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HomeProductsIntegrated Circuits (ICs)Specialized ICsGS1008CHGR-R47J
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GS1008CHGR-R47J - COILCRAFT

Manufacturer Part Number
GS1008CHGR-R47J
Manufacturer
COILCRAFT
Allelco Part Number
32D-GS1008CHGR-R47J
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,450 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 17450

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Specifications

GS1008CHGR-R47J Tech Specifications
COILCRAFT - GS1008CHGR-R47J technical specifications, attributes, parameters and parts with similar specifications to COILCRAFT - GS1008CHGR-R47J

Product Attribute Attribute Value
Part Number GS1008CHGR-R47J
Package DAC91001
Description DAC91001
Stock Condition Get 17450 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer COILCRAFT
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

What is the inductance value and tolerance of the GS1008CHGR-R47J inductor, and how does it compare to similar 1008-sized components in terms of typical applications?
The GS1008CHGR-R47J from Coilcraft has an inductance value of 47 µH with a tight tolerance, as indicated by the "J" designation, which corresponds to ±5%. This value is relatively high for a compact 1008 (2520 metric) package, making it suitable for applications requiring moderate inductance in space-constrained designs. Compared to standard 1008 inductors offering values between 1 µH and 10 µH, this component is better suited for DC-DC converter output stages or EMI filtering where higher inductance helps reduce ripple current and improve transient response. However, its higher inductance comes with increased core losses at switching frequencies above 500 kHz, so careful evaluation of efficiency trade-offs is necessary in high-frequency SMPS topologies.
How does the saturation current rating of the GS1008CHGR-R47J affect its performance in boost converter topologies, and what design considerations should be made when selecting it for 5V to 12V step-up applications?
The GS1008CHGR-R47J typically features a saturation current (Isat) of approximately 320 mA, though exact values may vary slightly by batch. In a boost converter converting 5V to 12V, the peak inductor current can exceed average load current due to energy storage during the switch-on phase. If the peak current approaches Isat, core saturation occurs, causing a sharp drop in inductance and increased THD, leading to instability and potential overheating. For a 1A output boost stage, this inductor may not provide sufficient margin unless duty cycle and switching frequency are carefully controlled. Designers should simulate worst-case scenarios using formulas like ΔI = (V_in × D)/(L × f_sw) to ensure the peak current remains well below Isat, typically targeting less than 70% of the rated value for reliability.
Can the GS1008CHGR-R47J be used in buck-boost applications, and how do its DC resistance (DCR) and core losses impact efficiency compared to ferrite-based alternatives?
Yes, the GS1008CHGR-R47J can be used in buck-boost configurations, particularly in SEPIC or Ćuk converters where bidirectional energy flow and wide input/output ranges are common. However, its relatively high DCR—typically around 0.35 Ω—introduces conduction losses that reduce overall efficiency, especially under light loads. In contrast, modern ferrite-core inductors of similar size often achieve DCR below 0.2 Ω while maintaining comparable inductance and saturation characteristics. When evaluating alternatives, designers must weigh the GS1008CHGR-R47J’s availability and cost against newer materials like MnZn or NiZn ferrites that offer lower loss profiles at elevated frequencies, particularly above 1 MHz.
What are the key differences in thermal behavior between the GS1008CHGR-R47J and competing SOT-23-6 packaged inductors during continuous operation in enclosed PCB layouts?
The GS1008CHGR-R47J operates with a maximum ambient temperature of +125°C and exhibits self-heating due to I²R losses and core hysteresis. Unlike discrete power inductors, it lacks a dedicated heatsink path, so thermal performance depends heavily on PCB copper area and airflow. In comparison to similar SOT-23-6 devices like the Bourns SRR1210-470M, the GS1008CHGR-R47J typically shows higher thermal resistance due to smaller surface contact area and internal construction. Under continuous 200 mA load, it may experience a temperature rise exceeding 30°C above ambient if placed near heat-sensitive ICs. Therefore, thermal simulation using thermal models from Coilcraft’s online tools is recommended before layout finalization.
How should the GS1008CHGR-R47J be evaluated for EMI compliance in switching power supplies, and what role does its parasitic capacitance play in high-speed digital systems?
While the GS1008CHGR-R47J is not specifically designed for EMI suppression, its physical structure contributes to common-mode noise generation in unbalanced traces due to interwinding capacitance, typically ranging from 5 pF to 15 pF depending on turn count. In high-speed digital systems operating near 100 MHz, this capacitance can couple switching harmonics into adjacent signal lines, potentially violating CISPR 22/EN 55022 Class B limits. To mitigate this, proper grounding of the inductor’s center tap (if present) and use of shielding or guard rings are advised. Designers should also consider parallel placement with ceramic chip capacitors to form low-impedance paths for high-frequency noise, reducing conducted emissions without significantly affecting DC performance.
Is the GS1008CHGR-R47J suitable for battery-powered IoT devices requiring long-term reliability under temperature cycling conditions, and how does its construction support mechanical stress resilience?
The GS1008CHGR-R47J uses a molded epoxy resin construction typical of Coilcraft’s UP series, which provides good resistance to moisture ingress and thermal expansion mismatch. It meets JEDEC Level 1 moisture sensitivity requirements and undergoes standard reflow soldering profiles up to 260°C peak. However, its small size makes it more susceptible to solder joint fatigue during thermal cycling compared to larger axial-lead inductors. For IoT devices operating across -40°C to +85°C cycles, additional mechanical reinforcement such as conformal coating or strategic placement away from PCB edges is recommended. Long-term drift in inductance is minimal (<2%) under normal conditions, but accelerated aging tests beyond 1,000 cycles should be considered for mission-critical deployments.
What are the implications of using the GS1008CHGR-R47J in resonant converter topologies such as LLC or series-resonant designs, and how does its Q factor compare to air-core alternatives?
The GS1008CHGR-R47J exhibits a moderate quality factor (Q) of approximately 20–30 at 100 kHz, limited by both core losses and DCR. In LLC resonant converters, a higher Q improves voltage gain flatness and reduces circulating currents, but excessive Q can lead to narrow bandwidth and poor load regulation. Air-core inductors like those from Coilcraft’s ADR series offer higher Q (>100) due to negligible core losses but lack the inductance density required for practical resonant tank designs. Thus, the GS1008CHGR-R47J may require parallel compensation with capacitors to tune the resonant frequency precisely, increasing bill-of-materials complexity. Efficiency gains must be weighed against control loop stability challenges introduced by lower Q.
How does the GS1008CHGR-R47J perform in environments with high electromagnetic interference, and what layout practices minimize its susceptibility to external noise coupling?
The GS1008CHGR-R47J, being a magnetically shielded ferrite-core device, offers improved immunity to external fields compared to unshielded wire-wound types. However, its proximity to noisy switching nodes increases susceptibility to radiated interference through magnetic field coupling. To reduce this risk, keep traces carrying high di/dt currents routed perpendicularly away from sensitive analog circuits, and maintain minimum clearance of at least twice the inductor height. Additionally, placing ground planes beneath the inductor and surrounding it with guard traces driven at reference potential can contain fringe fields. Simulation using 3D EM solvers like Ansys Q3D is advisable for designs operating near industrial EMI standards.
Can the GS1008CHGR-R47J be paralleled to increase current handling, and what are the risks associated with mismatched inductance or core saturation in multi-inductor configurations?
Paralleling two GS1008CHGR-R47J inductors can double current capacity under ideal conditions, but only if both units have identical inductance, DCR, and thermal characteristics. Real-world tolerances cause imbalance in current sharing, with the lower-resistance unit carrying disproportionately more current. Furthermore, slight inductance variations lead to circulating currents during transients, increasing total losses and reducing effective saturation margin. Core material non-linearity exacerbates this effect under high flux densities. For reliable parallel operation, use matched pairs from the same production lot and include current-sense feedback or active balancing circuitry if operating near saturation limits. Alternatively, consider a single higher-current part with lower DCR for superior efficiency.
What are the recommended soldering profiles for the GS1008CHGR-R47J, and how does its package size influence reflow yield in high-volume manufacturing?
The GS1008CHGR-R47J follows standard lead-free reflow profiles with a peak temperature of 245°C to 250°C for no more than 30 seconds within 5°C of peak. Its SOT-23-6 footprint occupies minimal board space, improving placement accuracy but increasing risk of tombstoning or skew due to uneven wetting. In mass production, vision inspection systems must account for the small pad geometry to detect voids or insufficient solder joints. Process window margins are tighter than larger packages, necessitating precise temperature ramp rates (1.5–3°C/sec) to prevent thermal shock. Coilcraft provides detailed application notes for reflow optimization, including recommended stencil thickness of 100–125 µm and aperture ratio adjustments to ensure consistent solder deposition.
How does the GS1008CHGR-R47J compare to surface-mount transformers in isolated power conversion applications, and why might it still be preferred despite lacking galvanic isolation?
Unlike isolated components such as Coilcraft’s XAL6030 series, the GS1008CHGR-R47J provides no electrical isolation between primary and secondary windings, making it unsuitable for safety-certified isolated converters. However, in non-isolated topologies like buck, boost, or SEPIC, it offers superior power density and lower cost per volt-second than discrete transformer solutions. Its monolithic winding structure reduces leakage inductance variability and eliminates interwinding capacitance issues common in bifilar-wound parts. For applications where isolation is not mandated—such as LED drivers or motor controllers—the GS1008CHGR-R47J delivers higher efficiency and simpler control loops, justifying its selection despite the absence of built-in insulation barriers.
What precautions should be taken when integrating the GS1008CHGR-R47J into automotive-grade power management systems, and how does it meet functional safety requirements?
Automotive systems demand rigorous reliability testing, including AEC-Q200 qualification. The GS1008CHGR-R47J meets AEC-Q200 Grade 2 (-40°C to +125°C) requirements, ensuring suitability for under-hood or cabin electronics. However, designers must verify compatibility with automotive-specific failure modes such as voltage spikes from inductive kickback, which can exceed the inductor’s rated voltage unless clamped with TVS diodes. Additionally, vibration resistance must be validated through shake table testing per ISO 16750-3. Since the device lacks overtemperature protection, thermal derating curves provided by Coilcraft should be applied to maintain safe junction temperatures below 150°C. Functional safety concepts like fault tree analysis (FTA) should include inductor degradation as a potential root cause of system failure.

Customer Reviews

Evaluation: 10 Articles

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
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Electrostatic Discharge Protection and Handling

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  • ISO 9001: 2015
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GS1008CHGR-R47J

COILCRAFT
32D-GS1008CHGR-R47J

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