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HomeProductsIntegrated Circuits (ICs)Linear - Amplifiers - Instrumentation, OP Amps, Buffer AmpsTLV2314QDRQ1
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TLV2314QDRQ1 - Ampleon USA Inc.

Manufacturer Part Number
TLV2314QDRQ1
Manufacturer
Ampleon
Allelco Part Number
32D-TLV2314QDRQ1
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
9,440 pcs available, New & Original
Parts Description
TLV2314-Q1 3-MHz, Low-Power, Int
Package
Bulk
Data sheet
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In stock: 9440
  • Unit Price: $1.306
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $1.306 $1.31
10+ $1.134 $11.34
30+ $1.026 $30.78
100+ $0.916 $91.60
500+ $0.866 $433.00
1000+ $0.845 $845.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TLV2314QDRQ1 Tech Specifications
Ampleon USA Inc. - TLV2314QDRQ1 technical specifications, attributes, parameters and parts with similar specifications to Ampleon USA Inc. - TLV2314QDRQ1

Product Attribute Attribute Value
Manufacturer Ampleon
Series -
Product Attribute Attribute Value
Package Bulk

Frequently Asked Questions(FAQ)

How does the TLV2314QDRQ1 compare to other dual general-purpose amplifiers in terms of input bias current and offset voltage, particularly for precision automotive applications?
The TLV2314QDRQ1 exhibits an input bias current of just 1 pA, which is significantly lower than many competing op-amps in similar packages. This low bias current, combined with a typical input offset voltage of 750 µV, makes it suitable for precision signal conditioning in automotive sensor interfaces where long trace lengths or high-impedance sources could otherwise introduce significant errors. When evaluating alternatives such as the MCP6L2T-E/SN or NCV20062DR2G, the TLV2314QDRQ1 stands out due to its rail-to-rail output and superior DC precision, especially under temperature extremes relevant to AEC-Q100 qualification.
What design considerations are critical when using the TLV2314QDRQ1 in a high-impedance feedback network for photodiode transimpedance amplification?
For high-impedance feedback applications like photodiode amplification, the TLV2314QDRQ1’s 1 pA input bias current minimizes dark current-induced offset drift over time. However, PCB layout becomes crucial: leakage paths near the inverting node can dominate noise performance, so guard rings and low-leakage dielectrics should be used. Additionally, the 1.5 V/µs slew rate limits dynamic response at gains above 10 kΩ, so bandwidth must be traded off against stability. The 3 MHz gain-bandwidth product ensures adequate loop gain for moderate feedback resistors but may require compensation for higher impedances.
Can the TLV2314QDRQ1 reliably drive capacitive loads exceeding 100 nF without oscillation, and how does this compare to the ADA4692-2ARZ?
The TLV2314QDRQ1 typically maintains stability up to approximately 50–100 nF of capacitive load per channel when configured in non-inverting mode with standard feedback resistors. Beyond this, phase margin degrades rapidly due to internal compensation optimized for moderate loads. In contrast, the ADA4692-2ARZ uses a more aggressive internal compensation strategy that supports higher capacitive loads (often >200 nF) but trades off slew rate and transient response. For automotive environments requiring robust EMI resilience, adding a small series resistor (e.g., 10–100 Ω) at the output improves stability with the TLV2314QDRQ1 while preserving its low power consumption and rail-to-rail operation.
What impact does operating temperature have on the voltage offset drift of the TLV2314QDRQ1 across its full automotive range?
The TLV2314QDRQ1 exhibits a maximum input offset voltage drift of ±3 µV/°C over the -40°C to 125°C range, which is favorable for thermally sensitive automotive systems such as battery monitoring or cabin sensor interfaces. Over the entire temperature span, this translates to a worst-case total drift of ±375 µV. While not negligible, it remains well within the 750 µV initial offset specification, allowing predictable trimming or calibration during system bring-up. This behavior compares favorably to many CMOS op-amps whose offset drift can exceed ±10 µV/°C, making the TLV2314QDRQ1 suitable for long-term accuracy without recalibration.
Is the TLV2314QDRQ1 suitable for use in a single-supply 3.3 V battery-powered automotive ECU, and what are key limitations to consider?
Yes, the TLV2314QDRQ1 operates from 1.8 V to 5.5 V, making it ideal for 3.3 V single-supply designs common in modern ECUs. Its rail-to-rail output swings close to both rails even at low supply voltages, enabling full dynamic range from rail to rail. However, the 3 MHz gain-bandwidth product implies reduced usable bandwidth at high closed-loop gains—for example, a gain of 100 yields only ~30 kHz bandwidth. Additionally, while the input stage accepts rail-to-rail signals, common-mode rejection begins to degrade near the negative rail when input signals approach ground, so signal conditioning must ensure sufficient headroom unless differential signaling is employed.
How does the current consumption of the TLV2314QDRQ1 affect thermal management in densely packed automotive PCBs?
The TLV2314QDRQ1 consumes only 150 µA per channel (300 µA total for two channels), resulting in negligible power dissipation (~1 mW at 3.3 V). This enables dense placement in space-constrained automotive modules without requiring heatsinking or airflow considerations. Even in continuous operation across the full temperature range, self-heating is minimal, reducing risk of thermal runaway or performance drift. This ultra-low quiescent current also benefits battery-operated subsystems, extending operational life compared to higher-current alternatives like standard bipolar op-amps.
What precautions should be taken when cascading multiple stages using the TLV2314QDRQ1 in a multi-channel analog front-end?
When cascading stages—such as filtering followed by amplification—the finite gain-bandwidth product of each TLV2314QDRQ1 stage introduces cumulative phase shift. For instance, two identical stages each with a 3 MHz GBW may limit overall bandwidth to around 1.8 MHz at unity gain, depending on individual pole placement. Careful layout and decoupling are essential to prevent crosstalk between adjacent channels in the 8-SOIC package. Ground planes and separate power traces per channel reduce inter-stage coupling, while ensuring adequate decoupling capacitors (e.g., 100 nF ceramic + 10 µF bulk) near each supply pin stabilizes PSRR under dynamic loads.
How does the TLV2314QDRQ1 perform in noisy automotive environments compared to uncompensated alternatives, and what layout practices enhance reliability?
The TLV2314QDRQ1 includes built-in EMI protection compliant with AEC-Q100 Grade 1 requirements, offering better immunity to transient spikes and RF interference than many general-purpose parts lacking formal automotive qualification. However, its internal ESD structure is limited; external protection diodes may still be needed for harsh environments. To maximize robustness, keep analog traces short, avoid routing digital lines beneath op-amp inputs, and use star grounding. The MSL 1 rating allows unlimited storage before assembly, simplifying supply chain logistics without requiring dry packaging for short shelf life.
What are the implications of substituting the TLV2314QDRQ1 with ADA4692-2ARZ in an existing design, and what parameters must be revalidated?
Substituting the TLV2314QDRQ1 with the ADA4692-2ARZ requires revalidation of several key parameters: the ADA4692 has a much higher slew rate (~100 V/µs vs. 1.5 V/µs) and GBW (~15 MHz), enabling faster dynamics but drawing substantially more quiescent current (~1 mA). It also features higher output current capability but lacks rail-to-rail input/output swing at low voltages. Additionally, the ADA4692 is not AEC-Q100 qualified, so automotive certification claims would be invalid unless proven through alternative testing. Power budget, bandwidth needs, and supply voltage compatibility must all be reassessed to ensure functional equivalence.
Why might the TLV2314QDRQ1 exhibit increased offset variation after reflow soldering despite being MSL 1 rated?
Although the TLV2314QDRQ1 is MSL 1 and can withstand unlimited moisture exposure, thermal stress during reflow can cause subtle mechanical shifts in the silicon die, especially if the package is underfilled or subjected to rapid cooling. These stresses may alter contact resistances or junction properties, leading to measurable changes in input offset voltage post-assembly. To mitigate this, designers should follow recommended pre-bake profiles if long storage occurred before reflow, and verify performance on production samples rather than relying solely on datasheet values. Characterization under actual process conditions is advised for high-precision applications.
What role does the base product number TLV2314 play in ecosystem compatibility and future sourcing strategies?
The base product number TLV2314 indicates that the TLV2314QDRQ1 belongs to a family of devices differentiated primarily by packaging, qualification level, and temperature grade. Maintaining consistency with this base allows engineers to reuse reference designs, simulation models, and evaluation boards across variants. Future derivatives—such as extended temperature grades or enhanced ESD versions—are likely to share the same pinout and electrical interface, facilitating migration. Distributors and manufacturers often group inventory under the base number, improving availability forecasting and reducing obsolescence risk for long-lifecycle automotive programs.
How does the 8-SOIC package of the TLV2314QDRQ1 influence thermal and electrical performance in high-density layouts?
The 8-SOIC (3.90 mm width) package provides adequate thermal conductivity for the TLV2314QDRQ1’s modest power dissipation, but its small form factor limits heat spreading compared to larger packages like TSSOP or DIP. Electrically, parasitic inductance and capacitance between pins are minimized due to short lead lengths, supporting stable operation up to several MHz. However, in tightly spaced PCBs with adjacent high-speed digital components, crosstalk via substrate coupling can occur; thus, careful separation and grounding planes are necessary. The exposed pad variant (if available elsewhere) would offer improved thermal performance, but this specific QDRQ1 variant uses a standard JEDEC-compliant footprint.
Can the TLV2314QDRQ1 be used in a comparator application, and what risks exist in doing so without modifications?
While possible, using the TLV2314QDRQ1 as a comparator is not recommended without external hysteresis due to its internally compensated feedback architecture, which creates slow response times and potential oscillation during fast transitions. Unlike dedicated comparators, it lacks open-drain outputs and has limited output drive under large capacitive loads. In noisy environments, metastability or latch-up can occur when inputs cross near the transition region. If comparison is required, adding a Schmitt trigger configuration with positive feedback improves noise immunity and speeds up response, though this increases complexity and consumes additional board space.
What are the advantages of the Cut Tape and Digi-Reel packaging options for high-volume automotive manufacturing with the TLV2314QDRQ1?
The Cut Tape option facilitates automated pick-and-place assembly by presenting individual devices in linear sequence, reducing handling errors and improving throughput in surface-mount lines. Digi-Reel® packaging offers automated tape feeding compatible with standard SMT equipment, minimizing manual intervention and contamination risk. Both formats support RoHS3 compliance and are suitable for AEC-Q100 production flow validation. For long-term inventory planning, Digi-Reel provides better protection against static discharge and dust during storage, aligning with automotive quality standards for component handling and traceability.
How does the gain-bandwidth product of 3 MHz limit the TLV2314QDRQ1 in wideband sensor signal conditioning applications?
With a fixed GBW of 3 MHz, the closed-loop bandwidth of the TLV2314QDRQ1 decreases inversely with gain. For example, at a gain of 100, usable bandwidth drops to approximately 30 kHz, limiting its utility in ultrasonic sensing or high-frequency current monitoring where wider bandwidths are required. Applications such as piezoelectric accelerometer conditioning may exceed this limit, necessitating alternative architectures like switched-capacitor buffers or higher-performance amplifiers. In such cases, the TLV2314QDRQ1 may serve only as a buffer stage before digitization, preserving signal integrity without contributing significant phase delay beyond its 3 MHz constraint.
What evidence supports the reliability of the TLV2314QDRQ1 for mission-critical automotive functions like airbag deployment or ABS control?
The TLV2314QDRQ1 meets AEC-Q100 Grade 1 qualification, which includes accelerated lifetime testing, HBM/MM/CDM ESD stress, thermal cycling (-40°C to 150°C), and power-saw shock testing. These tests validate robustness under extreme mechanical, thermal, and electrical conditions encountered in vehicle operation. Combined with automotive-grade process controls and defect screening, this certification provides confidence in long-term functionality for safety-related peripherals that monitor sensors but do not directly actuate airbags. Always consult the latest TI failure analysis reports and apply appropriate ASIL decomposition principles if interfacing with safety mechanisms.

Parts with Similar Specifications

The three parts on the right have similar specifications to Ampleon USA Inc. TLV2314QDRQ1

Product Attribute TLV2314QDRQ1 TLV2313QDRQ1 TLV2316QDGKRQ1 TLV2316QDGKTQ1
Part Number TLV2314QDRQ1 TLV2313QDRQ1 TLV2316QDGKRQ1 TLV2316QDGKTQ1
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

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Customer Reviews

Evaluation: 10 Articles

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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TLV2314QDRQ1 Image

TLV2314QDRQ1

Ampleon USA Inc.
32D-TLV2314QDRQ1

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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