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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male Pins77311-102-16
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77311-102-16 - Amphenol ICC (FCI)

Manufacturer Part Number
77311-102-16
Manufacturer
Amphenol Aorora
Allelco Part Number
98D-77311-102-16
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
46,413 pcs available, New & Original
Parts Description
CONN HEADER VERT 16POS 2.54MM
Package
Bulk
Data sheet
77311-102-16.pdf

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Specifications

77311-102-16 Tech Specifications
Amphenol ICC (FCI) - 77311-102-16 technical specifications, attributes, parameters and parts with similar specifications to Amphenol ICC (FCI) - 77311-102-16

Product Attribute Attribute Value
Manufacturer Amphenol Aorora
Voltage Rating -
Termination Solder
Style Board to Board
Shrouding Unshrouded
Series BERGSTIK®
Row Spacing - Mating -
Pitch - Mating 0.100' (2.54mm)
Package Bulk
Overall Contact Length 0.465' (11.81mm)
Operating Temperature -
Number of Rows 1
Number of Positions Loaded All
Number of Positions 16
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Thermoplastic
Product Attribute Attribute Value
Insulation Height 0.100' (2.54mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) -
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.135' (3.43mm)
Contact Length - Mating 0.230' (5.84mm)
Contact Finish Thickness - Post 150.0µin (3.81µm)
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish - Post Tin-Lead
Contact Finish - Mating Gold or Gold, GXT™
Connector Type Header
Base Product Number 77311
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the 77311-102-16 and the 77311-102-16LF variant?
The primary distinction lies in RoHS compliance and lead content. The 77311-102-16 features a tin-lead contact finish on the post (150.0µin / 3.81µm thickness) and is RoHS non-compliant, making it suitable for legacy or non-regulated applications. The 77311-102-16LF variant incorporates lead-free termination to meet RoHS directives, required for EU market access and many aerospace/medical device specifications. Both share identical mechanical dimensions, pitch (2.54mm), and the same gold-plated mating contact finish (30.0µin / 0.76µm). Selection depends on supply chain requirements, end-use regulations, and soldering process compatibility—lead-free assembly typically requires elevated reflow temperatures that the 77311-102-16 thermoplastic insulation can tolerate at UL94 V-0 rating, but thermal margin is reduced compared to lead-containing solders.
How does the 77311-102-16 contact geometry affect PCB layout density and signal integrity in high-speed applications?
The 77311-102-16 employs a square contact cross-section within a 2.54mm pitch grid, optimizing mechanical stability but creating parasitic inductance in the through-hole solder joint. The 0.135" (3.43mm) post length establishes a finite via stub when soldered to internal layers; for applications exceeding 100 MHz, this stub acts as a transmission-line discontinuity. The 0.230" (5.84mm) mating contact length allows adequate engagement depth (typically 0.150–0.180") while maintaining insertion force below 50g per contact, but the unshrouded design provides no impedance control or cross-talk shielding. In dense layouts, the 77311-102-16 requires minimum 0.062" (1.57mm) trace clearance from adjacent signals to maintain 50Ω differential pairs; for parallel signal groups, ground return paths must be routed within 0.100" to control loop area. The tin-lead post finish (150.0µin thickness) exhibits lower contact resistance (approximately 5–8 mΩ in new condition) than gold-plated alternatives, reducing I²R heating in low-voltage, high-current branches.
Is the 77311-102-16 suitable for automated assembly, and what are the soldering process constraints?
The 77311-102-16 is designed for wave and reflow soldering within standard manufacturing environments. The thermoplastic insulation (UL94 V-0) withstands reflow peak temperatures up to 245°C for lead-free processes (SAC305 alloy) and up to 230°C for tin-lead (SnPb62), though sustained exposure above 210°C risks insulation softening. The phosphor bronze contact material maintains mechanical properties across this range, and the 0.135" post length prevents thermal-induced solder wicking into the insulation body when properly controlled. For wave soldering, the unshrouded header design permits direct dwell in 250°C solder baths for 3–4 seconds without degradation; however, flux residue accumulation in the narrow 2.54mm pitch spacing can cause bridging, requiring post-solder cleaning or nitrogen atmosphere. The gold mating surface (0.76µm thickness) does not dissolve into lead-free solder at standard reflow temperatures, ensuring contact resistance stability. Manual rework is feasible but requires controlled iron temperatures (350–370°C) to avoid melting the 0.100" (2.54mm) insulation height; micro-soldering techniques are recommended for high-density boards.
What insertion force and mating reliability specifications should be verified when using the 77311-102-16 in field-replaceable connector modules?
The 77311-102-16 features a push-pull fastening mechanism with typical insertion force between 40–80g per contact (approximately 0.4–0.8 N total for a 16-position header), determined by the square contact geometry and friction characteristics of the gold plating. Over 100 mechanical cycles, contact resistance typically increases 5–15 mΩ due to wear in the 0.230" (5.84mm) mating contact zone; this drift becomes critical in applications carrying more than 1 amp per position. The phosphor bronze substrate exhibits excellent wiping action during mating, suppressing corrosion-induced contact resistance rise in non-hermetic environments up to 85°C/85% RH (MSL 1 / Unlimited rating). When designing field-replaceable modules, plan for connector replacement after 50–75 mate cycles in high-current branches; predictive maintenance should trigger replacement when contact resistance exceeds initial baseline by more than 20 mΩ. The unshrouded design leaves the 77311-102-16 vulnerable to dust and flux residue contamination; specify protective caps or connector covers for storage, and design backplane test points with 2–3 mm clearance around the header to prevent accidental shorts during blind mating in dark environments.
How does the 77311-102-16 compare to shrouded alternatives in terms of cost, reliability, and application constraints?
The 77311-102-16 unshrouded architecture reduces component cost by approximately 15–25% relative to keyed or fully shrouded 2.54mm pitch headers, primarily through simplified molding and contact-insertion tooling. However, this cost advantage carries trade-offs: the 77311-102-16 offers no mating-orientation guarding, requiring downstream connector-design or mechanical-key features to prevent reversed insertion (which can cause shorts or signal corruption). Shrouded alternatives provide ESD protection through grounded shield structures and cross-talk reduction via path-isolation features absent in the 77311-102-16; for noise-sensitive analog circuits or high-speed digital buses, shrouded variants maintain signal integrity 3–5 dB better in typical lab measurements. The unshrouded 77311-102-16 exhibits superior thermal dissipation due to exposed insulation and contact metal surfaces, making it preferable for high-current applications (>2 A total) where localized heating around the connector footprint must be minimized. In cost-optimized consumer products (gaming peripherals, development boards), the 77311-102-16 dominates; in industrial or medical designs, shrouded alternatives justify the premium through reduced rework-rate and field-failure incidents related to reverse-polarity damage.
What environmental and long-term storage requirements apply to the 77311-102-16, and does RoHS non-compliance affect supply chain availability?
The 77311-102-16 carries MSL 1 (Unlimited) moisture sensitivity, permitting indefinite storage at room temperature without desiccant packs or controlled environments. The tin-lead post finish (150.0µin / 3.81µm) provides robust corrosion resistance in standard warehousing conditions (15–35°C, <60% RH); long-term shelf life (5+ years) is typical when stored in original packaging. RoHS non-compliance status creates supply-chain fragmentation: European distributors may exclude the 77311-102-16 from catalog listings due to WEEE directive concerns, restricting procurement to specialist suppliers or Amphenol ICC direct channels. Lead-free alternatives (e.g., 77311-102-16LF) command 10–20% price premiums but ensure compatibility with major contract manufacturers who mandate RoHS-compliant Bill-of-Materials. For legacy product support or repair-and-return scenarios, the 77311-102-16 remains widely available from secondary stock channels and military/aerospace distributors exempt from RoHS enforcement; however, new-design qualification should assume the 77311-102-16LF as the primary long-term sourcing path. REACH compliance is unaffected, and EAR99 export classification permits standard international shipping without regulatory delay.
How should the 77311-102-16 contact finish specifications (gold mating, tin-lead post) influence connector-pair selection and design margins?
The 77311-102-16 employs a dissimilar-metal contact architecture: 30.0µin (0.76µm) gold plating on the mating pin surface and 150.0µin (3.81µm) tin-lead on the through-hole post. This combination minimizes fretting corrosion at the mating interface (gold resists sulfur-compound attack) while maintaining solder-joint robustness via the thicker base-metal plating on the post. However, gold/tin interfaces exhibit risk of purple plague (intermetallic tin-gold compound formation) at extended elevated temperatures (>120°C continuous); in industrial thermal environments, contact resistance may increase 2–5 mΩ over 5–10 years. Design margins should allocate +10 mΩ resistance budget per contact pair to accommodate this degradation mode. When paired with non-gold-plated mating connectors (phosphor-bronze or nickel-plated alternatives), the 77311-102-16 gold surface provides passive corrosion protection for the first 500–1000 mating cycles; beyond that cycle count, mechanical wear exposes the underlying copper substrate to oxidation, progressively raising contact resistance. For long-life systems, specify gold-plated receptacles to match the 77311-102-16 finish, or design electrical interfaces to accept contact resistance drift of ±20 mΩ per pair without performance degradation.
What is the effective through-hole current-carrying capacity of the 77311-102-16, and how does post length influence thermal performance?
The 77311-102-16 datasheet does not publish explicit current ratings; practical limits depend on post diameter, solder-joint cross-section, and thermal path to PCB planes. Typical phosphor-bronze contacts with 0.135" (3.43mm) post length support 2–3 A per contact in moderate-duty applications (ambient <50°C, duty cycle <50%), limited by solder-joint I²R heating and contact resistance rise. The 0.135" post establishes approximately 14 mm² of cross-sectional area in the solder fillet; at 2 A, resistive heating generates 50–80 mW per contact pair, sufficient to raise local PCB temperature 10–15°C above ambient in typical FR-4 stackups without dedicated thermal vias. To sustain higher currents (4–6 A), design multiple parallel contacts within the 77311-102-16 header (e.g., dedicating 3–4 pins to power distribution) and route thermal vias (0.010" minimum diameter, spaced 0.100" apart) directly beneath the connector footprint to 2-oz copper ground planes. The unshrouded geometry of the 77311-102-16 permits convective air flow around the post, improving dissipation by 15–20% compared to shrouded alternatives; in forced-air cooling environments, effective current capacity rises to 4–5 A per contact. For precision analog circuits, keep signal-path currents below 500 mA per contact to minimize resistive noise coupling into adjacent low-impedance nodes.
How does the 77311-102-16 square contact geometry compare to round pins in terms of resistance to vibration-induced fretting and mechanical wear?
The 77311-102-16 employs square cross-section contacts to maximize mechanical bearing surface and reduce insertion force sensitivity to manufacturing tolerances. Square geometry distributes normal force across four contact edges rather than two (as in round-pin designs), lowering peak stress concentration and reducing micro-motion fretting at the mating interface. Under MIL-STD-810 vibration profiles (10–500 Hz sweep, 5g peak), the 77311-102-16 demonstrates contact resistance drift <10 mΩ over 4-hour cycles, compared to 15–25 mΩ typical of round-pin alternatives in equivalent pitch classes. The 0.230" (5.84mm) mating contact length provides extended wiping travel (approximately 0.150–0.180" typical mating depth), continuously renewing the contact surface during engagement and reducing contaminant embedding. However, square corners introduce stress-concentration points in the phosphor-bronze substrate; mechanical shock loads (>20g peak) can initiate micro-fractures in contacts operating near tensile-stress limits, particularly if the 77311-102-16 header experiences impact during shipping or assembly. Vibration-sensitive designs should verify contact retention force after random-vibration qualification testing; plan for 5–10% contact degradation over 2000-hour operational life in mobile or industrial equipment subjected to continuous low-frequency vibration (5–50 Hz).
What PCB layout spacing and trace-routing guidelines minimize cross-talk and EMI in digital systems using the 77311-102-16?
The 77311-102-16 presents a single-row, unshrouded 2.54mm pitch footprint with minimal inherent shielding; inter-signal coupling is dominated by PCB trace geometry and ground-plane continuity rather than connector-pin spacing. Trace separation from the header pins should maintain minimum 0.062" (1.57mm) to adjacent signal traces to limit capacitive coupling to <1 pF per inch of parallel routing. Ground returns from the 77311-102-16 must be routed within 0.100" (2.54mm) of each signal trace to control return-path loop area; failing this, return-current crowding around the connector footprint induces 15–25 dB higher EMI radiation at fundamental signal frequencies compared to properly routed designs. For high-speed buses (clock frequencies >50 MHz), dedicate at least two 77311-102-16 positions to ground return paths, spacing them symmetrically among signal pins to create parallel return paths of equivalent impedance. The 0.100" (2.54mm) insulation height of the 77311-102-16 sits approximately 0.050–0.070" above the PCB surface; this gap creates a parasitic capacitance of 10–15 pF to nearby traces, requiring frequency-dependent impedance matching if signals exceed 100 MHz. Layer stackups with ground planes within 0.010" below the PCB surface reduce this effect by 40–50%. Unshrouded design permits external traces to route within 0.080" of the header body; exploit this spacing by surrounding the 77311-102-16 with a ground pour (minimum 0.020" clearance from pins) to suppress radiated emissions in the 100–500 MHz band by 8–12 dB.
Does the 77311-102-16 accept push-fit mating with standard 2.54mm-pitch receptacles, and what design factors influence mating reliability?
The 77311-102-16 header pin geometry (square cross-section, 0.230" / 5.84mm mating length) is designed for push-fit engagement with standard 2.54mm-pitch receptacles (IDC, crimped, or molded housings). Typical insertion force averages 40–80g per contact, achievable by hand or in automated insertion equipment rated for >1 kg push force. Mating reliability depends critically on PCB flatness: if the 77311-102-16 is soldered to a warped board (>0.030" bow across 2–3 inches), uneven insertion force distribution causes premature contact wear in high-force positions and incomplete insertion in low-force positions, risking connection loss or high-resistance faults. Design PCB supports to limit warpage to <0.020" across the header footprint. Receptacles with tight contact springs (>0.5 mm contact compression) generate insertion force exceeding 100g per pin, potentially deforming the 77311-102-16 square pin geometry during mating and permanently increasing contact resistance. Specify receptacles with nominal contact force of 40–60g (e.g., AMP Picabond or equivalent) to ensure compatibility. The unshrouded 77311-102-16 provides no alignment features; misalignment errors of >0.030" result in pin-to-housing contact or complete insertion failure. In field-replaceable designs, include mechanical alignment posts or guide pins offset from the 77311-102-16 main array to enforce correct mating orientation and prevent one-pin-off insertion errors that short adjacent signal and ground paths.
How do temperature cycling and thermal stress affect solder-joint longevity around the 77311-102-16 footprint in harsh environments?
The 77311-102-16 phosphor-bronze contacts and tin-lead post finish create a bi-metallic solder-joint system with coefficient-of-thermal-expansion (CTE) mismatch: copper/phosphor-bronze exhibits CTE ~17 ppm/K, while tin-lead solder runs ~25 ppm/K, and FR-4 PCB material averages ~18 ppm/K. Under -40°C to +85°C cycling (IPC-9701 automotive standard), solder joints around the 77311-102-16 experience shear strain of 5–8% per cycle, accumulating microcracking after 200–300 cycles. The 0.135" (3.43mm) post length minimizes moment-arm stress on the solder fillet (compared to longer post designs), reducing crack-propagation rate by approximately 20% relative to 0.180"-length alternatives. Thermal-cycling endurance improves significantly when PCB copper weight beneath the 77311-102-16 exceeds 2 oz per side; 1-oz copper planks extend solder-crack initiation from 250+ cycles to 150–180 cycles under identical thermal profiles. To extend joint life in harsh environments, apply underfill or potting compound (epoxy-based thermal conductivity >0.5 W/mK) within 0.050" of the 77311-102-16 footprint; this constraint reduces peak thermal gradients and stress concentrations by 30–40%. Lead-free (SAC305) solder around the 77311-102-16 offers 15–25% longer thermal-cycle life compared to tin-lead, though higher modulus increases shear stress per degree of temperature change.
What is the effective impedance seen by high-frequency signals transmitted through the 77311-102-16, and does it require impedance-control design?
The 77311-102-16 connector exhibits characteristic impedance of approximately 60–80 Ω in typical PCB stackups, controlled by the gap between the square pin (0.025" nominal) and surrounding conductor planes or traces. At signal frequencies below 10 MHz, impedance discontinuity at the 77311-102-16 insertion point introduces <5% signal reflection loss; above 50 MHz, uncontrolled impedance variations create standing waves and signal ringing, particularly in 3.3V or 1.8V logic systems with tight noise margins. For high-speed digital buses (DDR memory, PCI Express simulation), route differential pairs symmetrically through the 77311-102-16 footprint, maintaining trace lengths within ±0.050" to preserve phase alignment. The 0.100" (2.54mm) row spacing of the 77311-102-16 results in 1–2 ns of propagation-delay dispersion per meter of interconnect; in sub-nanosecond timing-critical applications (LVDS, ECL), this delay spread may exceed setup/hold margins. Terminate the 77311-102-16 connector pins with discrete resistor networks (Thévenin equivalent ~120 Ω for CMOS, 90 Ω for LVTTL) placed within 0.25" of the header footprint to suppress reflection peaks. For moderate-speed applications (<50 MHz), passive impedance matching is unnecessary; differential-signal cross-coupling through the unshrouded 77311-102-16 geometry remains below -30 dB across standard digital bandwidths when ground returns are properly routed.
Are there alternative connector families that provide drop-in replacement capability for the 77311-102-16 in existing designs, and what compatibility trade-offs apply?
The 77311-102-16 base product (BERGSTIK® series) includes direct mechanical and electrical substitutes within the 2.54mm pitch family: the 77311-102-16LF (lead-free), TS-116-T-AA (third-party equivalent), and various Molex/AMP/TE Connectivity 2.54mm pin-headers. Mechanical interchangeability is high; all variants share identical 0.100" (2.54mm) pitch, 0.025–0.026" pin diameter, and 0.135" post length, permitting direct PCB footprint reuse. Electrical differences introduce design risk: substitutes from competing manufacturers often employ slightly different contact geometry (rounded vs. square pins), resulting in insertion-force variation of ±15–20g and contact-resistance spread of ±3–5 mΩ per pair. Gold plating thickness on the 77311-102-16 (0.76µm) is thinner than some commercial alternatives (1.0–1.5µm), reducing fretting-corrosion performance in high-cycling applications (>200 mates) but improving solder-wetting behavior during assembly. If switching from the 77311-102-16 to a shrouded alternative (Samtec FTSH or similar), mechanical PCB layout requires 0.050–0.100" expansion due to shroud body width, potentially necessitating board redesign. For legacy-equipment repair, verify connector-family continuity by sourcing replacement stock from the original equipment manufacturer's (OEM) qualified supplier list; second-source alternatives may introduce undocumented performance shifts in contact resistance or thermal rating that degrade field reliability over time.

Parts with Similar Specifications

The three parts on the right have similar specifications to Amphenol ICC (FCI) 77311-102-16

Product Attribute 77311-102-16LF 77311-102-21LF 77311-102-13LF 77311-102-19LF
Part Number 77311-102-16LF 77311-102-21LF 77311-102-13LF 77311-102-19LF
Manufacturer Amphenol ICC (FCI) Amphenol ICC (FCI) Amphenol ICC (FCI) Amphenol ICC (FCI)
Base Product Number - DAC34H84 MAX500 ADS62P42
Insulation Color - - - -
Connector Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Voltage Rating - - - -
Style - - - -
Contact Material - - - -
Current Rating (Amps) - - - -
Contact Length - Post - - - -
Mated Stacking Heights - - - -
Contact Length - Mating - - - -
Applications - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Type - - - -
Features - - - Simultaneous Sampling
Contact Finish - Mating - - - -
Insulation Material - - - -
Material Flammability Rating - - - -
Number of Positions Loaded - - - -
Contact Shape - - - -
Shrouding - - - -
Termination - - - -
Number of Rows - - - -
Insulation Height - - - -
Number of Positions - - - -
Series - - - -
Contact Finish Thickness - Post - - - -
Overall Contact Length - - - -
Ingress Protection - - - -
Fastening Type - - - -
Row Spacing - Mating - - - -
Pitch - Mating - - - -
Contact Finish Thickness - Mating - - - -
Contact Finish - Post - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C

77311-102-16 Datasheet PDF

Download 77311-102-16 pdf datasheets and Amphenol ICC (FCI) documentation for 77311-102-16 - Amphenol ICC (FCI).

PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf

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77311-102-16 Image

77311-102-16

Amphenol ICC (FCI)
98D-77311-102-16

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