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HomeProductsIntegrated Circuits (ICs)MemoryPC28F640J3F75B
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PC28F640J3F75B - Alliance Memory, Inc.

Manufacturer Part Number
PC28F640J3F75B
Manufacturer
Alliance Memory, Inc.
Allelco Part Number
32D-PC28F640J3F75B
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,432 pcs available, New & Original
Parts Description
IC FLASH 64MBIT CFI 64EASYBGA
Package
64-EasyBGA (10x13)
Data sheet
-
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 11432

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Specifications

PC28F640J3F75B Tech Specifications
Alliance Memory, Inc. - PC28F640J3F75B technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. - PC28F640J3F75B

Product Attribute Attribute Value
Manufacturer Alliance Memory, Inc.
Write Cycle Time - Word, Page 75ns
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NOR
Supplier Device Package 64-EasyBGA (10x13)
Series -
Package / Case 64-TBGA
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 64Mbit
Memory Organization 8M x 8, 4M x 16
Memory Interface CFI
Memory Format FLASH
Base Product Number PC28F640
Access Time 75 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071

Parts Introduction

Manufacturer Part Number

PC28F640J3F75B

Manufacturer

Alliance Memory

Introduction

The PC28F640J3F75B is a 64Mbit FLASH memory device using NOR technology.

Product Features and Performance

Non-Volatile FLASH Memory

64Mbit Memory Size

Memory Organization of 8M x 8, 4M x 16

Product Advantages

High-density FLASH memory

Stable memory retention

EasyBGA package for surface mount technology

Key Technical Parameters

NOR Technology

CFI Memory Interface

Write Cycle Time at 75ns

Access Time of 75 ns

Supply Voltage between 2.7V and 3.6V

Operating Temperature range from -40°C to 85°C

Quality and Safety Features

Tested for wide temperature range operation

Reliable data storage and retention

Compatibility

CFI standard interface for compatibility with a variety of microcontrollers and processors

Application Areas

Embedded systems

Telecommunications

Networking hardware

Automotive electronics

Product Lifecycle

Discontinued at Digi-Key

Potential need to seek alternative suppliers or replacements

Several Key Reasons to Choose This Product

Optimal balance of performance, density, and reliability

Suitable for harsh environmental conditions

Compatibility with a wide range of applications

NOR technology advantageous for critical data storage and reliable operation

Frequently Asked Questions(FAQ)

What is the maximum supply voltage tolerance and operating temperature range for the PC28F640J3F75B NOR flash memory IC?
The PC28F640J3F75B supports a supply voltage range of 2.7V to 3.6V, allowing stable operation in systems with moderate power constraints. Its industrial-grade temperature rating spans from -40°C to 85°C, making it suitable for automotive or ruggedized applications where thermal extremes are common. This wide operational envelope ensures reliability across diverse deployment environments without requiring additional environmental compensation circuitry.
How does the access time of the PC28F640J3F75B compare to typical NOR flash devices used in embedded control systems?
With an access time of 75 ns, the PC28F640J3F75B falls within the mid-range performance tier among NOR flash memory solutions. Most high-performance NOR memories offer access times below 50 ns, while lower-cost alternatives may exceed 100 ns. For microcontrollers like ARM Cortex-M series that execute code directly from flash at clock speeds up to 100 MHz, this 75 ns specification implies potential wait states during instruction fetches unless the system clock is carefully managed.
Can the PC28F640J3F75B be used in parallel configurations to support wider data buses beyond 8 bits?
Yes, the device supports multiple memory organizations including 8M x 8 and 4M x 16, enabling flexible interface configurations. In a 4M x 16 organization, two chips can be combined to form a 8M x 16-bit memory space—ideal for processors requiring 16-bit external data paths. However, users must ensure address line mapping aligns with their microcontroller’s memory controller capabilities and verify timing compatibility under parallel read operations.
Is the PC28F640J3F75B compatible with standard CFI (Common Flash Interface) protocols for automatic configuration detection?
Absolutely. The PC28F640J3F75B implements full CFI compliance, which allows host systems to automatically detect key parameters such as memory size, supported commands, and sector erase granularity during boot-up initialization. This simplifies firmware development by eliminating hard-coded memory layouts and reduces integration risk in heterogeneous SoC platforms.
What write cycle duration should engineers expect when programming individual words versus full-page writes using the PC28F640J3F75B?
The datasheet specifies a 75 ns write cycle time for both word-level and page-level programming. While this may seem fast compared to older NOR technologies, it reflects internal burst-write optimizations rather than true single-cycle atomic updates. In practice, sustained programming throughput depends heavily on the host controller’s ability to issue command sequences without interruption, especially since actual endurance cycles remain limited to thousands before wear-out occurs.
How does the moisture sensitivity level (MSL) classification affect handling and storage requirements for bulk quantities of PC28F640J3F75B devices?
Classified as MSL 3 (168-hour floor life), the PC28F640J3F75B requires controlled dry storage conditions once removed from moisture-barrier packaging. After opening, it must be reflow-soldered within 168 hours if ambient humidity exceeds 60% RH; otherwise, bake-out procedures are necessary prior to assembly. This aligns with JEDEC standards and prevents popcorning defects during thermal cycling in mass production.
Are there any known limitations regarding block erase granularity when implementing firmware update routines with the PC28F640J3F75B?
The PC28F640J3F75B supports uniform sector-based erasure, but exact block sizes depend on the specific die revision and factory partitioning. Without explicit sector map documentation from Alliance Memory, designers should assume worst-case scenarios involving large erase blocks that could complicate delta updates or partial firmware patches. Implementing a wear-leveling-aware file system becomes critical to avoid premature failure at frequently updated logical regions.
What role does the 64-EasyBGA (10x13) package play in thermal and mechanical reliability for industrial applications?
The 64-ball grid array package offers superior solder joint integrity under vibration compared to conventional TQFP alternatives, thanks to its fine-pitch BGA design and distributed thermal pad layout. The small form factor (10x13 mm) also enables compact PCB footprints suitable for space-constrained designs. However, successful reflow soldering demands precise stencil thickness and alignment tolerances to prevent bridging or open joints—especially important in high-volume manufacturing lines.

Parts with Similar Specifications

The three parts on the right have similar specifications to Alliance Memory, Inc. PC28F640J3F75B

Product Attribute PC28F640J3F75B TR PC28F640J3F75A PC28F640J3D75B TR PC28F640J3F75A
Part Number PC28F640J3F75B TR PC28F640J3F75A PC28F640J3D75B TR PC28F640J3F75A
Manufacturer Micron Technology Inc. Alliance Memory, Inc. Micron Technology Inc. Micron Technology Inc.
Memory Format - - - -
Access Time - - - -
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Voltage - Supply - - - -
Memory Type - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Memory Organization - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Memory Interface - - - -
Write Cycle Time - Word, Page - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Technology - - - -
Memory Size - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
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Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
Alliance Memory, Inc.

PC28F640J3F75B

Alliance Memory, Inc.
32D-PC28F640J3F75B

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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