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HomeProductsIntegrated Circuits (ICs)Embedded - Microcontroller, Microprocessor, FPGA ModulesSOMLX800-11-000GCR-A
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SOMLX800-11-000GCR-A - Beacon EmbeddedWorks

Manufacturer Part Number
SOMLX800-11-000GCR-A
Manufacturer
Beacon EmbeddedWorks
Allelco Part Number
98D-SOMLX800-11-000GCR-A
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
13,621 pcs available, New & Original
Parts Description
IC MODULE GEODE LX800 500MHZ
Package
Box
Data sheet
SOMLX800-11-000.pdf
RoHs Status
 
Our certification
In stock: 13621

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Specifications

SOMLX800-11-000GCR-A Tech Specifications
Beacon EmbeddedWorks - SOMLX800-11-000GCR-A technical specifications, attributes, parameters and parts with similar specifications to Beacon EmbeddedWorks - SOMLX800-11-000GCR-A

Product Attribute Attribute Value
Manufacturer Beacon EmbeddedWorks
Speed 500MHz
Size / Dimension 3.780" L x 4.530" W (96.00mm x 115.00mm)
Series -
RAM Size -
Package Box
Product Attribute Attribute Value
Operating Temperature 0°C ~ 70°C
Module/Board Type MPU Core
Flash Size -
Core Processor Geode, LX 800
Connector Type -
Co-Processor -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN 4A994B
HTSUS 8471.41.0150

Frequently Asked Questions(FAQ)

What are the key performance limitations of the SOMLX800-11-000GCR-A module when operating near its maximum temperature range, and how does this affect embedded system reliability in industrial environments?
The SOMLX800-11-000GCR-A operates within a commercial temperature range of 0°C to 70°C, which limits its suitability for extended outdoor or high-heat industrial applications without active thermal management. At sustained temperatures approaching 70°C, the Geode LX800 core may experience reduced clock stability and increased power leakage, potentially causing intermittent performance degradation. Designers should consider ambient heat sources, enclosure ventilation, and thermal dissipation paths in system enclosures to maintain consistent operation, especially in scenarios involving prolonged computational load or confined spaces.
How does the physical footprint of the SOMLX800-11-000GCR-A impact mechanical integration in compact embedded systems compared to smaller form factor alternatives?
With dimensions of 96.00mm x 115.00mm, the SOMLX800-11-000GCR-A occupies a relatively large area compared to modern System-on-Modules (SoMs) based on ARM Cortex processors. This size makes it less ideal for space-constrained designs such as handheld devices or portable instrumentation where board real estate is at a premium. While its footprint supports robust mechanical mounting and heatsink attachment, integration into miniaturized systems may require custom carrier boards with additional structural reinforcement or layout accommodations, increasing both mechanical and electrical complexity.
Can the SOMLX800-11-000GCR-A be used in battery-powered applications, and what factors should influence power budgeting decisions during system design?
Due to its lack of integrated memory and reliance on external components, the SOMLX800-11-000GCR-A itself does not specify dynamic power consumption data, but historical benchmarks suggest the Geode LX800 at 500MHz typically consumes around 1–2W under typical load. Given this and the absence of low-power states documentation, continuous operation near full speed would likely exceed power budgets for most portable or battery-operated systems. Therefore, its use in energy-sensitive applications is generally discouraged unless paired with aggressive sleep strategies and external power gating, which adds design overhead and complexity.
How does the absence of on-module flash and RAM affect development workflows and system boot time when using the SOMLX800-11-000GCR-A?
The SOMLX800-11-000GCR-A does not include onboard flash or RAM, requiring designers to implement these externally. This increases bill-of-materials (BOM) count and board complexity, while also introducing potential signal integrity challenges across address/data buses. Boot times become dependent on the chosen NOR or NAND flash interface and external DRAM initialization sequence, which can extend cold-start latency by hundreds of milliseconds compared to integrated solutions. Additionally, firmware updates must target removable media or network-based provisioning, limiting offline deployment flexibility.
What are the implications of the Geode LX800 architecture in the SOMLX800-11-000GCR-A regarding software compatibility and driver support for modern Linux distributions?
The SOMLX800-11-000GCR-A’s core processor is based on the VIA Geode LX800, an x86-compatible CPU from the mid-to-late 2000s. While basic Linux kernel support exists through legacy patches and embedded distributions like Buildroot or OpenEmbedded, mainstream distributions such as Ubuntu LTS or Fedora no longer provide official binary support or optimized kernels for this architecture. Developers must rely on community-maintained builds, which may lack security updates or hardware acceleration features, thereby increasing long-term maintenance risk and reducing scalability for future-proof deployments.
How should designers evaluate the trade-offs between using the SOMLX800-11-000GCR-A versus newer ARM-based modules in terms of computational throughput and ecosystem maturity?
Although the SOMLX800-11-000GCR-A offers 500MHz clock speed, the Geode LX800 uses a single-core x86 architecture with limited IPC (instructions per cycle), resulting in lower effective performance than contemporary dual-core ARM Cortex-A53 or A72 implementations running at similar frequencies. Furthermore, ARM platforms benefit from mature toolchains, extensive peripheral libraries, and broader OS support—advantages absent in the aging x86 embedded niche supported by the SOMLX800-11-000GCR-A. For new designs prioritizing performance, maintainability, or connectivity, ARM-based alternatives generally offer superior value despite higher initial component cost.
Is the SOMLX800-11-000GCR-A suitable for high-vibration industrial environments, and what mechanical considerations apply during PCB assembly and mounting?
The SOMLX800-11-000GCR-A lacks conformal coating or ruggedized packaging, and its surface-mount connectors may not withstand prolonged mechanical stress. In high-vibration settings such as factory automation or mobile machinery, solder joint fatigue or connector detachment could occur over time. Designers should reinforce attachment points, use strain relief on cabling, and validate board-level vibration resistance through accelerated life testing. Additionally, selecting low-profile connectors and avoiding fine-pitch traces near the module edges enhances robustness against shock and vibration-induced failures.
What are the regulatory and supply chain risks associated with sourcing the SOMLX800-11-000GCR-A, given its age and manufacturer status?
As a product from Beacon EmbeddedWorks—a company now defunct—the SOMLX800-11-000GCR-A represents an obsolete part with limited lifecycle assurance. ECCN 4A994B classification indicates it falls under non-restricted electronics, but availability is uncertain due to discontinued production. Procurement risks include price volatility, counterfeit susceptibility, and lack of technical support. Designers considering this module should assess whether it fits into legacy upgrades or if migration to a supported alternative is feasible, balancing obsolescence mitigation against project timeline constraints.

Parts with Similar Specifications

The three parts on the right have similar specifications to Beacon EmbeddedWorks SOMLX800-11-000GCR-A

Product Attribute SOMLX800-11-000GCR SOMLX800-11-700GCR SOMLX800-11-000GC SOMM5485-MED01-0201R-A
Part Number SOMLX800-11-000GCR SOMLX800-11-700GCR SOMLX800-11-000GC SOMM5485-MED01-0201R-A
Manufacturer Beacon EmbeddedWorks Beacon EmbeddedWorks Beacon EmbeddedWorks Beacon EmbeddedWorks
Series - - - -
Size / Dimension - - - -
Flash Size - - - -
Speed - - - -
Co-Processor - - - -
RAM Size - - - -
Connector Type - - - -
Module/Board Type - - - -
Core Processor - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

SOMLX800-11-000GCR-A Datasheet PDF

Download SOMLX800-11-000GCR-A pdf datasheets and Beacon EmbeddedWorks documentation for SOMLX800-11-000GCR-A - Beacon EmbeddedWorks.

Datasheets
AMD Geode LX 800 SOM.pdf

Customer Reviews

Evaluation: 10 Articles

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
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SOMLX800-11-000GCR-A Image

SOMLX800-11-000GCR-A

Beacon EmbeddedWorks
98D-SOMLX800-11-000GCR-A

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