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S25FL256LDPNFV011 - Infineon Technologies

Name: Infineon Technologies S25FL256LDPNFV011
Brand: Infineon Technologies
SKU: S25FL256LDPNFV011
Price: 0.099 USD
Availability: InStock
Rating: 5 (7 reviews)

Manufacturer Part Number: S25FL256LDPNFV011

Manufacturer: Infineon Technologies

Allelco Part Number: 98D-S25FL256LDPNFV011

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 40,487 pcs available, New & Original

Parts Description: IC FLASH 256MBIT SPI/QUAD 8WSON

Package: 8-WSON (6x8)

Data sheet: S25FL256LDPNFV0.pdf

PCN Packaging
Date Code/Shelf Life Chgs 18/Jul/2019.pdf Ship Label REV.pdf

RoHs Status: ROHS3 Compliant

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In stock: 40487

Unit Price: $0.269
Subtotal: $0.00

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Quantity	Unit Price	Ext. Price
1+	$0.269	$0.27
200+	$0.104	$20.80
500+	$0.101	$50.50
1230+	$0.099	$121.77

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

S25FL256LDPNFV011 Tech Specifications
Infineon Technologies - S25FL256LDPNFV011 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies - S25FL256LDPNFV011

Product Attribute	Attribute Value
Manufacturer	Infineon Technologies
Write Cycle Time - Word, Page	-
Voltage - Supply	2.7V ~ 3.6V
Technology	FLASH - NOR
Supplier Device Package	8-WSON (6x8)
Series	FL-L
Package / Case	8-WDFN Exposed Pad
Package	Tube
Operating Temperature	-40°C ~ 105°C (TA)

Product Attribute	Attribute Value
Mounting Type	Surface Mount
Memory Type	Non-Volatile
Memory Size	256Mbit
Memory Organization	32M x 8
Memory Interface	SPI - Quad I/O, QPI
Memory Format	FLASH
Clock Frequency	66 MHz
Base Product Number	S25FL256

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991B1A
HTSUS	8542.32.0071

Frequently Asked Questions(FAQ)

How does the S25FL256LDPNFV011 support high-speed data transfer in embedded systems with limited pin count, and what are the key interface trade-offs involved?: The S25FL256LDPNFV011 leverages a Quad I/O SPI interface alongside QPI to achieve up to 66 MHz operation while maintaining an 8-pin package footprint. This enables efficient parallel data transfers without requiring additional GPIO lines, making it suitable for space-constrained designs such as wearables or IoT nodes. However, the use of QPI increases protocol complexity and may necessitate firmware-level optimizations to fully exploit bandwidth. Designers must weigh these benefits against potential latency overheads when compared to standard SPI implementations.

What is the impact of operating voltage range (2.7V–3.6V) on system power budgeting when integrating the S25FL256LDPNFV011 into battery-powered devices?: Operating across 2.7V to 3.6V allows compatibility with both legacy 3.3V logic and newer low-voltage microcontrollers, but introduces challenges in power sequencing and noise margins. At lower supply voltages, signal integrity can degrade due to reduced drive strength and increased susceptibility to electromagnetic interference. Additionally, write operations typically consume more current during programming pulses; thus, average power consumption depends heavily on usage patterns. Engineers should account for worst-case current draw during erase/write cycles when estimating total energy per cycle.

Can the S25FL256LDPNFV011 be used in automotive-grade applications given its -40°C to +105°C temperature rating, and what design precautions are necessary?: While the S25FL256LDPNFV011 meets industrial temperature requirements, it lacks formal AEC-Q100 qualification, which limits its direct use in safety-critical automotive subsystems. If deployed in non-safety functions—such as infotainment logging—extra caution is needed regarding thermal cycling stress, solder joint reliability, and long-term data retention under fluctuating temperatures. Layout practices should include adequate ground planes and decoupling capacitors near the package to minimize thermal gradients and voltage transients.

How does the memory organization (32M x 8) influence sector-based erase strategies in firmware development using the S25FL256LDPNFV011?: With a fixed page size implied by the 32M x 8 structure, firmware must manage writes within logical blocks that align with the device’s internal architecture. Although not explicitly stated in the parameter list, typical flash sectors in this family range from 4KB to 64KB, requiring careful mapping between application data structures and physical erase units. Misaligned updates risk partial overwrites or corruption unless buffered appropriately. Developers should consult the full datasheet for exact block boundaries to avoid unintended side effects.

In what scenarios would the QPI mode of the S25FL256LDPNFV011 outperform conventional SPI, and at what point do the added complexities outweigh the benefits?: QPI provides four bidirectional data lines, enabling eight times the command throughput compared to single-bit SPI commands. This is advantageous for bulk read operations in bootloader contexts or real-time logging where latency matters. However, enabling QPI requires precise timing calibration and may increase code complexity due to dual-edge clocking and setup/hold constraints. For applications with sporadic access patterns or limited CPU resources, the overhead of managing QPI may reduce overall efficiency despite higher peak bandwidth.

What considerations apply when selecting pull-up resistors for the chip select line of the S25FL256LDPNFV011 in noisy industrial environments?: Strong pull-ups (e.g., 4.7kΩ) ensure reliable assertion of CS# during power-up resets but increase susceptibility to false triggering from capacitive coupling. Weaker values (10kΩ–22kΩ) reduce loading but require stronger drive from the microcontroller. In electrically harsh settings, adding a series resistor (22Ω–100Ω) with a moderate pull-up helps dampen reflections and improve signal integrity. The optimal value depends on trace length, board material, and expected noise levels.

How does the lack of RoHS compliance affect supply chain decisions involving the S25FL256LDPNFV011 in consumer electronics manufacturing?: Non-RoHS status implies restricted lead content and potentially other hazardous substances, limiting adoption in end markets requiring strict environmental certification. Manufacturers sourcing this part must verify alternate availability through qualified suppliers or consider migration paths to compliant variants like the S25FL256LNP. Using non-compliant components risks production delays if audits reveal violations, even if the component itself performs nominally.

When comparing the S25FL256LDPNFV011 to similar-density NOR flashes, what architectural differences might affect write endurance or block protection mechanisms?: Unlike some competitors using uniform block sizes, the FL-L series often employs mixed-size sectors (e.g., one-time-programmable vs. multi-write regions), which impacts how wear leveling is applied in firmware. Additionally, certain protection schemes lock entire arrays via status registers rather than per-block control, making selective security less granular. These design choices influence how frequently specific regions can be updated before reaching write cycle limits—typically around 100,000 cycles for standard blocks.

What role does the exposed pad on the 8-WSON (6x8) package play in thermal management for the S25FL256LDPNFV011, and how should it be handled during PCB assembly?: The exposed pad acts as a thermal conduit and mechanical anchor, improving heat dissipation from internal bond wires and enhancing solder joint reliability. It must be soldered directly to a dedicated copper plane with multiple vias to the inner layers. Leaving it floating or improperly connected can cause intermittent failures or accelerated degradation. During reflow, sufficient solder paste volume ensures good adhesion and electrical continuity.

Why might a developer choose the tube packaging option for the S25FL256LDPNFV011 instead of tape-and-reel, and what are the implications for inventory handling?: Tube packaging suits low-volume prototyping or custom assembly lines where automated pick-and-place equipment is unavailable. It reduces upfront costs but increases manual handling risks, including ESD exposure and misalignment during insertion. For mass production, switching to reel packaging improves throughput and lowers defect rates. Inventory turnover also slows with tubes due to slower consumption rates, potentially leading to obsolescence if demand shifts unexpectedly.

How does the absence of Moisture Sensitivity Level (MSL) classification inform storage and handling procedures for the S25FL256LDPNFV011?: An MSL "Not Applicable" designation suggests the component is inherently stable against humidity-induced damage, possibly due to hermetic sealing or robust packaging materials. Nonetheless, prolonged exposure to high-humidity environments before assembly could still compromise solderability or promote electrochemical migration. Standard anti-static protocols remain essential, and storage should follow general IPC guidelines regardless of MSL labeling.

What are the performance implications of using the S25FL256LDPNFV011 in continuous streaming read modes versus burst accesses?: Continuous streaming reads benefit from QPI-enabled pipelining, allowing sustained throughput near 264 Mbps (assuming DDR at 66 MHz). However, interruptions in the clock or bus contention can stall the pipeline, causing latency spikes. Burst modes optimize for short, repeated accesses common in code execution, reducing command overhead. Real-world performance hinges on how well the host controller manages prefetch buffers and avoids backpressure during sustained transfers.

How should system designers validate data retention claims for the S25FL256LDPNFV011 beyond datasheet specifications?: Beyond the guaranteed 20-year retention at 85°C, empirical validation involves accelerated aging tests at elevated temperatures (e.g., 125°C) over thousands of hours, followed by functional verification of stored data. Endurance testing should simulate realistic erase/write cycles representative of actual workloads. Correlation between lab results and projected field life requires statistical modeling of Arrhenius parameters and usage profiles.

What firmware-level safeguards are recommended to prevent corruption during power loss events involving the S25FL256LDPNFV011?: Implementing transactional update patterns—where new data is written to a temporary region and atomically swapped upon completion—prevents partial writes. Watchdog timers combined with backup capacitors extend window for graceful shutdown during brownouts. Additionally, CRC checks on critical metadata ensure integrity post-reset. These measures mitigate risks posed by abrupt power removal during erase/write phases.

How does the base product number S25FL256 relate to variant differentiation among manufacturers and what pitfalls should engineers avoid?: The base number indicates shared core functionality across families, but pinouts, voltage tolerances, and feature sets diverge significantly between vendors. Using S25FL256LDPNFV011 without verifying package compatibility or timing specs can lead to hardware mismatches. Always cross-reference detailed mechanical and electrical characteristics, especially for clock frequencies, input thresholds, and reset behavior, to ensure interchangeability claims hold true.

Parts with Similar Specifications

The three parts on the right have similar specifications to Infineon Technologies S25FL256LDPNFV011

Product Attribute
Part Number	S25FL256LDPNFV010	S25FL256LDPNFV013	S25FL256LDPNFN011	S25FL256LDPNFI011
Manufacturer	Infineon Technologies	Infineon Technologies	Infineon Technologies	Infineon Technologies
Series	-	-	-	-
Technology	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Memory Organization	-	-	-	-
Write Cycle Time - Word, Page	-	-	-	-
Memory Format	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Clock Frequency	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Memory Interface	-	-	-	-
Memory Size	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Voltage - Supply	-	-	-	-
Memory Type	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C

S25FL256LDPNFV011 Datasheet PDF

Download S25FL256LDPNFV011 pdf datasheets and Infineon Technologies documentation for S25FL256LDPNFV011 - Infineon Technologies.

PCN Packaging: Date Code/Shelf Life Chgs 18/Jul/2019.pdf Ship Label REV.pdf

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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