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HomeProductsIntegrated Circuits (ICs)Interface - Analog Switches, Multiplexers, DemultiplexersMAX4711CSE
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MAX4711CSE - Analog Devices Inc./Maxim Integrated

Manufacturer Part Number
MAX4711CSE
Manufacturer
Maxim Integrated
Allelco Part Number
32D-MAX4711CSE
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
16,640 pcs available, New & Original
Parts Description
IC SWITCH SPST-NCX4 25OHM 16SOIC
Package
16-SOIC
Data sheet
MAX4711CSE.pdf

Datasheets

MAX4711-13.pdf

Part Numbering Guide

Part Numbering System.pdf
RoHs Status
 
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Specifications

MAX4711CSE Tech Specifications
Analog Devices Inc./Maxim Integrated - MAX4711CSE technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc./Maxim Integrated - MAX4711CSE

Product Attribute Attribute Value
Manufacturer Maxim Integrated
Voltage - Supply, Single (V+) 2.7V ~ 11V
Voltage - Supply, Dual (V±) ±2.7V ~ 5.5V
Switch Time (Ton, Toff) (Max) 125ns, 80ns
Switch Circuit SPST - NC
Supplier Device Package 16-SOIC
Series -
Package / Case 16-SOIC (0.154", 3.90mm Width)
Package Tube
Operating Temperature 0°C ~ 70°C (TA)
On-State Resistance (Max) 25Ohm
Product Attribute Attribute Value
Number of Circuits 4
Multiplexer/Demultiplexer Circuit 1:1
Mounting Type Surface Mount
Current - Leakage (IS(off)) (Max) 500pA
Crosstalk -87dB @ 1MHz
Charge Injection 25pC
Channel-to-Channel Matching (ΔRon) 200mOhm
Channel Capacitance (CS(off), CD(off)) 8pF, 8pF
Base Product Number MAX4711
-3db Bandwidth -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

MAX4711CSE Image
MAX4711CSE (1)

Manufacturer Part Number

MAX4711CSE

Manufacturer

analog-devices

Introduction

The MAX4711CSE is a quad, single-pole, single-throw (SPST), normally-closed analog switch from Analog Devices. It offers high-speed switching performance, low on-resistance, and low charge injection, making it suitable for a wide range of applications, including data acquisition, test and measurement, and audio/video signal routing.

Product Features and Performance

4 independent SPST analog switches

Low on-resistance: 25Ω maximum

Low on-resistance matching: 200mΩ typical

Fast switching speed: 125ns max turn-on, 80ns max turn-off

Low charge injection: 25pC typical

Wide supply voltage range: 2.7V to 11V single-supply or ±2.7V to ±5.5V dual-supply

Low leakage current: 500pA maximum

Low crosstalk: -87dB @ 1MHz

Operating temperature range: 0°C to 70°C

Product Advantages

Compact, space-saving 16-SOIC package

Ideal for applications requiring high-speed, low-distortion analog switching

Robust design with high reliability and long lifespan

Key Reasons to Choose This Product

Exceptional switching performance with low on-resistance and fast switching speeds

Wide operating voltage range and low power consumption make it suitable for a variety of applications

Reliable and durable design ensures long-lasting performance

Cost-effective solution for high-speed analog signal switching needs

Quality and Safety Features

Manufactured using Analog Devices' high-quality semiconductor processes

Meets industry safety and reliability standards

Compatibility

The MAX4711CSE is compatible with a wide range of electronic systems and devices that require high-speed, low-distortion analog signal switching.

Application Areas

Data acquisition systems

Test and measurement equipment

Audio and video signal routing

Industrial control systems

Instrumentation and medical equipment

Product Lifecycle

The MAX4711CSE is an obsolete product, meaning it is no longer in active production. However, there are several alternative products available from Analog Devices that offer similar or improved performance characteristics. Customers are advised to contact our website's sales team for more information on suitable replacement options.

Frequently Asked Questions(FAQ)

How does the MAX4711CSE’s on-state resistance compare to similar SPST-NC switch ICs in the same voltage range, and what implications does this have for signal integrity in low-impedance applications?
The MAX4711CSE features a maximum on-state resistance of 25Ω per channel, which is relatively high compared to precision analog switches like the ADG819 (typically 0.5Ω) but aligns with general-purpose multiplexers such as the TS3USB221A (around 0.6Ω). However, its 25Ω Ron introduces significant signal attenuation in high-current or low-impedance paths—for example, a 10mA current through a single channel would drop 250mV across the switch, potentially exceeding acceptable thresholds in precision measurement circuits. This makes the MAX4711CSE better suited for buffering or routing signals where moderate loading is acceptable, rather than direct drive of sensitive loads. When cascading multiple channels, cumulative resistance increases further, compounding voltage drops.
What are the key timing characteristics of the MAX4711CSE, and how do Ton and Toff values influence system-level performance in high-speed switching environments?
The MAX4711CSE has a maximum turn-on time (Ton) of 125ns and turn-off time (Toff) of 80ns, indicating asymmetric response due to internal charge pump dynamics. This asymmetry suggests that the device prioritizes fast disconnection during turn-off, which helps reduce glitching in analog signal chains. In a 1MHz switching scenario, one full cycle requires 1µs, leaving only ~795ns for stable conduction; thus, the device can support up to ~8kHz effective switching without overlapping transitions. For applications requiring sub-100ns settling to final value (e.g., ADC sampling), the total acquisition window must exceed Ton + Toff plus any required settling margin, making the MAX4711CSE suitable for moderate-speed signal routing but not ideal for nanosecond-precision gating.
Given its leakage current and off-state capacitance, what impact does the MAX4711CSE have on signal isolation in high-impedance sensor interfaces?
With a maximum off-state leakage current of 500pA and channel capacitance of 8pF per input/output, the MAX4711CSE exhibits poor isolation in high-resistance networks. In a 1MΩ source impedance environment, 500pA of leakage equates to a 0.5V offset error—substantial in microvolt-scale measurements. Additionally, the 8pF capacitance forms an RC low-pass filter with the source impedance, creating a -3dB corner at approximately 20kHz (1/(2π×1MΩ×8pF)). This limits bandwidth in DC-coupled, high-Z sensing applications and introduces phase lag. While crosstalk is rated at -87dB @ 1MHz, this assumes complementary signal levels and clean power rails; real-world parasitics often degrade performance beyond datasheet claims.
Can the MAX4711CSE be used in bidirectional analog signal routing, and if so, what design considerations apply regarding channel matching and crosstalk?
Although the MAX4711CSE supports bidirectional operation via its SPST-NC topology, it is not optimized for true bidirectional analog switching. Each channel routes from one pin to another in a fixed direction unless external diodes or level shifting are added. More critically, the channel-to-channel resistance mismatch is 200mΩ, meaning one channel may conduct 0.8% more current than another under identical conditions—problematic in differential amplifier configurations or balanced signal paths. Crosstalk at -87dB @ 1MHz implies minimal interference between adjacent channels when driven with opposing signals, but this degrades near resonance points of PCB traces or package parasitics. Therefore, while usable in unidirectional routing, careful layout and calibration are essential for multi-channel systems.
How does the operating temperature range of the MAX4711CSE affect long-term reliability in industrial versus commercial applications?
The MAX4711CSE operates from 0°C to 70°C, which aligns with standard commercial grade but falls short of industrial (-40°C to +85°C) requirements. At elevated temperatures near 70°C, semiconductor parameters drift: leakage currents increase exponentially, and contact resistance may rise due to oxide layer effects. For instance, at 70°C, the 500pA leakage could double, exacerbating errors in high-impedance circuits. In sealed or thermally stressed enclosures where ambient exceeds 55°C, derating becomes necessary. Consequently, the MAX4711CSE is best deployed in controlled environments or where thermal management maintains junction temperatures below 60°C to ensure consistent performance over time.
What are the limitations of using the MAX4711CSE in battery-powered systems, particularly regarding power consumption and supply voltage scaling?
Operating from a single supply of 2.7V to 11V, the MAX4711CSE consumes quiescent current typically around 1µA, which is favorable for low-power designs. However, the 11V upper limit restricts use in modern lithium-ion systems (nominal 3.7V, max 4.2V charging), as exceeding 4.2V risks damaging the IC unless regulated. Moreover, at lower supplies like 3.0V, the internal charge pump may struggle to generate sufficient gate drive, increasing Ron variability and reducing linearity. In sleep-mode dominated systems, the static current dominates total consumption; thus, disabling unused channels or using enable pins (if available) improves efficiency. The absence of shutdown mode means continuous draw even when idle, limiting suitability for ultra-low-power IoT endpoints.
How does charge injection in the MAX4711CSE affect data converters, and what mitigation strategies exist during sample-and-hold transitions?
Charge injection of 25pC occurs during switching events as charge stored in parasitic capacitances is dumped into the load. When driving a 10kΩ resistor to ground, this appears as a transient voltage spike of V = Q/C_eq, where C_eq includes load and sampling capacitor. For a 100pF ADC input, 25pC creates a 0.25V glitch, potentially corrupting the first sampled point. In successive-approximation ADCs with 12-bit resolution, this corresponds to ~3 LSB error at full scale. To mitigate, designers often insert a dummy switch to precharge the node before actual conversion, or use higher-order anti-aliasing filters. Alternatively, delaying the ADC strobe by one switching period allows transients to settle. The MAX4711CSE’s relatively high charge injection necessitates such precautions in precision acquisition systems.
What packaging-related challenges arise when integrating the MAX4711CSE into dense PCBs, and how does MSL rating inform handling procedures?
As a 16-pin SOIC in a 3.9mm-wide package, the MAX4711CSE occupies moderate footprint space but shares thermal and electrical characteristics typical of surface-mount discretes. Its Moisture Sensitivity Level (MSL) of 1 indicates unlimited shelf life and no bake requirement prior to reflow, simplifying manufacturing logistics. However, the narrow lead pitch (1.27mm center-to-center) demands precise pick-and-place alignment to avoid bridging, especially in high-volume assembly. The exposed pad (if present) should be soldered to a thermal plane to manage junction temperature, though the MAX4711CSE lacks explicit thermal enhancement features. Careful stencil design and nitrogen reflow profiling minimize voiding and improve solder joint reliability in automated lines.
Are there substitute parts for the MAX4711CSE, and how do they compare in terms of key parameters like Ron, speed, and supply range?
Substitutes include the MAX4711CSE+, which is functionally identical but RoHS-compliant. Other potential alternatives are limited due to the specific 2.7V–11V rail-to-rail input capability and 4-channel architecture. Candidates like the DG444 (from Analog Devices) offer similar specs but span ±5V dual supplies and have lower Ron (~70Ω), making them less suitable for low-voltage single-supply designs. The TS3A3359DBR (TI) provides lower leakage and better ESD protection but lacks integrated charge pumps and operates down to 1.65V. Thus, while substitutes exist, none match the exact combination of voltage range, channel count, and switching performance offered by the MAX4711CSE without trade-offs.
How does the lack of integrated protection features in the MAX4711CSE impact robustness in automotive or harsh-environment deployments?
Unlike newer switches with ESD diodes to IEC 61000-4-2 Level 4, the MAX4711CSE relies solely on its internal structure for electrostatic discharge protection, which typically caps out at ±2kV HBM. In industrial settings with inductive loads, back-EMF from relays or motors can induce voltages beyond this threshold, risking latchup or failure. Without overvoltage clamping, connecting a 24V line to a 3.3V microcontroller rail through this switch could permanently damage the IC. Designers must implement external TVS diodes or series resistors with clamping circuits to meet functional safety standards. This omission increases BOM cost and complexity in non-regulated environments, reducing the device’s suitability for mission-critical systems without additional shielding.
What role does the base product number MAX4711 play in inventory planning and legacy system maintenance?
The base product number MAX4711 encompasses all variants including suffixes like “CSE+”, “ETP”, or “T”, which differ only in packaging, temperature grade, or compliance marking. Recognizing this allows engineers to source equivalent devices interchangeably in prototyping, avoiding part-number proliferation. However, subtle differences—such as the MAX4711CSE’s RoHS non-compliance—can block adoption in EU-based projects. Inventory managers benefit from tracking the base number to forecast obsolescence, while procurement teams must verify exact suffix requirements to prevent mismatches. This abstraction simplifies long-term platform stability but requires rigorous documentation to ensure traceability across revisions.
In what scenarios would the MAX4711CSE outperform discrete transistor-based analog switches, and vice versa?
The MAX4711CSE excels in compact, integrated solutions requiring four independent switches with matched timing and simplified control logic. Compared to building switches from MOSFETs and drivers, it reduces board area, component count, and design effort—ideal for test equipment multiplexing or legacy interface expansion. Discrete implementations offer superior Ron (down to milliohms), faster switching (nanoseconds), and wider voltage ranges (up to 100V), but consume more space and require biasing networks. The MAX4711CSE trades peak performance for integration density and ease of use, making it preferable in space-constrained, moderate-speed applications where consistency across four channels outweighs raw metrics.
How does the absence of bandwidth specification (-3dB) in the MAX4711CSE datasheet constrain its use in RF or high-frequency signal paths?
The missing -3dB bandwidth figure indicates the device is not characterized for AC performance above DC to low-kHz frequencies. Realistically, due to parasitic inductance and capacitance in the SOIC package and internal layout, usable bandwidth rarely exceeds 100kHz–1MHz, even if propagation delay appears benign. At 100kHz sine waves, insertion loss may reach several dB, degrading SNR in audio or sensor signals. For RF applications (>1MHz), the MAX4711CSE is inappropriate regardless of crosstalk claims, which assume small-signal conditions and ideal termination. Designers should treat it as DC-optimized, and any AC routing should be verified empirically with network analysis to confirm acceptable return loss and flatness.
What considerations apply when cascading multiple MAX4711CSE devices to achieve eight or sixteen channels?
Cascading two MAX4711CSE chips doubles channel count but compounds timing skew: if each has 125ns Ton variation, worst-case skew between channels across both ICs reaches 250ns. This misalignment distorts time-division multiplexed signals or interferes with synchronous sampling. Power sequencing also becomes critical—both devices draw 1µA continuously, totaling 2µA, but simultaneous switching can cause transient spikes on shared VCC unless bypass capacitors are sized appropriately. Layout symmetry is paramount to maintain channel matching within 200mΩ delta. Ultimately, while possible, cascading increases complexity and risk, suggesting evaluation of monolithic 8-channel alternatives like the ADG738 for future designs.
How does the MAX4711CSE’s charge injection interact with switched-capacitor circuits, and what circuit techniques reduce its adverse effects?
In switched-capacitor integrators or sample-and-hold stages, charge injection directly contaminates the sampled voltage. A 25pC injection into a 1nF integration capacitor yields a 25mV error—significant in high-gain amplifiers. Techniques like bootstrapped switches or transmission gates isolate injection paths, but the MAX4711CSE lacks such features. Practical mitigation includes adding a hold capacitor larger than the injection-induced charge (e.g., 10× larger), using correlated double sampling to subtract offsets digitally, or inserting a buffer stage to decouple capacitive loading. Alternatively, interleaving switching phases minimizes net injection during critical windows. These methods add latency or circuitry but preserve accuracy in precision analog frontends.
What are the implications of the MAX4711CSE’s RoHS non-compliance status for global market deployment and regulatory audits?
RoHS non-compliance means the device contains restricted substances like lead in excess of 0.1% by weight, blocking sale into European Union markets under Directive 2011/65/EU. Even if technically functional, inclusion of the MAX4711CSE in end products destined for CE marking requires substitution or exemption justification, which is increasingly difficult for consumer electronics. Manufacturers must maintain separate inventory streams and document usage carefully to avoid accidental shipments. While acceptable in non-EU regions (e.g., North America), this limitation reduces supply chain flexibility and complicates global sourcing strategies. Transitioning to compliant variants like the MAX4711CSE+ is advisable for new designs targeting worldwide distribution.

Parts with Similar Specifications

The three parts on the right have similar specifications to Analog Devices Inc./Maxim Integrated MAX4711CSE

Product Attribute MAX4711CSE+ MAX4711CSE+T MAX4711CUE+ MAX4711ESE
Part Number MAX4711CSE+ MAX4711CSE+T MAX4711CUE+ MAX4711ESE
Manufacturer Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated
Switch Time (Ton, Toff) (Max) - - - -
-3db Bandwidth - - - -
Channel Capacitance (CS(off), CD(off)) - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
On-State Resistance (Max) - - - -
Multiplexer/Demultiplexer Circuit - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Circuits - - - -
Voltage - Supply, Single (V+) - - - -
Channel-to-Channel Matching (ΔRon) - - - -
Switch Circuit - - - -
Series - - - -
Voltage - Supply, Dual (V±) - - - -
Charge Injection - - - -
Crosstalk - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Current - Leakage (IS(off)) (Max) - - - -

MAX4711CSE Datasheet PDF

Download MAX4711CSE pdf datasheets and Analog Devices Inc./Maxim Integrated documentation for MAX4711CSE - Analog Devices Inc./Maxim Integrated.

Datasheets
MAX4711-13.pdf
Environmental Information
Maxim Integrated REACH.pdf Maxim Integrated RoHS Cert.pdf
Part Numbering Guide
Part Numbering System.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

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MAX4711CSE Image

MAX4711CSE

Analog Devices Inc./Maxim Integrated
32D-MAX4711CSE

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