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HomeProductsIntegrated Circuits (ICs)Embedded - Microcontroller, Microprocessor, FPGA ModulesSOMDM3730-32-2880AKXR
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SOMDM3730-32-2880AKXR - Beacon EmbeddedWorks

Manufacturer Part Number
SOMDM3730-32-2880AKXR
Manufacturer
Beacon EmbeddedWorks
Allelco Part Number
98D-SOMDM3730-32-2880AKXR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,342 pcs available, New & Original
Parts Description
IC MOD CORTEX-A8 1GHZ 512MB
Package
Bulk
Data sheet
SOMDM3730-32-28.pdf

PCN Assembly/Origin

2.73KHz.pdf
RoHs Status
 
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In stock: 17342

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Specifications

SOMDM3730-32-2880AKXR Tech Specifications
Beacon EmbeddedWorks - SOMDM3730-32-2880AKXR technical specifications, attributes, parameters and parts with similar specifications to Beacon EmbeddedWorks - SOMDM3730-32-2880AKXR

Product Attribute Attribute Value
Manufacturer Beacon EmbeddedWorks
Speed 1GHz
Size / Dimension 0.590' L x 1.300' W (15.00mm x 33.00mm)
Series DM37x
RAM Size 512MB
Package Bulk
Product Attribute Attribute Value
Operating Temperature -40°C ~ 70°C
Module/Board Type MPU, DSP Core
Flash Size 512MB
Core Processor ARM® Cortex®-A8, DM3730
Connector Type Board-to-Board (BTB) Socket - 200
Co-Processor TMS320C64x (DSP)

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN 5A002A1 LOG
HTSUS 8473.30.1180

Frequently Asked Questions(FAQ)

How does the DM3730-32-2880AKXR compare to the SOMDM3730-32-2780AKCR in terms of memory capacity and operating frequency, and what design implications might this have for embedded system performance?
The SOMDM3730-32-2880AKXR operates at 1GHz with 512MB of RAM and 512MB of flash, while the substitute part SOMDM3730-32-2780AKCR has a slightly lower clock speed and potentially reduced memory bandwidth. This difference can affect real-time processing capabilities in DSP-heavy applications. When evaluating both modules for signal-intensive workloads, engineers should consider whether the marginal reduction in performance from the 2780 variant is acceptable given cost or availability advantages.
What are the thermal constraints when deploying the SOMDM3730-32-2880AKXR in an industrial environment, and how do these relate to its operating temperature range and power delivery requirements?
Although the module supports operation down to -40°C, sustained high-load conditions near 70°C may require careful layout planning around the 15mm x 33mm footprint to maintain stable performance. The ARM Cortex-A8 core draws significant current at 1GHz, so adequate decoupling and PCB thermal management are essential. Without proper heatsinking or airflow, junction temperatures could exceed safe limits during extended DSP co-processing tasks.
Can the DM3730-32-2880AKXR be used in automotive-grade applications despite not being explicitly labeled as such, and what modifications or validation steps would be required?
The component’s -40°C to 70°C commercial-grade rating falls short of most automotive specifications (typically AEC-Q100 Grade 2). While it may function temporarily in low-stress automotive edge nodes, long-term reliability under vibration, thermal cycling, or humidity would need rigorous testing beyond standard datasheet parameters. Engineers should treat it as unsuitable for primary vehicle control systems without additional environmental hardening.
How does the presence of a TMS320C64x DSP core alongside the ARM Cortex-A8 on the SOMDM3730-32-2880AKXR influence real-time task scheduling in mixed-signal applications?
The dual-core architecture enables offloading deterministic DSP tasks—such as filter banks or FFT computations—to the C64x, freeing the Cortex-A8 for Linux-based control logic. In practice, latency-sensitive operations like audio decoding or sensor fusion benefit significantly from this split, but requires careful synchronization via shared memory or message queues. Mismanagement can lead to buffer underruns or priority inversion if inter-process communication isn't optimized.
What considerations apply when integrating the SOMDM3730-32-2880AKXR into a custom carrier board using its 200-pin BTB socket interface?
Signal integrity becomes critical due to the high-speed nature of the interconnect at 1GHz operation. Differential pairs and clock lines must follow strict length matching rules (<5mm skew), and impedance-controlled routing is recommended. Additionally, power sequencing between the MPU and DSP domains should adhere to the reference design to avoid brownout resets during boot-up.
Is the 512MB DDR3 memory on the DM3730-32-2880AKXR expandable, and what limitations exist regarding memory upgrade or replacement?
No, the 512MB RAM is soldered directly onto the module and cannot be upgraded post-manufacture. Attempting to modify it would void warranty and risk damaging the BGA package. Designers must account for peak memory demands during initial development, including OS overhead, application buffers, and DMA allocations, which collectively consume a substantial portion of available bandwidth at full utilization.
How does the MSL rating of 1 for the SOMDM3730-32-2880AKXR affect handling procedures during prototyping versus high-volume assembly?
With unlimited shelf life and no time constraint after opening, this module simplifies inventory management and rework processes common in prototyping phases. However, during reflow soldering, operators must still follow standard JEDEC guidelines for moisture exposure to prevent popcorn cracking, even though the device itself is not moisture-sensitive per MSL 1.
What role does ECCN 5A002A1 play when sourcing or exporting components like the DM3730-32-2880AKXR for international projects?
This export classification indicates compliance with U.S. regulations for encryption commodities, requiring end-user declarations for certain jurisdictions. It signals that the device contains programmable logic capable of cryptographic functions through its ARM Cortex-A8 and integrated peripherals. Importers in restricted regions may need special licenses depending on intended use case.
Can the DM3730-32-2880AKXR support Linux-based frameworks like Yocto or Buildroot effectively, and what driver challenges might arise?
Yes, the Cortex-A8 runs Linux efficiently with sufficient RAM, but achieving optimal performance demands customized kernel configurations tailored to the DM37x SoC’s specific peripherals. Missing drivers for onboard interfaces—such as I2S for audio or CSI-2 for camera input—can delay bring-up unless validated reference boards or SDKs are leveraged early in the porting process.
How does the absence of detailed packaging information impact PCB footprint design for the SOMDM3730-32-2880AKXR, and what precautions should be taken?
Since packaging details are unspecified, engineers must rely on mechanical drawings from Beacon EmbeddedWorks rather than assume standard QFP or BGA layouts. The stated dimensions—0.59" x 1.30"—are crucial for enclosure compatibility, but pin-out alignment and mounting hardware must match the actual board-to-board connector type to ensure reliable mating during repeated insertion cycles.
What performance degradation should be expected if the DM3730-32-2880AKXR operates continuously at maximum load in ambient temperatures approaching 60°C?
At sustained loads above 80% CPU usage with ambient temperatures near 60°C, thermal throttling may occur due to the Cortex-A8’s governor reducing frequency to prevent overheating. This can manifest as dropped frames in video pipelines or delayed interrupt responses. Monitoring tools like `cpufreq` on Linux will show frequency scaling events, indicating that passive cooling alone may not suffice for continuous peak workloads.
Are there any known issues with the 512MB flash storage on the SOMDM3730-32-2880AKXR when used with wear-leveling algorithms in industrial logging applications?
Flash endurance (~10k write cycles) is sufficient for moderate logging scenarios, but aggressive wear-leveling strategies without proper block management can accelerate failure. For applications writing frequently to small files, implementing journaling or buffering data in RAM before bulk writes extends lifespan significantly. Failure modes typically appear as corrupted sectors rather than complete outages.

Parts with Similar Specifications

The three parts on the right have similar specifications to Beacon EmbeddedWorks SOMDM3730-32-2880AKXR

Product Attribute SOMDM3730-31-2880AKXR SOMDM3730-32-1880AKIR SOMDM3730-32-2780AKCR SOMDM3730-31-1880AKIR
Part Number SOMDM3730-31-2880AKXR SOMDM3730-32-1880AKIR SOMDM3730-32-2780AKCR SOMDM3730-31-1880AKIR
Manufacturer Beacon EmbeddedWorks Beacon EmbeddedWorks Beacon EmbeddedWorks Beacon EmbeddedWorks
RAM Size - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Speed - - - -
Core Processor - - - -
Co-Processor - - - -
Flash Size - - - -
Module/Board Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Connector Type - - - -
Size / Dimension - - - -
Series - - - -

SOMDM3730-32-2880AKXR Datasheet PDF

Download SOMDM3730-32-2880AKXR pdf datasheets and Beacon EmbeddedWorks documentation for SOMDM3730-32-2880AKXR - Beacon EmbeddedWorks.

PCN Obsolescence/ EOL
SOMDM3730 OBS Nov/2015.pdf SOMDM3730 05/Oct/2018.pdf
PCN Design/Specification
Mult Dev Hardware/Label Rev Sep/2019.pdf SOMDM3730 HW Rev 21/Dec/2021.pdf
PCN Assembly/Origin
2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Delivery Method

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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  • Packaging
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QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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  • ISO 9001: 2015
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SOMDM3730-32-2880AKXR Image

SOMDM3730-32-2880AKXR

Beacon EmbeddedWorks
98D-SOMDM3730-32-2880AKXR

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