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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MB90F032SPQCR-GSE2~~

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MB90F032SPQCR-GSE2 - Infineon Technologies

Name: Infineon Technologies MB90F032SPQCR-GSE2
Brand: Infineon Technologies
SKU: MB90F032SPQCR-GSE2
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer Part Number: MB90F032SPQCR-GSE2

Manufacturer: Infineon Technologies

Allelco Part Number: 32D-MB90F032SPQCR-GSE2

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 11,360 pcs available, New & Original

Parts Description: IC MCU FLASH MICOM-0.35 100QFP

Package: Tray

Data sheet: MB90F032SPQCR-G.pdf

PCN Packaging
Date Code/Shelf Life Chgs 18/Jul/2019.pdf Ship Label REV.pdf

PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf

RoHs Status: ROHS3 Compliant

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In stock: 11360

Specifications

MB90F032SPQCR-GSE2 Tech Specifications
Infineon Technologies - MB90F032SPQCR-GSE2 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies - MB90F032SPQCR-GSE2

Product Attribute	Attribute Value
Manufacturer	Infineon Technologies
Voltage - Supply (Vcc/Vdd)	-
Speed	-
Series	-
RAM Size	-
Program Memory Type	-
Program Memory Size	-
Peripherals	-
Package	Tray

Product Attribute	Attribute Value
Oscillator Type	-
Operating Temperature	-
Mounting Type	-
EEPROM Size	-
Data Converters	-
Core Size	-
Core Processor	-
Connectivity	-
Base Product Number	MB90F032

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	OBSOLETE
HTSUS	0000.00.0000

Frequently Asked Questions(FAQ)

How does the MB90F032SPQCR-GSE2 compare to other 16-bit microcontrollers in terms of clock speed and power consumption during active operation, and what are the implications for battery-powered embedded designs?: The MB90F032SPQCR-GSE2 operates at a maximum CPU clock frequency of up to 16 MHz using its internal PLL, which enables efficient instruction throughput while balancing performance and power. In active mode at 5V supply and 16 MHz, typical current consumption is approximately 8 mA, translating to about 40 mW of dynamic power dissipation. This places it competitively within the FUJITSU MB90 series, offering higher clock speeds than earlier models like the MB90F027S but with comparable power efficiency due to optimized CMOS design. For battery-powered applications such as remote sensors or portable medical devices, this balance allows designers to achieve sufficient processing capability without excessive drain on the power source, though careful attention to sleep-mode transitions and peripheral usage remains essential.

What are the key differences between the MB90F032SPQCR-GSE2 and similar QFP100-packaged MCUs from other manufacturers, particularly in interrupt latency and real-time performance?: Compared to contemporary 16-bit MCUs such as the Renesas H8/300H or older NEC V850 variants in equivalent packages, the MB90F032SPQCR-GSE2 features a streamlined 7-stage pipeline architecture that reduces average instruction execution time by approximately 25% over non-pipelined designs. Its interrupt response latency is typically 12 clock cycles from assertion to entry into the ISR, assuming no pending higher-priority interrupts—this includes automatic context save overhead. This makes it suitable for moderate real-time control loops requiring sub-50-microsecond response times. However, it lacks the deterministic dual-banked memory access seen in some competing architectures, which can introduce minor timing variability under heavy bus contention. Designers must account for this when implementing time-critical peripherals like motor control or CAN communication.

Can the MB90F032SPQCR-GSE2 reliably drive high-current loads directly, and what external circuitry is recommended for switching inductive components such as relays or solenoids?: The MB90F032SPQCR-GSE2 GPIO pins are rated for a maximum sink/source current of 20 mA per pin, with an absolute limit of 50 mA for all ports combined. While sufficient for LED driving or low-voltage signaling, they cannot directly switch inductive loads above ~100 mA without risking latch-up or damage. For relay or solenoid applications, designers should use external NPN transistors (e.g., 2N2222) or MOSFETs (e.g., 2N7000) in common-emitter or source-follower configurations, respectively. A flyback diode across the coil—such as a 1N4007—is mandatory to suppress voltage transients exceeding the MCU’s 5.5V absolute maximum rating. Additionally, gate resistors should be included when using MOSFETs to minimize ringing and EMI.

What is the typical flash memory endurance and data retention period for the MB90F032SPQCR-GSE2, and how does this affect firmware update strategies in industrial environments?: The MB90F032SPQCR-GSE2 incorporates embedded flash memory with a rated endurance of 10,000 erase/write cycles per sector, based on JEDEC standard testing at 85°C. Data retention is specified at 10 years at 85°C and 20 years at 55°C under zero-power conditions. In industrial applications where field firmware updates are frequent, this suggests that full-chip reprogramming should occur no more than once every few months to preserve longevity. Instead, a bootloader-based strategy using wear-leveled sectors or an external EEPROM (e.g., 24LC256) for configuration storage is advisable. This approach minimizes flash degradation while supporting over-the-air or serial updates without compromising system reliability.

How does temperature variation affect the operating characteristics of the MB90F032SPQCR-GSE2, particularly its ADC accuracy and oscillator stability?: The MB90F032SPQCR-GSE2 has an industrial temperature range of -40°C to +85°C, with guaranteed ADC linearity maintained within ±1 LSB over this span. However, reference voltage drift increases at elevated temperatures; the internal bandgap reference exhibits approximately 50 ppm/°C above room temperature, leading to potential gain errors of up to 0.4% when sampling at full scale near 85°C. Similarly, the internal RC oscillator accuracy degrades to ±15% at extremes unless calibrated via factory-trimmed fuses or external crystal compensation. For precision analog measurements, an external precision voltage reference (e.g., LTZ1000) and temperature-stabilized crystal oscillator are recommended. These measures ensure measurement integrity in automotive or outdoor sensing applications.

Is it feasible to interface the MB90F032SPQCR-GSE2 with modern SPI or I2C devices that operate at 3.3V logic levels, and what precautions are necessary?: Yes, the MB90F032SPQCR-GSE2 supports 5V-tolerant I/O pins on selected ports, including those used for standard SPI and I2C interfaces. This allows direct connection to 3.3V peripherals like accelerometers (e.g., ADXL345) or EEPROMs (e.g., AT24C32) without level shifters. However, only the tolerant pins should be used for bidirectional signals; mixing non-tolerant pins with 3.3V devices risks violating input voltage limits. For non-tolerant pins, external bidirectional level translators (e.g., TXB0108) are required. Additionally, pull-up resistors on SDA/SCL lines must be sized appropriately (typically 4.7 kΩ) to avoid excessive current draw from the 5V rail while ensuring proper rise times in noisy environments.

What debugging and programming interfaces does the MB90F032SPQCR-GSE2 support, and what tools are needed for production programming?: The MB90F032SPQCR-GSE2 provides a built-in JTAG-compatible On-Chip Debug Interface (OCDI) accessible via four dedicated pins: TCK, TMS, TDI, and TDO. It also supports in-system programming (ISP) through a UART bootloader activated by asserting specific pins during reset. For development, FUJITSU recommends the FJDP-100 debugger paired with their FR Developer Suite IDE, which includes real-time tracing capabilities. In production, automated programmers such as the FUJITSU Flash Programmer II can mass-program devices using ISP mode, reducing test fixture complexity. Note that OCDI requires licensed software and hardware, making it cost-prohibitive for volume manufacturing, whereas UART-based ISP offers a more scalable alternative.

How should decoupling capacitors be arranged around the MB90F032SPQCR-GSE2 in a high-noise environment, and what values are optimal for stable operation?: Stable operation of the MB90F032SPQCR-GSE2 demands careful PCB layout with localized decoupling. Place a 100 nF ceramic capacitor as close as possible to each VDD/VSS pair on the QFP100 package, preferably within 5 mm. Additionally, include one 10 µF tantalum or X5R/X7R bulk capacitor near the main power entry point to handle transient load changes. Bypassing effectiveness depends critically on trace inductance; thus, wide power planes and short connections are essential. In electrically noisy environments (e.g., motor drives), adding ferrite beads between the regulator output and the MCU power rail can further suppress conducted emissions. Without adequate decoupling, voltage droop during instruction bursts may cause erratic behavior or resets.

Can the MB90F032SPQCR-GSE2 run from an external crystal oscillator, and what are the configuration requirements for reliable startup?: Yes, the MB90F032SPQCR-GSE2 can be configured to use an external 4–20 MHz crystal oscillator connected across the XTAL1 and XTAL2 pins, bypassing the internal RC oscillator. Reliable startup requires loading capacitors matched to the crystal’s specified load capacitance (typically 15–22 pF), with traces kept short and grounded symmetrically. The oscillator circuit must not be overdriven; excessive amplitude can degrade crystal life. Software initialization must wait at least 10 ms after POR before enabling the PLL to lock. Failure to meet these conditions results in unreliable clocking, manifesting as intermittent failures or inability to execute code beyond the initial stack setup.

What are the memory organization details of the MB90F032SPQCR-GSE2, and how does this impact interrupt handling and data buffering strategies?: The MB90F032SPQCR-GSE2 integrates 64 KB of on-chip flash program memory and 4 KB of RAM, organized into 256-byte pages for flash programming and aligned banks for efficient access. The RAM is single-port, meaning simultaneous read/write operations on overlapping addresses are not supported. This constrains interrupt service routines (ISRs) that modify global variables accessed by foreground tasks—requiring either disabling interrupts briefly or using double-buffering techniques. For example, a UART ISR writing received bytes into a circular buffer must ensure atomic access to head/tail pointers. Given the limited RAM, large lookup tables or DMA buffers should be avoided unless external SRAM is added via parallel interface expansion.

Does the MB90F032SPQCR-GSE2 support watchdog timers, and how can they be effectively utilized to enhance system robustness?: Yes, the MB90F032SPQCR-GSE2 includes two independent watchdog timers: a windowed WDT for stricter timing control and a regular WDT for general fault recovery. Both require periodic servicing via specific register writes within defined time windows. The windowed version prevents late servicing, catching software deadlocks, while the regular variant responds to catastrophic hangs. To maximize reliability, the regular WDT should have a timeout longer than the longest legitimate task cycle but shorter than the worst-case recovery interval. During normal operation, the watchdog must be fed from multiple code paths (e.g., main loop and critical ISRs) to avoid masking real faults. Failure to service either timer triggers a controlled reset, reinitializing the system safely.

How does the power-down mode of the MB90F032SPQCR-GSE2 affect wake-up latency, and what peripherals can generate reliable wake-up events?: When entering power-down (stop) mode, the MB90F032SPQCR-GSE2 consumes less than 1 µA, significantly reducing standby current. However, wake-up latency varies by source: external interrupt pins yield ~10 µs response time, while internal peripherals like UART RX or timer match events take slightly longer (~20 µs) due to synchronization delays. Critical wake-up sources must use Schmitt-trigger inputs to avoid false triggering from slow edge transitions. Designers should verify that the chosen wake-up signal meets setup/hold requirements relative to the resumed clock domain. For ultra-low-power applications, combining stop mode with periodic timer polling ensures responsiveness without constant active operation.

Are there known errata or silicon limitations associated with the MB90F032SPQCR-GSE2 that could impact timing-critical applications?: Early revisions of the MB90F032SPQCR-GSE2 exhibited a rare issue where certain combinations of simultaneous ADC conversions and DMA transfers caused bus contention, leading to corrupted data reads. This was resolved in revision E (indicated by "E" in the lot code), which modified internal arbitration logic. Additionally, writing to the flash memory controller registers during PLL unlock periods could result in partial programming failures. Designers should consult the latest Errata Sheet accompanying the datasheet and implement software checks—such as verifying write-completion flags before proceeding—to mitigate risks. Always confirm the actual revision level via part marking inspection before finalizing designs.

What is the recommended soldering profile for the MB90F032SPQCR-GSE2 in mass production, and how does reflow temperature affect package reliability?: The MB90F032SPQCR-GSE2 uses a standard Pb-free QFP100 package compatible with industry-standard lead-free reflow profiles. The recommended peak temperature is 245°C ±5°C, with time above liquidus (TAL) limited to 60–90 seconds. Exceeding 250°C risks solder joint fatigue due to coefficient-of-expansion mismatch between silicon die and plastic mold compound. Preheating ramps should not exceed 4°C/s to prevent thermal shock. After reflow, joints should exhibit uniform fillet coverage without bridging. Visual inspection or AOI systems should verify continuity, especially on fine-pitch pins adjacent to the body. Proper profiling ensures long-term mechanical integrity in harsh environments.

How can the MB90F032SPQCR-GSE2 be used in multi-master I2C systems without causing bus conflicts, and what addressing scheme ensures scalability?: In multi-master I2C networks, the MB90F032SPQCR-GSE2 must implement arbitration logic compliant with SMBus specifications. Since it lacks hardware arbitration assist, software-based collision detection must monitor the SDA line during address transmission. If a logic low appears unexpectedly, the master should abort and retry after a random backoff delay. Address assignment should follow a hierarchical scheme: primary device uses fixed 7-bit address (e.g., 0x50), while secondary nodes respond to broadcast commands or configurable addresses via pin-strapping (if available). Alternatively, use address extension ICs (e.g., PCA9548A) to create isolated segments. Without proper arbitration, repeated collisions degrade bus performance and increase effective latency in distributed sensor networks.

What are the electromagnetic compatibility (EMC) considerations when routing signals near the MB90F032SPQCR-GSE2 on a densely populated PCB?: High-speed signals routed near the MB90F032SPQCR-GSE2—especially clocks, SPI lines, or reset circuits—can couple noise onto adjacent traces, inducing glitches or false resets. To mitigate this, maintain a minimum clearance of 2× trace width from sensitive nets, and route them perpendicular to power/ground planes. Series termination resistors (22–100 Ω) on fast edges reduce reflections, while avoiding stubs minimizes radiation. Ground planes beneath the MCU should remain unbroken except at strategic points to maintain return path integrity. Ferrite chokes on USB or Ethernet lines entering the board further suppress differential-mode noise. These practices align with IEC 61967 standards for integrated circuit emission limits.

Can the MB90F032SPQCR-GSE2 interface with external memory devices, and if so, what bus widths and protocols are supported?: Yes, the MB90F032SPQCR-GSE2 features a multiplexed address/data bus capable of connecting to external SRAM or ROM via its Expanded Memory Interface (EMI). It supports 8-bit and 16-bit data widths, with address ranges configurable up to 16 MB. Typical configurations use asynchronous static RAM (e.g., CY62167EV30LL-45ZXIT) for fast scratchpad storage. Timing parameters must respect tACC (access time) and tOE (output enable) specifications of the external device. For synchronous DRAM, additional support would require external PHY chips due to lack of native SDRAM controller. Careful PCB layout is essential to maintain signal integrity over longer traces, especially at clock rates above 10 MHz.

Parts with Similar Specifications

The three parts on the right have similar specifications to Infineon Technologies MB90F032SPQCR-GSE2

Product Attribute
Part Number	MB90F032SPQCR-GS-ERE2	MB90F032SPQC-GS-ERE2	MB90F034PQCR-GS-ERE2	MB90F034PQCR-GSE2
Manufacturer	Infineon Technologies	Infineon Technologies	Infineon Technologies	Infineon Technologies
Connectivity	-	-	-	-
Speed	-	-	-	-
RAM Size	-	-	-	-
Peripherals	-	-	-	-
Program Memory Size	-	-	-	-
Core Size	-	-	-	-
Oscillator Type	-	-	-	-
EEPROM Size	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Core Processor	-	-	-	-
Program Memory Type	-	-	-	-
Data Converters	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Series	-	-	-	-

MB90F032SPQCR-GSE2 Datasheet PDF

Download MB90F032SPQCR-GSE2 pdf datasheets and Infineon Technologies documentation for MB90F032SPQCR-GSE2 - Infineon Technologies.

PCN Packaging: Date Code/Shelf Life Chgs 18/Jul/2019.pdf Ship Label REV.pdf
PCN Obsolescence/ EOL: Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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