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HomeProductsInductors, Coils, ChokesFixed InductorsBWCS0029282118NG00
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BWCS0029282118NG00 - Chilisin Electronics

Manufacturer Part Number
BWCS0029282118NG00
Manufacturer
Chilisin Electronics
Allelco Part Number
98D-BWCS0029282118NG00
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
47,907 pcs available, New & Original
Parts Description
INDUCTOR RF
Package
1008
Data sheet
BWCS0029282118N.pdf

Environmental Information

Pulse Larson REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 47907
  • Unit Price: $0.07
  • Subtotal: $0.00

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The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

BWCS0029282118NG00 Tech Specifications
Chilisin Electronics - BWCS0029282118NG00 technical specifications, attributes, parameters and parts with similar specifications to Chilisin Electronics - BWCS0029282118NG00

Product Attribute Attribute Value
Manufacturer Chilisin Electronics
Type Drum Core, Wirewound
Tolerance ±2%
Supplier Device Package 1008
Size / Dimension 0.115" L x 0.110" W (2.92mm x 2.79mm)
Shielding Unshielded
Series BWCS
Ratings -
Q @ Freq 50 @ 350MHz
Package / Case 1008 (2520 Metric)
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount
Material - Core Ceramic
Inductance Frequency - Test 50 MHz
Inductance 18 nH
Height - Seated (Max) 0.083" (2.10mm)
Frequency - Self Resonant 2.5GHz
Features -
DC Resistance (DCR) 110mOhm Max
Current Rating (Amps) 1 A
Current - Saturation (Isat) -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8504.50.8000

Frequently Asked Questions(FAQ)

What makes the BWCS0029282118NG00 suitable for RF matching networks in the 350 MHz to 2.5 GHz range?
The BWCS0029282118NG00 delivers a Q factor of 50 at 350 MHz with a self-resonant frequency of 2.5 GHz, positioning it effectively within UHF and lower microwave bands. The ceramic drum core construction minimizes losses across this spectrum, while the unshielded design reduces parasitic coupling that could degrade impedance matching precision. For narrowband RF circuits operating near 350 MHz, the BWCS0029282118NG00 maintains sufficient reactance linearity, though designers should verify skin effect contributions at frequencies approaching 1 GHz where the Q begins to roll off noticeably.
How does the 110 mOhm DCR of the BWCS0029282118NG00 affect power dissipation in bias and matching circuits?
At the rated 1 A continuous current, the BWCS0029282118NG00 dissipates approximately 110 mW of resistive loss alone. In low-noise amplifier bias networks, this translates to roughly 0.11 W per inductor element. For multi-stage designs using several BWCS0029282118NG00 inductors in series (common in tuning networks), cumulative DCR losses can reach 0.3–0.5 W depending on topology. Thermal management becomes necessary in compact designs; the component's -40°C to 125°C rating assumes adequate board-level heat dissipation rather than isolated operation.
Why is the ±2% tolerance specification of the BWCS0029282118NG00 acceptable for RF tuning but potentially problematic for high-Q resonant circuits?
The BWCS0029282118NG00 tolerance of ±2% represents a ±0.36 nH window around the nominal 18 nH value. For impedance matching networks where matching networks rely on continuous component trimming or where absolute inductance drift is distributed across multiple elements, this tolerance is manageable. However, in narrowband LC resonators or crystal oscillator loading circuits where resonance frequency ƒ0 = 1/(2π√LC) becomes frequency-sensitive, the BWCS0029282118NG00 tolerance can shift center frequency by approximately 1 MHz at 2.4 GHz. Production binning or post-trim calibration of BWCS0029282118NG00 units may be necessary for frequency-critical applications.
How does the unshielded construction of the BWCS0029282118NG00 compare to shielded alternatives for on-PCB coupling and crosstalk risk?
The unshielded drum core of the BWCS0029282118NG00 exhibits stronger magnetic field extension compared to shielded counterparts, creating a trade-off between lower Q degradation (shielding increases core loss) and increased mutual coupling to adjacent traces and components. In single-layer or densely routed RF sections, placing the BWCS0029282118NG00 at least 2–3 mm from high-frequency signal paths and using ground planes beneath the inductor reduces coupling effectively. The unshielded BWCS0029282118NG00 is preferable for very low-power circuits where shielding losses would exceed crosstalk risk; shielded variants become necessary in multi-layer mixed-signal boards where digital switching noise couples magnetically.
At what current levels does the BWCS0029282118NG00 approach nonlinear behavior, and how does saturation affect matching network stability?
The BWCS0029282118NG00 datasheet specifies a 1 A maximum continuous rating with no explicit saturation current (Isat) value listed. Ceramic drum cores exhibit gradual nonlinearity rather than sharp saturation; inductance typically drops 10–15% near 1 A and continues eroding above that threshold due to core permeability saturation. In RF bias circuits carrying 0.5–0.8 A through the BWCS0029282118NG00, the inductor remains approximately linear. For pulse or transient currents exceeding 1.2 A, the effective inductance of the BWCS0029282118NG00 may fall by 20–30%, destabilizing resonant frequencies and impedance trajectories. Peak current analysis is necessary whenever the BWCS0029282118NG00 is used in switching or transient-laden applications.
Is the BWCS0029282118NG00 appropriate for direct integration into printed transmission lines, or does its package geometry require discrete pad spacing?
The BWCS0029282118NG00 physical dimensions (2.92 mm × 2.79 mm × 2.10 mm height) fit within 1008 metric footprints but do not integrate directly as a distributed element along a transmission line. Instead, the BWCS0029282118NG00 functions as a lumped element, requiring discrete placement with appropriate bond-pad spacing (typically 0.2–0.3 mm gaps minimum for 1008 packages). For impedance matching, the BWCS0029282118NG00 should be positioned on the characteristic impedance line with series capacitors forming L-network or π-network topologies. Direct attachment to transmission line corners or junctions is mechanically feasible but introduces impedance discontinuities; inserting the BWCS0029282118NG00 in series with short (<1 cm) trace segments minimizes radiation loss.
Why does the BWCS0029282118NG00 specify a test frequency of 50 MHz rather than higher RF bands, and how should designers extrapolate inductance and Q to operational frequencies?
The BWCS0029282118NG00 inductance value (18 nH) is verified at 50 MHz, where measurement equipment and fixture parasitic effects are well-controlled and repeatable. At this frequency, the BWCS0029282118NG00 operates well below its self-resonant frequency (2.5 GHz), ensuring purely inductive behavior with minimal reactance distortion. For 350 MHz operation (where Q = 50 is specified), inductance remains stable within ±3–5% of the 50 MHz baseline due to skin effect and distributed capacitance. However, near 2.5 GHz, the BWCS0029282118NG00 transitions toward resonance, and inductance measurement becomes frequency-dependent and fixture-sensitive. Designers should treat the BWCS0029282118NG00 specifications as valid only up to approximately 1/3 of self-resonant frequency (roughly 800 MHz) without device-level verification; beyond that, full-wave simulation or network analyzer characterization of the BWCS0029282118NG00 is necessary.
How do the BWCS0029282118NG00 and competing 18 nH inductors differ in Q factor performance and thermal stability across temperature extremes?
The BWCS0029282118NG00 Q of 50 at 350 MHz is mid-range for ceramic drum core designs; competing inductors using ferrite or air cores may achieve Q = 60–80 at the same frequency but with higher DCR or larger footprints. Thermal stability of the BWCS0029282118NG00 across -40°C to 125°C varies with core material; ceramic inductors typically exhibit inductance drift of ±2–3% over the full temperature range, with Q degradation accelerating above 85°C due to copper resistivity increases. The BWCS0029282118NG00 outperforms ferrite alternatives in temperature stability but trades slightly lower Q for reduced nonlinearity and cost. For applications requiring <±1% inductance over temperature, the BWCS0029282118NG00 may necessitate circuit-level compensation (parallel capacitor tuning or active bias adjustment).
Does the BWCS0029282118NG00 meet reliability and environmental standards for automotive or aerospace RF modules?
The BWCS0029282118NG00 is ROHS3 compliant and MSL 1 (unlimited moisture exposure), indicating suitability for commercial-grade RF designs with standard PCB assembly processes. However, the BWCS0029282118NG00 lacks explicit automotive (AEC-Q200) or aerospace (MIL-PRF) certification. For automotive RF modules (vehicle telematics, V2X), the BWCS0029282118NG00 may require supplementary reliability screening (thermal cycling, mechanical shock testing) by the integrating manufacturer. The ECCN classification (EAR99) and HTSUS code confirm the BWCS0029282118NG00 is unrestricted for commercial export. Aerospace applications typically demand MIL-grade inductors with extended temperature ranges and documented failure-rate data; the BWCS0029282118NG00 is not recommended for space or high-reliability military RF systems without vendor-specific qualification.
What PCB layout and thermal management practices minimize performance drift in BWCS0029282118NG00-based RF matching networks?
The BWCS0029282118NG00 should be positioned within 5 mm of RF active components (transistors, amplifiers) to reduce trace inductance and phase delay in feedback networks. Ground vias directly beneath and around the BWCS0029282118NG00 pad reduce return-path impedance and suppress coupling to adjacent signal layers. Thermal management involves ensuring the BWCS0029282118NG00 is not placed in direct contact with high-dissipation components; a minimum 2 mm air gap and aluminum-filled via fields below power devices help distribute heat and prevent localized hot spots that accelerate DCR drift. For designs operating near the 125°C upper limit, measuring the BWCS0029282118NG00 temperature on the PCB (via IR thermography or embedded sensors) and comparing against ambient reveals whether active cooling is needed. Matching network tuning curves should be measured across the full operating temperature range of the BWCS0029282118NG00 to validate frequency stability margins.

Parts with Similar Specifications

The three parts on the right have similar specifications to Chilisin Electronics BWCS0029282118NG00

Product Attribute BWCS0029282115NG00 BWCS0029282118NK00 BWCS0029282118NJ00 BWCS0029282112NG00
Part Number BWCS0029282115NG00 BWCS0029282118NK00 BWCS0029282118NJ00 BWCS0029282112NG00
Manufacturer Chilisin Electronics Chilisin Electronics Chilisin Electronics Chilisin Electronics
Type - - - -
Current - Saturation (Isat) - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Q @ Freq - - - -
Inductance - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Inductance Frequency - Test - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Current Rating (Amps) - - - -
Features - - - Simultaneous Sampling
Tolerance - - - -
Ratings - - - -
Frequency - Self Resonant - - - -
Shielding - - - -
Material - Core - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
DC Resistance (DCR) - - - -
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Size / Dimension - - - -
Height - Seated (Max) - - - -

BWCS0029282118NG00 Datasheet PDF

Download BWCS0029282118NG00 pdf datasheets and Chilisin Electronics documentation for BWCS0029282118NG00 - Chilisin Electronics.

Environmental Information
Pulse Larson REACH.pdf

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BWCS0029282118NG00 Image

BWCS0029282118NG00

Chilisin Electronics
98D-BWCS0029282118NG00

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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