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HomeProductsIntegrated Circuits (ICs)Embedded - Microcontroller, Microprocessor, FPGA ModulesSOMLX800-11-000GC
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SOMLX800-11-000GC - Beacon EmbeddedWorks

Manufacturer Part Number
SOMLX800-11-000GC
Manufacturer
Beacon EmbeddedWorks
Allelco Part Number
98D-SOMLX800-11-000GC
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
6,374 pcs available, New & Original
Parts Description
IC MODULE GEODE LX800 500MHZ
Package
Data sheet
SOMLX800-11-000.pdf
RoHs Status
 
Our certification
In stock: 6374

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Quantity

Specifications

SOMLX800-11-000GC Tech Specifications
Beacon EmbeddedWorks - SOMLX800-11-000GC technical specifications, attributes, parameters and parts with similar specifications to Beacon EmbeddedWorks - SOMLX800-11-000GC

Product Attribute Attribute Value
Manufacturer Beacon EmbeddedWorks
Speed 500MHz
Size / Dimension 3.780' L x 4.530' W (96.00mm x 115.00mm)
Series -
RAM Size -
Operating Temperature 0°C ~ 70°C
Product Attribute Attribute Value
Module/Board Type MPU Core
Flash Size -
Core Processor Geode, LX 800
Connector Type -
Co-Processor -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN 4A994B
HTSUS 8471.41.0150

Frequently Asked Questions(FAQ)

What are the thermal constraints for integrating the SOMLX800-11-000GC into an industrial control system operating in a hot ambient environment?
The SOMLX800-11-000GC is rated for operation from 0°C to 70°C, which limits its use in high-heat industrial settings without supplemental cooling. At sustained ambient temperatures approaching 65°C, the module's internal components may experience elevated junction temperatures, potentially reducing long-term reliability or triggering thermal throttling of the Geode LX800 processor. Designers must ensure adequate airflow or heatsinking if the enclosure exceeds 55°C under full load. Passive cooling alone may suffice below 40°C ambient, but active ventilation becomes necessary near the upper limit.
How does the lack of flash memory impact firmware update strategies when using the SOMLX800-11-000GC in remote embedded devices?
With no on-chip flash storage, the SOMLX800-11-000GC relies entirely on external persistent storage for firmware execution and updates. This necessitates a robust bootloader capable of loading code from external NOR or NAND flash via parallel or serial interfaces. Firmware updates must be staged carefully to avoid corruption—typically through a dual-bank architecture or fail-safe rollback mechanism. Remote updates require secure communication protocols and validation steps, increasing system complexity compared to integrated-flash solutions.
In what scenarios would the SOMLX800-11-000GC be preferred over ARM-based SoCs like the i.MX6 or Zynq-7000 series despite its lower power efficiency?
The SOMLX800-11-000GC may be chosen where legacy x86 compatibility is non-negotiable, such as in retrofitting older industrial PCs or running specialized Windows Embedded applications that cannot be ported. Its mature BIOS support and broad driver availability for peripheral chips also reduce integration risk in time-sensitive projects. While ARM alternatives offer better power-to-performance ratios, the Geode’s instruction set and software ecosystem can justify its use in cost-constrained, thermally limited environments with deterministic latency requirements.
What considerations apply when selecting external RAM for the SOMLX800-11-000GC to meet real-time performance demands?
Since the SOMLX800-11-000GC lacks internal RAM, designers must pair it with low-latency SDRAM or DDR memory compliant with the LX800’s memory controller specifications. For real-time systems, minimizing CAS latency and ensuring stable timing margins under temperature drift is critical. A typical configuration might use 512MB–1GB of PC133 SDRAM with tight row-cycle times; exceeding 70°C ambient can degrade signal integrity, so layout symmetry and impedance control become essential to maintain reliable access within microsecond-scale deadlines.
How does RoHS non-compliance affect procurement planning for the SOMLX800-11-000GC in regulated markets?
The SOMLX800-11-000GC’s RoHS non-compliance means it contains restricted substances such as lead in solder or certain brominated flame retardants, making it unsuitable for new designs targeting EU or California markets without exemptions. Procurement teams must verify whether their application qualifies under Category 9 exceptions for embedded computing modules. If not, sourcing alternatives or obtaining supplier documentation for end-of-life transitions becomes necessary to avoid customs delays or product bans during compliance audits.
Can the SOMLX800-11-000GC drive multiple high-resolution displays simultaneously in a multi-monitor control panel setup?
The Geode LX800 supports up to two independent video outputs via its integrated graphics core, typically LVDS and VGA or composite analog signals. Driving two 1920x1200 displays at 60Hz would exceed the LX800’s pixel throughput (~800 Mpixels/sec), limiting practical resolution to one 1920x1200 display plus another lower-resolution output. For true multi-monitor support beyond basic signage, an external GPU or display controller chip would be required, adding board complexity and power consumption.
What are the implications of the SOMLX800-11-000GC’s large physical footprint (96mm x 115mm) on mechanical design integration?
The SOMLX800-11-000GC’s size makes it suitable for desktop or rack-mounted systems but challenging for space-constrained enclosures like handheld terminals. Mounting requires careful PCB standoff placement to avoid stress on connectors and solder joints during vibration. Thermal expansion between the module and carrier board must be managed to prevent delamination, especially near solder joints under repeated thermal cycling. Mechanical fixturing should distribute weight evenly across the four mounting holes to maintain contact with heatsinks or chassis rails.
How do moisture sensitivity levels (MSL 1) influence handling and storage logistics for the SOMLX800-11-000GC?
Classified as MSL 1, the SOMLX800-11-000GC has unlimited shelf life and does not require dry packaging before assembly, simplifying inventory management. However, this assumes unopened original packaging remains intact. Once exposed to ambient humidity during assembly, standard reflow profiles still apply, but prolonged exposure (>8 hours) above 30% RH may accelerate oxidation on leads, particularly if stored improperly after opening. No additional baking is needed before soldering, unlike higher MSL components.
What trade-offs exist between using the SOMLX800-11-000GC and newer AMD G-Series processors for fanless embedded designs?
The SOMLX800-11-000GC consumes around 15W TDP under load, enabling fanless operation only in well-ventilated cases or passive-cooled chassis. Newer AMD G-Series processors offer similar performance but with improved power efficiency (as low as 9W) and enhanced graphics, allowing smaller form factors. However, the SOMLX800 avoids licensing costs and benefits from decades of BIOS optimization, which can outweigh raw efficiency gains in legacy-compatible deployments where software portability is secondary to compatibility.
How does the absence of ECCN classification impact export controls involving the SOMLX800-11-000GC?
The assigned ECCN 4A994B indicates the SOMLX800-11-000GC falls under “automatic data processing machines” but excludes encryption functionality, placing it outside strict ITAR controls. This facilitates international distribution to most countries without requiring individual licenses, though end-use monitoring applies. Still, exporters must verify final application against Wassenaar Arrangement guidelines, as some military or surveillance uses could trigger reclassification upon review. Always cross-check with current BIS or EAR regulations before global shipment.
Is the SOMLX800-11-000GC compatible with modern Linux distributions like Yocto or Buildroot out of the box?
The Geode LX800 has strong community and commercial Linux support, including kernels backported to version 4.x or earlier due to its aging architecture. Full compatibility with Yocto depends on machine configuration and kernel patches; some users report needing custom device trees or disabling newer features like KASAN. While Buildroot supports the platform, driver availability for peripherals like GPIO or I²C may lag behind mainline releases. Expect longer boot times and reduced responsiveness compared to ARM-based builds.
What are the risks of cascading failures if the SOMLX800-11-000GC shares power rails with noisy digital loads?
Powering the SOMLX800-11-000GC alongside high-current switching regulators or motor drivers can introduce voltage droop and noise coupling through shared planes. The LX800’s analog subsystems, such as PLLs for clock generation, are sensitive to ripple above 50mV p-p on the core supply. Poor decoupling—especially missing bulk capacitors near the module—can cause intermittent lockups or erratic behavior. Implementing separate VDD domains with ferrite beads and LC filters mitigates crosstalk while maintaining transient response.

Parts with Similar Specifications

The three parts on the right have similar specifications to Beacon EmbeddedWorks SOMLX800-11-000GC

Product Attribute SOMLX800-11-000GCR SOMLX800-11-000GCR-A SOMLX800-11-700GCR SOMIMX8MNS-11-29C0DMCR
Part Number SOMLX800-11-000GCR SOMLX800-11-000GCR-A SOMLX800-11-700GCR SOMIMX8MNS-11-29C0DMCR
Manufacturer Beacon EmbeddedWorks Beacon EmbeddedWorks Beacon EmbeddedWorks Beacon EmbeddedWorks
RAM Size - - - -
Size / Dimension - - - -
Connector Type - - - -
Flash Size - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Speed - - - -
Core Processor - - - -
Module/Board Type - - - -
Co-Processor - - - -
Series - - - -

SOMLX800-11-000GC Datasheet PDF

Download SOMLX800-11-000GC pdf datasheets and Beacon EmbeddedWorks documentation for SOMLX800-11-000GC - Beacon EmbeddedWorks.

Datasheets
Cylindrical Battery Holders.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
Beacon EmbeddedWorks

SOMLX800-11-000GC

Beacon EmbeddedWorks
98D-SOMLX800-11-000GC

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