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HomeProductsCrystals, Oscillators, ResonatorsCrystals416F26035IDT
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416F26035IDT - CTS-Frequency Controls

Manufacturer Part Number
416F26035IDT
Manufacturer
CTS Corporation
Allelco Part Number
98D-416F26035IDT
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
287,707 pcs available, New & Original
Parts Description
CRYSTAL 26.0000MHZ 18PF SMD
Package
4-SMD, No Lead
Data sheet
416F26035IDT.pdf
RoHs Status
ROHS3 Compliant
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In stock: 287707

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Specifications

416F26035IDT Tech Specifications
CTS-Frequency Controls - 416F26035IDT technical specifications, attributes, parameters and parts with similar specifications to CTS-Frequency Controls - 416F26035IDT

Product Attribute Attribute Value
Manufacturer CTS Corporation
Type MHz Crystal
Size / Dimension 0.063' L x 0.047' W (1.60mm x 1.20mm)
Series 416
Ratings -
Package / Case 4-SMD, No Lead
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C
Product Attribute Attribute Value
Operating Mode Fundamental
Mounting Type Surface Mount
Load Capacitance 18pF
Height - Seated (Max) 0.018' (0.45mm)
Frequency Tolerance ±30ppm
Frequency Stability ±50ppm
Frequency 26 MHz
ESR (Equivalent Series Resistance) 120 Ohms

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.60.0060

Frequently Asked Questions(FAQ)

How does the frequency stability of the 416F26035IDT crystal compare to its initial tolerance under varying operating conditions, and what design implications does this have for timing accuracy in embedded systems?
The 416F26035IDT exhibits a ±30ppm initial frequency tolerance and a ±50ppm frequency stability over the -40°C to 85°C operating range. While the initial tolerance represents a one-time manufacturing variation, the stability metric reflects how much the frequency drifts with temperature changes during operation. This means that even if the unit starts within spec, it could deviate by up to an additional ±20ppm due to thermal effects. For applications requiring tight clock synchronization, such as USB or high-speed SPI communication, this cumulative variation must be accounted for in system timing budgets. Designers should consider using calibration routines or selecting crystals with tighter stability grades when long-term accuracy is critical.
In what ways do the 120 Ohms ESR and 18pF load capacitance of the 416F26035IDT influence oscillator circuit design, and how might these values affect startup behavior in low-power microcontroller applications?
The 120 Ohms Equivalent Series Resistance (ESR) defines the minimum feedback resistance required in a Pierce oscillator circuit to ensure sufficient gain for oscillation initiation. With this value, designers must ensure the total series resistance in the feedback path remains below approximately 100kΩ to maintain reliable startup. The 18pF load capacitance specifies the optimal capacitive load the crystal presents to the oscillator circuit, which directly impacts frequency accuracy through crystal loading effects. Mismatched external capacitors can shift the actual load seen by the crystal, potentially causing frequency deviation beyond the ±50ppm stability specification. In battery-powered systems, incorrect loading may also increase current consumption during startup due to longer settling times or failed oscillation attempts.
Can the 416F26035IDT be used interchangeably with the suggested substitute part 416F26033IDR, and what key parameter differences should engineers verify before substituting in existing designs?
Although both belong to the same 416 series from CTS-Frequency Controls, the 416F26033IDR operates at 26 MHz but with different electrical characteristics: it typically has a lower ESR around 80 Ohms and may support tighter load capacitance matching. More importantly, frequency-specific parts like these often have distinct harmonic modes or overtone performance that isn’t immediately apparent without full characterization. Engineers should verify not only the nominal frequency but also the actual drive level, phase noise profile, and cold-start performance when substituting. Substitution without validation risks introducing instability or increased power draw in sensitive analog-digital coexistence environments.
What are the thermal considerations when integrating the 416F26035IDT into compact PCB layouts where ambient temperature fluctuations are expected, and how do these relate to the specified -40°C to 85°C operating range?
The 416F26035IDT is rated for industrial-grade operation spanning -40°C to +85°C, which covers most automotive and outdoor sensing applications. However, localized hotspots near high-current traces or components can create thermal gradients exceeding the crystal’s local environment. Since frequency stability is inherently temperature-dependent, rapid thermal transients can induce microsecond-level jitter in clock edges. Designers should avoid placing power regulators or switching FETs within 5mm of the crystal footprint and use thermal vias under the crystal pad if necessary. Additionally, conformal coating can alter heat dissipation rates, potentially pushing effective operating temperatures beyond datasheet assumptions if applied unevenly.
How does the surface-mount packaging of the 416F26035IDT—specifically the 4-SMD, no-lead configuration—impact mechanical stress susceptibility compared to traditional leaded packages, and what layout practices reduce failure risk?
The 4-SMD, no-lead package eliminates wire bonds and provides a more robust mechanical interface than older leaded types, reducing susceptibility to vibration-induced fatigue. However, its small form factor (1.60mm x 1.20mm) concentrates stress at the solder joints during PCB flexure. To mitigate this, designers should use generous copper pours connected via multiple thermal vias to distribute mechanical loads and avoid routing high-impedance traces directly adjacent to the crystal pads. Solder mask damming around the crystal footprint helps contain flux residue and prevents capillary action that could weaken joint integrity during reflow. These practices collectively enhance reliability in harsh environments like mobile devices or industrial controls.
Why is moisture sensitivity level (MSL) classification important for the 416F26035IDT, and how should assembly processes be adjusted when handling this component in high-humidity foundries?
The 416F26035IDT carries an MSL rating of 1, indicating unlimited shelf life under normal storage conditions without baking prior to soldering. This simplifies handling compared to higher-risk components, but improper storage in unconditioned environments can still lead to popcorning during reflow due to internal moisture expansion. Foundries should maintain storage below 60% relative humidity and ensure components are used within 168 hours of opening unless baked per JEDEC J-STD-033. Even with MSL 1, batch traceability and FIFO rotation remain essential to prevent latent damage accumulation over time.
What role does the fundamental mode of operation play in the 416F26035IDT’s performance, and why might harmonic modes be unsuitable for precision timing applications?
The 416F26035IDT operates in fundamental mode, meaning it vibrates at its base resonant frequency of 26 MHz with minimal distortion and predictable phase noise characteristics. Harmonic modes, while available on some crystals, introduce spurious signals and nonlinearities that degrade clock purity. Fundamental-mode crystals like this one offer superior short-term stability and lower aging rates, making them ideal for microcontroller clocks, RF synthesizers, and data converter interfaces. Attempting to force harmonic operation through overdriving or improper load matching can permanently damage the quartz blank and void warranty coverage.
How does the RoHS3 compliance status of the 416F26035IDT affect global regulatory adherence, and are there any hidden restrictions beyond lead-free requirements?
RoHS3 compliance confirms the 416F26035IDT meets Directive 2011/65/EU amendments including restrictions on phthalates (DEHP, BBP, DBP, DIBP), extending beyond traditional lead, cadmium, mercury, and hexavalent chromium limits. This ensures compatibility with European Union markets and supports sustainability goals. However, RoHS3 does not guarantee exemption from REACH SVHC declarations or conflict mineral reporting, which may still apply depending on end-product classification. Manufacturers must verify supply chain documentation for full compliance, especially in aerospace or medical sectors with additional material restrictions.
Given the 18pF load capacitance requirement, how should PCB parasitics be managed to maintain accurate frequency output in the 416F26035IDT implementation?
The 18pF load capacitance includes contributions from both external capacitors and PCB trace capacitance. Typical parasitic capacitance between crystal pads and ground planes can range from 0.2pF to 0.8pF depending on layer stackup and proximity. To meet the target load accurately, designers calculate total load as C_load = (C1 × C2)/(C1 + C2) + C_parasitic, where C1 and C2 are external tuning caps. Using 12–22pF nominal values with low-Df dielectrics (e.g., NP0/C0G) ensures the net load stays within ±2pF tolerance. Avoiding guard rings or overlapping copper fills beneath the crystal minimizes unintended coupling and stabilizes frequency across temperature cycles.
What distinguishes the 416F26035IDT from general-purpose crystals, and why would a designer choose it over ceramic resonators for a 26 MHz system clock?
Unlike ceramic resonators, the 416F26035IDT uses AT-cut quartz, offering superior frequency accuracy (±30ppm vs. ±200ppm typical), better long-term aging characteristics (<±5ppm/year), and lower phase noise. At 26 MHz, quartz crystals provide sharper Q-factor peaks and more stable resonance than ceramics, which are prone to drift from mechanical shock and temperature cycling. For systems requiring reliable UART baud rate generation, I²S clocks, or Ethernet PHY synchronization, the 416F26035IDT delivers predictable timing unavailable from resonator alternatives, despite slightly higher cost and board space usage.
How does the height-seated measurement (0.45mm max) of the 416F26035IDT constrain placement in multilayer PCBs with dense vertical stacking, and what clearance rules apply during automated assembly?
With a maximum seated height of 0.45mm, the 416F26035IDT occupies minimal profile, enabling use in thin-profile devices like wearables or IoT sensors. However, adjacent tall components (e.g., connectors or large ICs) must maintain at least 1.0mm vertical clearance to prevent collision during pick-and-place operations. Assembly equipment typically requires ≥0.5mm standoff above the crystal plane to ensure accurate bonding force application. Designers should consult their SMT vendor’s nozzle interference maps and avoid placing vias or test points directly beneath the crystal footprint to preserve mechanical stability.
Are there known limitations when driving the 416F26035IDT from CMOS logic families other than those specifically tested by the manufacturer, and how can drive level overshoot be mitigated?
The 416F26035IDT assumes a standard CMOS driver with moderate output swing and low DC offset. Driving it from LVDS or ECL logic may exceed recommended drive levels, leading to crystal blank erosion and accelerated aging. Drive level should remain below 100µW as implied by the 120 Ohms ESR; excessive drive increases power consumption and shortens lifespan. If using non-standard drivers, measure actual current through the crystal terminals or insert series resistors (10–100Ω) to limit energy transfer. Always validate startup behavior under worst-case VDD and process corners before finalizing firmware initialization sequences.
How does the ECCN designation EAR99 impact international sourcing decisions involving the 416F26035IDT, and what export controls might still apply?
An ECCN (Export Control Classification Number) of EAR99 indicates the 416F26035IDT is generally subject to U.S. Export Administration Regulations (EAR) general license provisions, simplifying export to most countries. However, EAR99 items can still require licenses for destinations listed under Entity List or Weapons of Mass Destruction (WMD) concerns. Additionally, dual-use applications in military, satellite, or encryption systems may trigger additional screening. Companies sourcing globally should implement end-use checks and maintain records per OFAC guidelines, even for seemingly benign components like this crystal.
What testing procedures are recommended to validate real-world performance of the 416F26035IDT before deploying it in production hardware, and how do these differ from datasheet specifications?
Datasheet parameters represent idealized lab conditions; real-world validation requires environmental stress testing including thermal cycling (-40°C to +85°C at 10 cycles), vibration (10–2000Hz random), and humidity exposure (85°C/85% RH for 1000 hours). Frequency drift, startup time, and phase jitter should be monitored under these stresses. Drive level verification using a spectrum analyzer or precision LCR meter ensures operation within safe limits. Additionally, long-term aging tests over 30 days help confirm drift trends align with the <±50ppm/year specification. These empirical checks reveal subtle issues like microphonic sensitivity or substrate contamination missed in static measurements.
How does the absence of explicit ratings in the 416F26035IDT specification affect use in safety-critical systems, and what alternative qualification paths exist?
Lack of formal ratings (e.g., AEC-Q200) means the 416F26035IDT is not certified for automotive or mission-critical applications where failure could pose safety risks. In such cases, engineers may pursue custom qualification through third-party labs, performing HALT/HASS tests aligned with ISO 16750 or DO-160 standards. Alternatively, selecting a rated variant (e.g., CTS’s automotive-grade equivalents) provides documented reliability data. For non-safety systems, however, the component’s inherent robustness—supported by RoHS3 and industrial temp range—may justify acceptance based on risk assessment and historical field data from similar deployments.
What are the implications of the “REACH Unaffected” status for the 416F26035IDT regarding chemical substance disclosures, and how should procurement teams respond?
“REACH Unaffected” suggests the component contains no substances of very high concern (SVHC) exceeding 0.1% weight concentration, aligning with EU Regulation (EC) No 1907/2006. However, this declaration comes from the supplier and must be verified through SDS (Safety Data Sheet) review and batch-specific declarations. Procurement teams should request updated SVHC lists quarterly and cross-check against ECHA’s Candidate List updates. Even unaffected components can become subject to new restrictions if their manufacturing inputs change, necessitating ongoing compliance monitoring throughout product lifecycle.
How does the 26 MHz fundamental frequency of the 416F26035IDT compare to common microcontroller oscillator requirements, and what divider strategies optimize power efficiency?
Many modern MCUs operate optimally at 16–32 MHz for balanced speed and power; thus, 26 MHz falls squarely within this sweet spot. Running at this frequency avoids the overhead of PLL multiplication (which consumes extra power) while supporting high-speed peripherals like USB Full Speed or SDIO. Instead of dividing down, designers often enable internal dividers post-startup to reduce CPU frequency during idle states. This preserves timing accuracy without sacrificing responsiveness, leveraging the crystal’s inherent stability rather than relying on digitally generated clocks derived from it.
What are the consequences of ignoring the Moisture Sensitivity Level 1 warning labels during warehouse storage of 416F26035IDT inventory, and how can quality assurance detect latent damage?
Despite MSL 1 implying low risk, poor warehouse humidity control (>70% RH) can accelerate hygroscopic absorption in plastic trays or antistatic bags, increasing popcorning probability during rework or repair cycles. Latent damage manifests as intermittent oscillation failures after months of service. QA teams can detect this via acoustic microscopy pre-assembly or by monitoring first-batch failure rates in accelerated burn-in testing. Implementing humidity-controlled storage (≤40% RH) and strict FIFO protocols reduces such risks significantly, even for supposedly benign components like the 416F26035IDT.

Parts with Similar Specifications

The three parts on the right have similar specifications to CTS-Frequency Controls 416F26035IDT

Product Attribute 416F26035IAT 416F26035ITR 416F26035ITT 416F26035IST
Part Number 416F26035IAT 416F26035ITR 416F26035ITT 416F26035IST
Manufacturer CTS-Frequency Controls CTS-Frequency Controls CTS-Frequency Controls CTS-Frequency Controls
Frequency - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Height - Seated (Max) - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Load Capacitance - - - -
Frequency Stability - - - -
Size / Dimension - - - -
Frequency Tolerance - - - -
ESR (Equivalent Series Resistance) - - - -
Series - - - -
Type - - - -
Ratings - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Mode - - - -

416F26035IDT Datasheet PDF

Download 416F26035IDT pdf datasheets and CTS-Frequency Controls documentation for 416F26035IDT - CTS-Frequency Controls.

Datasheets
Cylindrical Battery Holders.pdf
Environmental Information
RoHS Filters, Crystals, Oscillators.pdf CTS Corp REACH.pdf

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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416F26035IDT Image

416F26035IDT

CTS-Frequency Controls
98D-416F26035IDT

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