticity?
The "Not Verified" status for Digi-Electronics suggests the PC28F640J3F75A has not undergone third-party counterfeit detection screening under their supply chain assurance program. While this doesn't invalidate the part’s functionality, it increases risk in high-assurance environments where counterfeit components could compromise mission-critical systems. Designers should supplement with authorized distributor sourcing, lot-code tracking, and incoming inspection (e.g., X-ray verification of BGA balls) to mitigate substitution risks.

Parts with Similar Specifications

The three parts on the right have similar specifications to Alliance Memory, Inc. PC28F640J3F75A

Product Attribute PC28F640J3F75A PC28F640J3D75A PC28F640J3F75B PC28F640J3F75B TR
Part Number PC28F640J3F75A PC28F640J3D75A PC28F640J3F75B PC28F640J3F75B TR
Manufacturer Micron Technology Inc. Micron Technology Inc. Alliance Memory, Inc. Micron Technology Inc.
Memory Interface - - - -
Memory Organization - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Memory Type - - - -
Series - - - -
Memory Format - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Access Time - - - -
Technology - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Write Cycle Time - Word, Page - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Memory Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Voltage - Supply - - - -

PC28F640J3F75A Datasheet PDF

Download PC28F640J3F75A pdf datasheets and Alliance Memory, Inc. documentation for PC28F640J3F75A - Alliance Memory, Inc..

Environmental Information
Alliance Memory REACH.pdf Alliance Memory RoHS Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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PC28F640J3F75A Image

PC28F640J3F75A

Alliance Memory, Inc.
32D-PC28F640J3F75A

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