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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~CY8C4147LQE-S273T~~

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CY8C4147LQE-S273T - Infineon Technologies

Name: Infineon Technologies CY8C4147LQE-S273T
Brand: Infineon Technologies
SKU: CY8C4147LQE-S273T
Price: 3.93 USD
Availability: InStock
Rating: 5 (5 reviews)

Manufacturer Part Number: CY8C4147LQE-S273T

Manufacturer: Infineon Technologies

Allelco Part Number: 98D-CY8C4147LQE-S273T

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 46,853 pcs available, New & Original

Parts Description: IC MCU 32BIT 128KB FLASH 40QFN

Package: 40-QFN (6x6)

Data sheet: -

RoHs Status: ROHS3 Compliant

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Quantity	Unit Price	Ext. Price
1+	$10.38	$10.38
200+	$4.14	$828.00
500+	$4.00	$2,000.00
1000+	$3.93	$3,930.00

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Specifications

CY8C4147LQE-S273T Tech Specifications
Infineon Technologies - CY8C4147LQE-S273T technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies - CY8C4147LQE-S273T

Product Attribute	Attribute Value
Manufacturer	Infineon Technologies
Voltage - Supply (Vcc/Vdd)	1.71V ~ 5.5V
Supplier Device Package	40-QFN (6x6)
Speed	24MHz
Series	Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus
RAM Size	16K x 8
Program Memory Type	FLASH
Program Memory Size	128KB (128K x 8)
Peripherals	Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Package / Case	40-UFQFN Exposed Pad
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	External, Internal
Operating Temperature	-40°C ~ 125°C (TA)
Number of I/O	34
Mounting Type	Surface Mount, Wettable Flank
EEPROM Size	-
Data Converters	A/D 16x10b, 20x12b SAR
Core Size	32-Bit
Core Processor	ARM® Cortex®-M0+
Connectivity	FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Base Product Number	CY8C4147

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)

Frequently Asked Questions(FAQ)

How does the CY8C4147LQE-S273T compare to other ARM Cortex-M0+ MCUs in terms of power efficiency at 24MHz operation, and what design considerations should influence selection when targeting battery-powered automotive applications?: The CY8C4147LQE-S273T operates from 1.71V to 5.5V with a maximum frequency of 24MHz, which enables efficient performance while maintaining low dynamic power consumption typical of Cortex-M0+ cores. Its PSOC® 4 architecture includes programmable analog and digital blocks that reduce external component count, lowering total system current. In automotive battery applications, designers must consider quiescent current in sleep modes—though not explicitly listed, Infineon typically achieves microamp-level standby via clock gating and peripheral control. Selection should prioritize devices with integrated CapSense and programmable analog to minimize wake-up time and leakage, especially when paired with low-power sensors or LINbus communication.

What are the key differences between the CY8C4147LQE-S273T and similar 32-bit microcontrollers from Cypress (now Infineon) in terms of memory architecture and real-time performance for motor control applications?: While several members of the CY8C4100S Plus series share core features, the CY8C4147LQE-S273T distinguishes itself with 128KB flash and 16KB SRAM—a balanced configuration suitable for complex state machines in motor control. Unlike general-purpose MCUs, this device integrates a DMA controller and multiple PWM modules with dead-time insertion, enabling precise timing without CPU intervention. The presence of an internal temperature sensor and CapSense further supports robust motor drive feedback loops. Compared to lower-memory variants like the CY8C4126, the extra flash allows larger firmware stacks and interrupt handlers, critical when implementing field-oriented control algorithms requiring fast context switching.

Can the CY8C4147LQE-S273T reliably interface with 5V logic peripherals in an automotive environment, and what protection mechanisms are built into its I/O structure?: Yes, the CY8C4147LQE-S273T supports voltage operation up to 5.5V, which accommodates 5V logic systems commonly found in legacy automotive networks. Each GPIO pin is designed with ESD protection compliant to HBM >2kV and latch-up immunity exceeding JEDEC standards, essential for harsh automotive conditions. However, bidirectional I/Os must be carefully managed during power sequencing; if the MCU powers up before a 5V node, internal clamping diodes may conduct unless input voltages stay within absolute maximum ratings. For sustained 5V signaling, level-shifting circuits or open-drain configurations are recommended to avoid excessive current draw through parasitic paths.

What oscillator options are available on the CY8C4147LQE-S273T, and how do internal vs. external clock sources impact system reliability in temperature-stressed automotive applications?: The CY8C4147LQE-S273T features a precision internal 24MHz oscillator calibrated across temperature, along with support for an external crystal or resonator. In automotive environments ranging from -40°C to 125°C, the internal oscillator maintains ±2% accuracy over full temperature range, reducing dependency on external components susceptible to drift or failure. Using the internal RC eliminates external load capacitance requirements and PCB parasitics, improving robustness against vibration and thermal cycling. However, for applications needing precise timing (e.g., UART baud rate generation), an external 16–24MHz crystal provides tighter tolerance (±10ppm typical), ensuring reliable communication with CAN/LIN transceivers.

How does the A/D converter performance of the CY8C4147LQE-S273T compare to dedicated data acquisition ICs, and when would it be preferable to use its SAR ADC versus an external solution?: The CY8C4147LQE-S273T offers two 12-bit SAR ADCs sampling at up to 1 MSPS each and sixteen 10-bit channels sampling at 500 kSPS. While these meet moderate resolution needs for sensor monitoring, they lack the linearity and noise performance of high-end delta-sigma converters. For example, measuring small thermistor changes in engine coolant requires higher effective resolution than 12 bits can offer without oversampling. In such cases, an external IC like the TI ADS124S08 provides better SNR (>90dB) and integrated PGA. Conversely, when cost, space, and integration matter—such as reading multiple resistive touch inputs via CapSense—the on-chip ADC eliminates need for separate analog front ends, reducing BOM and layout complexity.

Is the CY8C4147LQE-S273T suitable for functional safety-critical automotive subsystems, and what development tools or certification support exist for ISO 26262 compliance?: The CY8C4147LQE-S273T itself is not qualified for ASIL levels under ISO 26262 but is AEC-Q100 Grade 1 certified, indicating suitability for general automotive use where moderate reliability suffices. For safety-critical functions requiring diagnostic coverage or lockstep processing, additional hardware redundancy or software mitigations would be necessary. Tools like PSoC Creator and ModusToolbox provide static analysis and code generation aids that help meet coding standards (MISRA C). However, full ISO 26262 compliance demands third-party assessments beyond silicon capabilities—designers should consult Infineon’s safety manuals and consider partnering with certified toolchains if targeting ASIL-B or higher.

What are the implications of using the CY8C4147LQE-S273T in humid or corrosive environments, given its wettable flank package and moisture sensitivity level?: The CY8C4147LQE-S273T uses a 40-QFN package with wettable flanks, enhancing solder joint inspection and resistance to electrochemical migration under humid conditions. With an MSL rating of 3 (168 hours), it can withstand two reflow cycles after storage in ambient conditions without baking, simplifying manufacturing logistics. However, in coastal or industrial settings with elevated chloride exposure, conformal coating is strongly advised to prevent dendrite formation between adjacent pins, particularly on the exposed pad. Proper handling per J-STD-033 ensures long-term reliability in mission-critical applications.

How many simultaneous communications protocols can the CY8C4147LQE-S273T actively drive, and what resource conflicts might arise when combining SPI, UART, and LINbus in a single design?: The CY8C4147LQE-S273T supports multiple interfaces simultaneously: one SSP/SPI, one UART/USART, I2C, and LINbus via reconfigurable pins. All four can operate concurrently since they utilize distinct peripheral blocks rather than shared buses. However, UART and LINbus both require precise baud rate generators; mismatched configurations may cause framing errors. Additionally, limited DMA channels mean transferring large SPI packets could temporarily block UART interrupts. Designers should map high-priority traffic (e.g., LIN responses) to dedicated DMA streams and validate timing budgets under worst-case CPU load scenarios.

What development ecosystem and debugging capabilities are available for the CY8C4147LQE-S273T, and how do they compare to open-source alternatives for rapid prototyping?: Infineon provides PSoC Creator IDE with graphical configuration tools for CapSense, PWM, and analog blocks, streamlining initial setup. Debugging relies on the MiniProg4 programmer/debugger supporting breakpoints, watch windows, and real-time variable monitoring. While less flexible than JTAG-based debuggers, MiniProg4 integrates seamlessly with PSOC’s modular design flow. Open-source options like Segger J-Link offer broader MCU support but lack native CapSense calibration wizards. For teams prioritizing rapid iteration on programmable analog features, Infineon’s toolchain reduces development time despite higher licensing costs compared to free GCC toolchains with limited GUI assistance.

Does the CY8C4147LQE-S273T include any security features for protecting firmware integrity, and how can developers safeguard code in production vehicles?: The CY8C4147LQE-S273T supports read protection via flash locking mechanisms and has a unique device ID for anti-cloning. However, it lacks hardware cryptographic accelerators or secure boot ROMs found in higher-end MCUs. To protect intellectual property, developers should enable flash write-protection after programming and store sensitive keys in reserved NVM sectors. Over-the-air updates require secure transport layers (e.g., TLS) implemented in software, increasing code size and risk of side-channel attacks. Given its entry-level security posture, this MCU is best suited for non-connected or isolated subsystems where physical access is controlled.

What is the expected lifespan and failure rate model for the CY8C4147LQE-S273T in continuous 125°C operation, and how does aging affect Flash endurance?: Operating continuously at 125°C accelerates wear-out mechanisms such as gate oxide degradation and charge leakage in flash cells. Typical endurance for modern embedded flash is 10k cycles at 125°C, though Infineon specifies minimum 10k writes for this device. At elevated temperatures, cycle life drops exponentially; extrapolating from Arrhenius models, expect ~1k cycles at 150°C. End-of-life criteria usually target bit error rates exceeding 1E-6. Applications requiring frequent firmware updates should implement wear leveling or reserve spare blocks to extend usable lifetime beyond nominal specifications.

How does the power-on reset (POR) and brown-out detection (BOD) circuitry behave during voltage dips common in automotive loadshedding events?: The CY8C4147LQE-S273T includes a BOD that monitors Vdd with typical thresholds at 2.7V and 3.0V, triggering a reset when voltage falls below setpoint. During cold starts or load dumps, if Vdd drops momentarily but recovers above threshold, the device resets cleanly without corrupted states. However, rapid transients (<1ms) may bypass BOD response due to comparator latency. Designers should add bulk decoupling capacitors near Vdd/Vss pins to filter ripple and ensure stable startup sequences, especially when driving capacitive loads or high-current peripherals simultaneously.

What are the recommended decoupling strategies for the CY8C4147LQE-S273T in high-noise automotive environments, and how do ceramic capacitor values impact stability?: Place 100nF X7R/X5R MLCCs as close as possible to each Vdd/Vss pair, plus one 10µF tantalum or polymer cap near the package to handle transient currents. High ESR electrolytics are unsuitable due to slow response times. Ceramic values below 10nF exhibit piezoelectric noise and microphonics; above 1µF suffer from voltage-dependent capacitance loss at DC bias. Automotive EMI regulations mandate strict conducted emissions limits, so proper decoupling reduces loop area and suppresses radiated interference from switching loads, ensuring reliable operation near ignition coils or DC-DC converters.

Can the CY8C4147LQE-S273T drive LCD segments directly, and what limitations apply to segment count and refresh rate?: Yes, the device embeds an LCD controller capable of driving up to 40 segments with internal charge pumps generating 3.3V bias voltages. Maximum drive frequency is 160Hz, limiting display types to basic alphanumeric or simple icons. Complex graphics requiring higher contrast or faster updates necessitate external drivers. Segment duty ratios are fixed at 1/3 or 1/4, constraining brightness uniformity. For dashboards or instrument clusters, external multiplexers expand segment capacity but increase component count and power consumption, trade-offs that may favor alternative MCUs with more flexible display interfaces.

What is the maximum allowable continuous sink/source current per I/O pin, and how should output stages be configured when driving LEDs or relays?: Each I/O pin on the CY8C4147LQE-S273T can source/sink up to 20mA continuously, with total package limit around 100mA for all pins combined. Driving LEDs directly at 20mA provides bright illumination but risks exceeding thermal limits during prolonged use. For relay coils drawing 50–100mA, use external transistors with flyback diodes to isolate inductive kickback from MCU pins. Always verify Voh/Vol specs under load to maintain logic levels; marginal margins reduce noise immunity in noisy automotive buses. Current-limiting resistors or constant-current sources improve LED longevity and color consistency across temperature variations.

How does the watchdog timer (WDT) implementation differ from traditional windowed WDTs, and what recovery strategies does it enable for soft faults?: Unlike windowed watchdogs requiring precise feed timing, the CY8C4147LQE-S273T employs a free-running WDT that resets the system if not serviced within a fixed period—typically 1–2 seconds. This simplifies software design by removing timing constraints but offers less granular fault detection. Upon reset, the application should enter a safe state and attempt self-diagnosis: check stack pointers, validate peripheral registers, or log error codes to non-volatile memory. Combined with Brown-Out Detect and Power-On Reset, this forms a robust fault containment strategy for intermittent glitches common in vehicle electrical systems.

What is the typical start-up time from reset assertion to first instruction execution, and how does it affect bootloader design for field updates?: After POR, the CY8C4147LQE-S273T begins executing code within 10–20 µs assuming internal oscillator stabilization completes in <50 µs. Bootloaders must account for this latency when polling serial interfaces or validating headers. If using external crystals, start-up delays increase to milliseconds, complicating timeout-sensitive protocols like UART-based DFU. Designers often preload critical vectors into RAM or use dual-bank flash to enable background updates without disrupting running code, ensuring seamless firmware upgrades even in live vehicles.

How does the CY8C4147LQE-S273T handle electromagnetic compatibility (EMC) during fast slew-rate transitions, and what PCB layout practices mitigate radiated emissions?: Fast digital edges generate broadband noise that couples onto signal lines or power planes. The CY8C4147LQE-S273T’s QFN package minimizes lead inductance, aiding EMC performance, but layout remains critical. Route high-speed traces (SPI, LIN) away from analog inputs and use guard rings around sensitive nodes. Split power planes carefully to avoid return path discontinuities, and place ground vias near signal returns to reduce loop areas. Adding series termination resistors (22–100Ω) at driver outputs dampens reflections and lowers di/dt, decreasing conducted emissions measured per CISPR 25 standards in automotive test chambers.

Parts with Similar Specifications

The three parts on the right have similar specifications to Infineon Technologies CY8C4147LQE-S273T

Product Attribute
Part Number	CY8C4147LQE-S253T	CY8C4147LQE-S273	CY8C4147LQE-S243T	CY8C4147LQE-S283T
Manufacturer	Infineon Technologies	Infineon Technologies	Infineon Technologies	Infineon Technologies
Program Memory Type	-	-	-	-
Core Processor	-	-	-	-
Core Size	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Oscillator Type	-	-	-	-
Peripherals	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Speed	-	-	-	-
Series	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Program Memory Size	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Number of I/O	-	-	-	-
RAM Size	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Data Converters	-	-	-	-
Connectivity	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
EEPROM Size	-	-	-	-

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Customer Reviews

Evaluation: 10 Articles

ECUb***h

Sep 22, 2026

Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
RS48***ieldTech

Sep 16, 2026

Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
Logi***b_Chris

Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
Circ***FixerTom

Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
Andr***PCBLab

Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
Leat***O'Keefe

Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
Indu***ialPower

Aug 17, 2026

Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.
Nikh***ech

Aug 13, 2026

Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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America	United States	5
America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
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Middle East	Israel	6

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