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HomeProductsIntegrated Circuits (ICs)Logic - Translators, Level ShiftersMAX3002EUP+T
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MAX3002EUP+T - Analog Devices Inc./Maxim Integrated

Manufacturer Part Number
MAX3002EUP+T
Manufacturer
Maxim Integrated
Allelco Part Number
32D-MAX3002EUP+T
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
8,798 pcs available, New & Original
Parts Description
IC TRANSLATOR BIDIR 20TSSOP
Package
20-TSSOP
Data sheet
MAX3002EUP+T.pdf

Part Numbering Guide

Part Numbering System.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 8798
  • Unit Price: $4.711
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $4.711 $4.71
10+ $4.111 $41.11
30+ $3.745 $112.35
100+ $3.438 $343.80
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MAX3002EUP+T Tech Specifications
Analog Devices Inc./Maxim Integrated - MAX3002EUP+T technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc./Maxim Integrated - MAX3002EUP+T

Product Attribute Attribute Value
Manufacturer Maxim Integrated
Voltage - VCCB 1.65 V ~ 5.5 V
Voltage - VCCA 1.2 V ~ 5.5 V
Translator Type Voltage Level
Supplier Device Package 20-TSSOP
Series -
Package / Case 20-TSSOP (0.173", 4.40mm Width)
Package Tape & Reel (TR)
Output Type Tri-State, Non-Inverted
Output Signal -
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C (TA)
Number of Circuits 1
Mounting Type Surface Mount
Input Signal -
Features Auto-Direction Sensing, Power-Supply Decoupling
Data Rate 35Mbps
Channels per Circuit 8
Channel Type Bidirectional
Base Product Number MAX3002

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

MAX3002EUP+T Image
MAX3002EUP+T (1)

Manufacturer Part Number

MAX3002EUP+T

Manufacturer

Analog Devices

Introduction

The MAX3002EUP+T is a versatile voltage level translator capable of bidirectional level shifting.

Product Features and Performance

High-speed data rate up to 35Mbps

Bidirectional translation of 8 channels

Auto-direction sensing feature

Power-supply decoupling function

Supports a wide voltage range for VCCA and VCCB

Product Advantages

Integrated ESD protection

Minimal propagation delay

Convenient 20-TSSOP packaging for easy surface mount applications

Key Technical Parameters

1 circuit with 8 bidirectional channels

Voltage - VCCA range from 1.2 V to 5.5 V

Voltage - VCCB range from 1.65 V to 5.5 V

Tri-State, Non-Inverted output type

Operating Temperature range from -40°C to 85°C

Quality and Safety Features

Designed for robust operation in commercial temperature environments

Meeting industry standards for electronic component safety

Compatibility

Suitable for interfacing between different voltage domains in a system

Application Areas

Consumer electronics

Data communication systems

Microprocessor-based systems

Cross-platform interface applications

Product Lifecycle

Active status

Not indicated as nearing discontinuation, replacements or upgrades should be checked with the manufacturer

Several Key Reasons to Choose This Product

Supports a broad range of supply voltages to ensure flexibility in various applications

Auto-direction sensing simplifies board complexity

High data rate supports modern high-speed interfaces

Low on-resistance ensures minimal signal distortion

Tape & Reel packaging enables efficient assembly for high-volume production

Frequently Asked Questions(FAQ)

What are the key voltage compatibility considerations when integrating the MAX3002EUP+T bidirectional translator into a mixed-voltage system with 1.8V and 3.3V domains?
The MAX3002EUP+T supports VCCA ranging from 1.2V to 5.5V and VCCB from 1.65V to 5.5V, enabling flexible interfacing between different logic levels. When connecting a 1.8V microcontroller to a 3.3V peripheral, for example, VCCA can be supplied at 1.8V while VCCB operates at 3.3V. This configuration ensures robust signal translation without level clamping risks. The device’s auto-direction sensing eliminates the need for separate direction control signals, simplifying layout and reducing pin count. Designers must ensure that both power rails are clean and stable, as the part includes internal decoupling capacitors but benefits from external bypassing near the supply pins for noise-sensitive applications.
How does the data rate capability of the MAX3002EUP+T influence its suitability for high-speed communication protocols such as I²C or UART?
With a maximum data rate of 35Mbps, the MAX3002EUP+T comfortably supports standard UART baud rates up to 115.2 kbps and even some enhanced modes beyond 1 Mbps in UART implementations. For I²C, which typically operates at 400 kHz (Fast Mode) or 1 MHz (Fast Mode Plus), the translator introduces negligible propagation delay—well within timing margins. However, designers should verify that total bus capacitance and pull-up resistor values remain compatible across voltage domains. While not optimized for DDR memory interfaces, the device is well-suited for most embedded serial communications where voltage translation and direction independence are required.
In what scenarios would the auto-direction sensing feature of the MAX3002EUP+T provide significant advantages over manually controlled translators?
Auto-direction sensing allows seamless bidirectional communication without requiring a dedicated direction pin or software intervention, making it ideal for systems like sensor nodes or handheld devices where GPIOs may change roles dynamically. For instance, a battery-powered IoT endpoint might alternate between reading configuration registers from a host and sending telemetry data back—each transfer direction handled automatically by the MAX3002EUP+T. This reduces firmware complexity, saves PCB space, and minimizes latency during direction changes compared to polling-based solutions using unidirectional buffers or manual direction control chips.
How does the operating temperature range of the MAX3002EUP+T impact deployment in industrial versus consumer environments?
Rated from -40°C to +85°C, the MAX3002EUP+T is suitable for extended industrial use cases including automotive-grade peripherals, factory automation sensors, and outdoor instrumentation. Consumer electronics, which typically require only 0°C to +70°C operation, also benefit from this margin, offering greater thermal reliability under transient loads or poor cooling conditions. The wide junction-to-ambient thermal resistance specification ensures consistent performance even when mounted on densely populated PCBs without forced airflow. Engineers should still conduct worst-case thermal simulations if the TSSOP package is soldered in close proximity to high-power components.
Can the MAX3002EUP+T be used safely in hot-swap applications where power sequencing is unpredictable?
Yes, provided proper precautions are taken. The MAX3002EUP+T has no absolute maximum rating violations when one side powers up before the other, thanks to its internal ESD protection diodes limiting voltage differentials. However, excessive inrush current or reverse polarity events could stress these diodes. To mitigate risk, include series resistors (e.g., 22–100Ω) on each I/O line and consider TVS diodes if hot insertion occurs frequently. Additionally, ensure that neither VCCA nor VCCB exceeds 5.5V during any phase of power-up to avoid latch-up conditions. These measures align with JEDEC standards for robust system integration.
What layout recommendations apply to minimize crosstalk and EMI when routing signals through the MAX3002EUP+T in a high-density PCB?
Maintain at least 3W spacing (where W is trace width) between adjacent signal lines passing through the translator, especially for clock or strobe signals above 10MHz. Route power and ground planes directly beneath the 20-TSSOP package with multiple vias to reduce impedance and improve decoupling. Keep input and output traces segregated to prevent coupling; if crossing is unavoidable, orthogonal routing helps. Place 0.1µF ceramic capacitors as close as possible to VCCA and VCCB pins to suppress high-frequency transients. Avoid running long parallel runs near crystal oscillators or RF sources to preserve signal integrity across the 8 bidirectional channels.
How does the number of channels in the MAX3002EUP+T compare to alternatives when scaling a multi-drop sensor network?
The MAX3002EUP+T provides eight independent bidirectional channels within a single 20-pin package, offering a compact solution for translating an entire port block such as a GPIO expansion or SPI/I²C bus. Alternatives like discrete MOSFET-based translators require more board area per channel and lack integrated direction logic. Multi-channel ICs from competitors often offer fewer than eight channels or higher quiescent current. For a system needing simultaneous translation of six or seven signals, the MAX3002EUP+T delivers optimal density without sacrificing direction autonomy. Only when needing dozens of channels would a multi-chip approach become necessary.
What are the implications of the Moisture Sensitivity Level 1 classification for the MAX3002EUP+T in manufacturing and storage?
MSL 1 indicates unlimited floor life at 30°C/60% RH, allowing manufacturers to store the MAX3002EUP+T indefinitely without baking prior to reflow. This simplifies inventory management and reduces production costs associated with moisture-related defects. No special handling procedures are required beyond standard ESD protocols. As long as packaging remains intact, the component poses no risk of popcorning during lead-free reflow profiles common in modern SMT assembly. This level of robustness makes it ideal for high-volume production environments seeking efficiency and yield stability.
Why might a designer choose the MAX3002EUP+T over a unidirectional buffer array despite having identical channel counts?
Unidirectional buffers require separate direction control logic, increasing pin usage and firmware overhead. In contrast, the MAX3002EUP+T automatically detects data flow direction on each of its eight lines, enabling true bidirectional communication without external steering. This is critical in protocols like SMBus or custom two-wire interfaces where direction changes unpredictably. Additionally, the MAX3002EUP+T maintains full signal swing across its supported voltage ranges (1.2V–5.5V), whereas many buffer solutions suffer from degraded rise times or reduced noise margins at lower voltages. The result is cleaner waveform integrity and better interoperability across diverse IC families.
How does the MAX3002EUP+T handle signal integrity when translating between 5V tolerant microcontrollers and 1.8V sensors?
Since both VCCA and VCCB can accept up to 5.5V, the MAX3002EUP+T safely translates 5V logic levels down to 1.8V without exceeding input thresholds. On the low-voltage side, inputs are treated as standard CMOS-compatible, ensuring compatibility with 1.8V sensor outputs. The translator passes through valid logic states without attenuation, preserving setup and hold times relative to source and destination clocks. However, care must be taken to ensure that 5V inputs do not drive the 1.8V rail excessively; series termination resistors or Schottky clamps may be added if leakage currents are a concern. Overall, the device acts as a transparent bridge under these conditions.
What trade-offs exist between using the MAX3002EUP+T and opto-isolators for galvanic isolation in safety-critical systems?
Opto-isolators provide electrical separation essential for hazardous environments but introduce significant propagation delay (>1µs) and limited lifetime due to LED degradation. The MAX3002EUP+T offers no galvanic isolation—making it unsuitable for applications requiring fault containment or surge immunity. However, it consumes far less power (~10µA typical quiescent current vs. ~1mA per channel for optocouplers) and supports much higher data rates (35Mbps vs. <10Mbps). Thus, the MAX3002EUP+T excels in non-isolated, cost-sensitive designs where speed and size matter more than dielectric strength. Isolation must be implemented separately via dedicated isolator ICs if required.
How does the tri-state output configuration of the MAX3002EUP+T affect bus contention risks in shared-bus architectures?
Each channel features a high-impedance tri-state output that actively disconnects when disabled, preventing unintended driving during reset or sleep modes. This prevents bus contention when multiple masters attempt arbitration simultaneously. Unlike open-drain configurations, tri-state outputs maintain defined logic levels during active transmission, improving noise margins. Designers must ensure that enable/disable timing respects protocol requirements—particularly in I²C-like systems where pull-ups rely on devices releasing the bus quickly. Proper use of the MAX3002EUP+T enhances system reliability in multi-drop topologies without additional gate circuitry.
What considerations apply when cascading multiple MAX3002EUP+T devices in a daisy-chain topology?
Cascading is feasible since each channel independently routes data without feedback dependencies. However, cumulative propagation delay across stages must be evaluated against protocol timing budgets—especially for synchronous links. Signal attenuation over long traces between devices can degrade eye diagrams at 35Mbps; thus, stub lengths should be minimized and matched impedances maintained. Additionally, power distribution becomes critical: ensure adequate decoupling at each stage to prevent ground bounce from affecting threshold accuracy. While functionally possible, daisy-chaining is generally avoided unless space constraints demand it, favoring point-to-point translations instead.
How does the MAX3002EUP+T perform in terms of electromagnetic emissions compared to discrete-level-shifting circuits?
Integrated translators like the MAX3002EUP+T exhibit lower radiated emissions than discrete solutions using transistor pairs or MOSFET switches due to shorter parasitic inductances and tighter current loops. Their monolithic design minimizes switching noise harmonics, aiding compliance with CISPR 22/24 standards in consumer and industrial equipment. Discrete approaches often generate higher dv/dt spikes from mismatched gate capacitances, requiring snubber networks or shielding. For designs targeting FCC Part 15 or EN 55032, the MAX3002EUP+T contributes favorably to overall EMC performance when paired with good grounding practices and filtered supplies.
What role does the Power-Supply Decoupling feature play in stabilizing the MAX3002EUP+T during dynamic load changes?
Internal decoupling capacitors help stabilize local voltage rails during fast edge transitions, reducing susceptibility to supply droop caused by simultaneous switching of multiple channels. However, they are sized for typical transient response and cannot replace bulk capacitance needed for sustained loads or noisy environments. External 0.1µF MLCCs placed within 2mm of each supply pin further enhance PSRR, particularly at frequencies above 10MHz. This hybrid approach ensures clean references for input comparators and output drivers, minimizing glitching and false triggering in time-sensitive applications.
When selecting between the MAX3002EUP+T and a similar translator from Texas Instruments (e.g., TXB0108), what technical factors should guide the decision?
Both support similar voltage ranges and data rates, but differences emerge in enable logic, power-up behavior, and package options. The MAX3002EUP+T uses auto-direction sensing, eliminating explicit OE pins, while the TXB0108 requires a dedicated direction control signal. Quiescent current varies slightly—consult datasheet curves for specific supply conditions. Package footprint alignment (both 20-TSSOP) eases migration, but thermal characteristics depend on solder joint quality and copper pour. Ultimately, choice hinges on whether automatic direction detection simplifies firmware outweighs the need for active enable control in the target application.

Parts with Similar Specifications

The three parts on the right have similar specifications to Analog Devices Inc./Maxim Integrated MAX3002EUP+T

Product Attribute MAX3002EUP+ MAX3002EBP+T MAX3002ETP+T MAX3002EUP
Part Number MAX3002EUP+ MAX3002EBP+T MAX3002ETP+T MAX3002EUP
Manufacturer Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated
Translator Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Output Signal - - - -
Number of Circuits - - - -
Data Rate - - - -
Channels per Circuit - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Voltage - VCCA - - - -
Input Signal - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage - VCCB - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Output Type - Current - Unbuffered Voltage - Buffered -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Channel Type - - - -
Features - - - Simultaneous Sampling
Series - - - -

MAX3002EUP+T Datasheet PDF

Download MAX3002EUP+T pdf datasheets and Analog Devices Inc./Maxim Integrated documentation for MAX3002EUP+T - Analog Devices Inc./Maxim Integrated.

Datasheets
MAX3000E-01E, MAX3002-12.pdf
Environmental Information
Maxim Integrated REACH.pdf Maxim Integrated RoHS Cert.pdf Red Phosphorous Certificate.pdf
Part Numbering Guide
Part Numbering System.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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MAX3002EUP+T Image

MAX3002EUP+T

Analog Devices Inc./Maxim Integrated
32D-MAX3002EUP+T

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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