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HomeProductsIntegrated Circuits (ICs)Embedded - Microcontroller, Microprocessor, FPGA ModulesSOMDM3730-32-1780AKIR
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SOMDM3730-32-1780AKIR - Beacon EmbeddedWorks

Manufacturer Part Number
SOMDM3730-32-1780AKIR
Manufacturer
Beacon EmbeddedWorks
Allelco Part Number
98D-SOMDM3730-32-1780AKIR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,406 pcs available, New & Original
Parts Description
IC MOD CORTEX-A8 800MHZ 256MB
Package
Bulk
Data sheet
SOMDM3730-32-17.pdf

PCN Design/Specification

Current Standard Model Jun/2015.pdf

PCN Obsolescence/ EOL

SOMDM3730 18/Oct/2016.pdf
RoHs Status
 
Our certification
In stock: 17406

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Quantity

Specifications

SOMDM3730-32-1780AKIR Tech Specifications
Beacon EmbeddedWorks - SOMDM3730-32-1780AKIR technical specifications, attributes, parameters and parts with similar specifications to Beacon EmbeddedWorks - SOMDM3730-32-1780AKIR

Product Attribute Attribute Value
Manufacturer Beacon EmbeddedWorks
Speed 800MHz
Size / Dimension 0.590" L x 1.300" W (15.00mm x 33.00mm)
Series DM37x
RAM Size 256MB
Package Bulk
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C
Module/Board Type MPU, DSP Core
Flash Size 512MB
Core Processor ARM® Cortex®-A8, DM3730
Connector Type Board-to-Board (BTB) Socket - 200
Co-Processor TMS320C64x (DSP)

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN 5A002A1 LOG
HTSUS 8473.30.1180

Frequently Asked Questions(FAQ)

What are the key performance characteristics of the SOMDM3730-32-1780AKIR that influence its suitability for real-time embedded systems requiring high computational throughput?
The SOMDM3730-32-1780AKIR combines an ARM® Cortex®-A8 application processor running at 800MHz with a TMS320C64x DSP core, enabling simultaneous execution of control logic and signal processing tasks. This heterogeneous architecture allows efficient offloading of digital signal processing workloads from the main CPU, which is particularly beneficial in applications such as motor control, audio/video processing, or sensor fusion. With 256MB of RAM and 512MB of flash storage, it provides sufficient memory bandwidth and persistent storage for complex firmware and data logging. The module’s compact form factor—15mm x 33mm—and board-to-board (BTB) socket interface make it suitable for space-constrained designs while maintaining reliable connectivity.
How does the operating temperature range of the SOMDM3730-32-1780AKIR impact deployment in industrial versus consumer environments?
The SOMDM3730-32-1780AKIR supports an operating temperature range from -40°C to +85°C, which aligns with industrial-grade specifications rather than typical commercial-grade components limited to 0°C–70°C. This extended range ensures stable operation in harsh environments such as automotive control units, outdoor monitoring devices, or factory automation equipment exposed to thermal cycling or elevated ambient temperatures. In contrast, consumer electronics often operate within narrower thermal bounds and may not require such robustness, making this module overqualified but potentially more reliable in long-lifecycle deployments.
When selecting between the SOMDM3730-32-1780AKIR and other DM37x-based modules, what factors should engineers prioritize if power efficiency is a critical constraint?
While the SOMDM3730-32-1780AKIR delivers strong computational performance, its dual-core architecture consumes relatively higher power compared to single-core alternatives like the OMAP35x series. Engineers prioritizing low-power operation should evaluate whether the integrated DSP functionality justifies the additional energy draw. For battery-powered or thermally constrained applications, alternative modules with dynamic voltage/frequency scaling or lower standby currents might be preferable unless the dedicated C64x DSP is essential for real-time task handling.
Can the SOMDM3730-32-1780AKIR support Linux-based development workflows, and what considerations apply when porting existing BSPs?
Yes, the SOMDM3730-32-1780AKIR typically runs Linux distributions optimized for TI’s DM37x SoCs, including Angstrom, Ubuntu Core, or custom Yocto builds. Porting requires verifying kernel compatibility with the specific flash layout, DDR configuration, and peripheral pin muxing. Engineers must ensure that bootloaders (e.g., MLO, u-boot) are configured correctly for the 512MB NAND flash and that device tree overlays account for carrier board-specific interfaces such as I2C, SPI, or camera serial interfaces. Lack of proper BSP support can lead to boot failures or unstable peripheral operation.
What are the implications of using the SOMDM3730-32-1780AKIR in safety-critical applications requiring functional certification?
The SOMDM3730-32-1780AKIR lacks built-in safety features such as lockstep cores, ECC-protected memory controllers, or ASIL-compliant design practices required by standards like ISO 26262 or IEC 61508. Its general-purpose architecture assumes software-level fault tolerance rather than hardware-enforced safety mechanisms. Therefore, deploying this module in safety-critical systems demands extensive software validation, watchdog management, redundancy strategies, and formal verification—adding significant development overhead and certification complexity.
How does the memory configuration of the SOMDM3730-32-1780AKIR compare to newer AM57xx-based modules in terms of scalability for future-proofing designs?
Compared to AM57xx series modules offering up to 2GB RAM and dual ARM Cortex-A15 cores, the SOMDM3730-32-1780AKIR’s 256MB RAM and single Cortex-A8 core represent a generational step down in memory capacity and processing headroom. While adequate for many mid-tier embedded applications today, projects anticipating long product lifecycles or feature expansion may find the limited RAM a bottleneck for multitasking, large datasets, or containerized workloads. Designers should assess projected software growth against available resources before committing to the SOMDM3730-32-1780AKIR.
What challenges arise when interfacing the SOMDM3730-32-1780AKIR with high-speed peripherals like HDMI or USB 3.0 due to its legacy architecture?
Although the DM3730 includes native support for HDMI output and USB 2.0, it does not support USB 3.0 or advanced display protocols requiring high-bandwidth data transfers. Attempting to connect external USB 3.0 devices or high-resolution HDMI displays may result in bandwidth saturation or driver incompatibilities, as the underlying interconnect fabric was designed around older standards. Engineers targeting rich multimedia interfaces should consider whether the SOMDM3730-32-1780AKIR’s I/O capabilities meet their system requirements or if a more modern platform is necessary.
How does moisture sensitivity level (MSL) rating affect handling procedures for the SOMDM3730-32-1780AKIR during manufacturing or field servicing?
The SOMDM3730-32-1780AKIR has an MSL rating of 1, indicating unlimited shelf life under standard storage conditions without requiring bake-out prior to use. This simplifies logistics and assembly planning, as the component can be stored indefinitely in dry environments without degradation risks. However, once removed from its protective packaging, it remains sensitive to humidity during soldering; standard JEDEC guidelines still apply during reflow processes to prevent moisture-induced delamination or popcorning.

Parts with Similar Specifications

The three parts on the right have similar specifications to Beacon EmbeddedWorks SOMDM3730-32-1780AKIR

Product Attribute SOMDM3730-31-1780AKIR SOMDM3730-32-1880AKIR SOMDM3730-30-1780AKIR SOMDM3730-31-1880AKIR
Part Number SOMDM3730-31-1780AKIR SOMDM3730-32-1880AKIR SOMDM3730-30-1780AKIR SOMDM3730-31-1880AKIR
Manufacturer Beacon EmbeddedWorks Beacon EmbeddedWorks Beacon EmbeddedWorks Beacon EmbeddedWorks
Co-Processor - - - -
Core Processor - - - -
RAM Size - - - -
Speed - - - -
Connector Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Size / Dimension - - - -
Flash Size - - - -
Series - - - -
Module/Board Type - - - -

SOMDM3730-32-1780AKIR Datasheet PDF

Download SOMDM3730-32-1780AKIR pdf datasheets and Beacon EmbeddedWorks documentation for SOMDM3730-32-1780AKIR - Beacon EmbeddedWorks.

PCN Assembly/Origin
Current Standard Model Update 10/Nov/2015.pdf
PCN Design/Specification
Current Standard Model Jun/2015.pdf
PCN Obsolescence/ EOL
SOMDM3730 18/Oct/2016.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
Beacon EmbeddedWorks

SOMDM3730-32-1780AKIR

Beacon EmbeddedWorks
98D-SOMDM3730-32-1780AKIR

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