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Home Products Integrated Circuits (ICs)Embedded - Microcontroller, Microprocessor, FPGA Modules~~SOMDM3730-32-1880AKIR~~

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SOMDM3730-32-1880AKIR - Beacon EmbeddedWorks

Manufacturer Part Number: SOMDM3730-32-1880AKIR

Manufacturer: Beacon EmbeddedWorks

Allelco Part Number: 98D-SOMDM3730-32-1880AKIR

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 8,875 pcs available, New & Original

Parts Description: IC MOD CORTEX-A8 800MHZ 512MB

Package: Bulk

Data sheet: SOMDM3730-32-18.pdf

PCN Obsolescence/ EOL
SOMDM3730 OBS Nov/2015.pdf SOMDM3730 05/Oct/2018.pdf

PCN Design/Specification
Mult Dev Hardware/Label Rev Sep/2019.pdf Current Standard Model Jun/2015.pdf

PCN Assembly/Origin
2.73KHz.pdf

RoHs Status

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Our certification

In stock: 8875

Specifications

SOMDM3730-32-1880AKIR Tech Specifications
Beacon EmbeddedWorks - SOMDM3730-32-1880AKIR technical specifications, attributes, parameters and parts with similar specifications to Beacon EmbeddedWorks - SOMDM3730-32-1880AKIR

Product Attribute	Attribute Value
Manufacturer	Beacon EmbeddedWorks
Speed	800MHz
Size / Dimension	0.590' L x 1.300' W (15.00mm x 33.00mm)
Series	DM37x
RAM Size	512MB
Package	Bulk

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 85°C
Module/Board Type	MPU, DSP Core
Flash Size	512MB
Core Processor	ARM® Cortex®-A8, DM3730
Connector Type	Board-to-Board (BTB) Socket - 200
Co-Processor	TMS320C64x (DSP)

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	1 (Unlimited)
ECCN	5A002A1 LOG
HTSUS	8473.30.1180

Frequently Asked Questions(FAQ)

What are the key performance characteristics of the SOMDM3730-32-1880AKIR embedded module that make it suitable for industrial-grade applications?: The SOMDM3730-32-1880AKIR features a dual-core architecture combining an ARM® Cortex®-A8 processor and a TMS320C64x DSP core, both operating at 800MHz. With 512MB of flash memory and 512MB of RAM, it delivers sufficient computational bandwidth for real-time signal processing and control tasks. Its extended operating temperature range from -40°C to 85°C ensures reliable operation in harsh environments, while RoHS compliance supports global regulatory requirements. These attributes collectively enable deployment in industrial automation, medical instrumentation, and transportation systems where reliability and thermal resilience are critical.

How does the memory configuration of the SOMDM3730-32-1880AKIR compare to alternative models like the SOMDM3730-32-2780AKCR in terms of system throughput and application suitability?: Both the SOMDM3730-32-1880AKIR and its substitute SOMDM3730-32-2780AKCR share identical memory sizes—512MB flash and 512MB RAM—and core processor specifications. However, the SOMDM3730-32-1880AKIR operates at a higher clock speed (800MHz vs. typically lower variants), resulting in improved instruction execution rates and faster data throughput. This makes the SOMDM3730-32-1880AKIR more appropriate for latency-sensitive or computationally intensive applications such as video encoding or motor control algorithms, whereas the substitute may suffice for less demanding embedded workloads.

What considerations should be made when integrating the SOMDM3730-32-1880AKIR into a compact board design due to its physical dimensions and connector interface?: The SOMDM3730-32-1880AKIR measures 15.00mm x 33.00mm and uses a 200-pin Board-to-Board (BTB) socket connector. These form factors demand careful layout planning to avoid interference with adjacent components and ensure adequate airflow given its passive cooling profile. Designers must allocate precise space within the system chassis and verify mechanical compatibility with the BTB interface, which is sensitive to misalignment during mating cycles. Thermal management becomes particularly important under sustained load due to limited surface area for heat dissipation.

Can the SOMDM3730-32-1880AKIR support real-time operating systems (RTOS) and what software stack implications arise from its dual-core architecture?: Yes, the SOMDM3730-32-1880AKIR can run RTOS platforms such as TI-RTOS, Linux with PREEMPT_RT patches, or Integrity OS. The co-processor—the TMS320C64x DSP—enables offloading deterministic tasks like digital filtering or sensor fusion onto dedicated hardware, freeing the ARM core for higher-level control logic. Developers must configure inter-processor communication mechanisms such as shared memory or message queues, increasing firmware complexity but enhancing system responsiveness and predictability.

What environmental certifications and handling precautions apply to the SOMDM3730-32-1880AKIR during manufacturing and field maintenance?: The SOMDM3730-32-1880AKIR carries RoHS compliance, indicating restriction of hazardous substances, and has an Moisture Sensitivity Level (MSL) of 1, meaning it can be stored indefinitely without baking before assembly. No special handling beyond standard ESD protocols is required. Additionally, its ECCN classification of 5A002A1 indicates export control relevance for certain end-use applications, necessitating compliance checks when deploying internationally.

How does the power consumption profile of the SOMDM3730-32-1880AKIR influence thermal design decisions in embedded systems?: Although exact power numbers aren't specified in public datasheets, the combination of high-speed processors (800MHz ARM and C64x cores) and dense memory implies significant dynamic power draw under active computation. Given the absence of integrated heatsinks or fans and the small footprint, designers must implement adequate PCB copper pour areas for heat spreading and consider airflow constraints in enclosures. Passive thermal solutions often require derating performance during continuous operation to prevent throttling or failure.

Is the SOMDM3730-32-1880AKIR compatible with legacy software developed for other DM37x modules, and what migration risks exist?: Software porting is generally feasible due to architectural continuity across DM37x family devices, including similar peripherals and boot sequences. However, timing-critical code relying on undocumented register behaviors or specific voltage thresholds may exhibit instability when moved to the SOMDM3730-32-1880AKIR. Validation through hardware-in-the-loop testing is essential, especially if transitioning from lower-performance derivatives like the SOMDM3730-32-2780AKCR, where cycle accuracy differences could affect algorithm output.

What role does the TMS320C64x DSP play in accelerating multimedia processing on the SOMDM3730-32-1880AKIR?: The integrated TMS320C64x DSP provides parallel arithmetic capabilities optimized for fixed-point operations, making it ideal for real-time video decoding, audio effects, or radar signal analysis. By handling these tasks independently from the main CPU, it reduces host load and improves frame rates in applications like surveillance cameras or industrial vision systems. Developers can leverage TI’s Code Composer Studio tools to partition workloads efficiently between the two cores while maintaining synchronization via hardware semaphores.

How does the 512MB RAM allocation on the SOMDM3730-32-1880AKIR impact multitasking scenarios compared to smaller-memory variants?: With 512MB of unified memory accessible by both the ARM and DSP cores, the SOMDM3730-32-1880AKIR supports larger datasets, longer running processes, and richer user interfaces than configurations with only 256MB. This enables smooth operation of multiple concurrent services—such as background logging, network streaming, and GUI rendering—without frequent swapping or buffer exhaustion. In contrast, reduced RAM limits concurrency and increases dependency on aggressive garbage collection or memory compression techniques.

Parts with Similar Specifications

The three parts on the right have similar specifications to Beacon EmbeddedWorks SOMDM3730-32-1880AKIR

Product Attribute
Part Number	SOMDM3730-32-1780AKIR	SOMDM3730-31-1880AKIR	SOMDM3730-30-1880AKIR	SOMDM3730-32-2880AKXR
Manufacturer	Beacon EmbeddedWorks	Beacon EmbeddedWorks	Beacon EmbeddedWorks	Beacon EmbeddedWorks
Co-Processor	-	-	-	-
Size / Dimension	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
RAM Size	-	-	-	-
Module/Board Type	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Core Processor	-	-	-	-
Flash Size	-	-	-	-
Connector Type	-	-	-	-
Speed	-	-	-	-
Series	-	-	-	-

SOMDM3730-32-1880AKIR Datasheet PDF

Download SOMDM3730-32-1880AKIR pdf datasheets and Beacon EmbeddedWorks documentation for SOMDM3730-32-1880AKIR - Beacon EmbeddedWorks.

PCN Obsolescence/ EOL: SOMDM3730 OBS Nov/2015.pdf SOMDM3730 05/Oct/2018.pdf
PCN Design/Specification: Mult Dev Hardware/Label Rev Sep/2019.pdf Current Standard Model Jun/2015.pdf
PCN Assembly/Origin: 2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

ECUb***h

Sep 22, 2026

Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
RS48***ieldTech

Sep 16, 2026

Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
Logi***b_Chris

Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
Circ***FixerTom

Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
Andr***PCBLab

Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
Leat***O'Keefe

Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
Indu***ialPower

Aug 17, 2026

Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.
Nikh***ech

Aug 13, 2026

Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

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ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
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