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Home Products Integrated Circuits (ICs)Memory~~S25FL256SAGBAEA00~~

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S25FL256SAGBAEA00 - Infineon Technologies

Name: Infineon Technologies S25FL256SAGBAEA00
Brand: Infineon Technologies
SKU: S25FL256SAGBAEA00
Price: 74.06 USD
Availability: InStock
Rating: 5 (8 reviews)

Manufacturer Part Number: S25FL256SAGBAEA00

Manufacturer: Infineon Technologies

Allelco Part Number: 98D-S25FL256SAGBAEA00

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 35,241 pcs available, New & Original

Parts Description: IC FLASH 256MBIT SPI/QUAD 24BGA

Package: 24-BGA (8x6)

Data sheet: S25FL256SAGBAEA.pdf

PCN Packaging
Ship Label REV.pdf

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In stock: 35241

Unit Price: $74.06
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Quantity	Unit Price	Ext. Price
1+	$74.06	$74.06

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

S25FL256SAGBAEA00 Tech Specifications
Infineon Technologies - S25FL256SAGBAEA00 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies - S25FL256SAGBAEA00

Product Attribute	Attribute Value
Manufacturer	Infineon Technologies
Write Cycle Time - Word, Page	-
Voltage - Supply	2.7V ~ 3.6V
Technology	FLASH - NOR
Supplier Device Package	24-BGA (8x6)
Series	FL-S
Package / Case	24-TBGA
Package	Tray
Operating Temperature	-55°C ~ 125°C (TA)

Product Attribute	Attribute Value
Mounting Type	Surface Mount
Memory Type	Non-Volatile
Memory Size	256Mbit
Memory Organization	32M x 8
Memory Interface	SPI - Quad I/O
Memory Format	FLASH
Clock Frequency	133 MHz
Base Product Number	S25FL256

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991B1A
HTSUS	8542.32.0071

Frequently Asked Questions(FAQ)

How does the S25FL256SAGBAEA00 compare to other SPI NOR flash memory ICs in terms of data transfer rate and interface efficiency for embedded systems requiring high-speed code execution?: The S25FL256SAGBAEA00 supports a maximum clock frequency of 133 MHz with a Quad I/O SPI interface, enabling burst read speeds up to 532 Mbps under optimal conditions. This represents a significant performance advantage over standard single or dual SPI devices, particularly in applications such as automotive infotainment systems or industrial control units where boot time and application load speed are critical. When compared to similar-density parts like the Winbond W25Q256JV or Micron N25Q256A, which top out at 104 MHz with Dual/Quad I/O, the Infineon device offers improved throughput in systems constrained by limited bus bandwidth.

What are the key reliability considerations when integrating the S25FL256SAGBAEA00 into safety-critical automotive or industrial designs operating across its full temperature range?: Operating across -55°C to +125°C, the S25FL256SAGBAEA00 is qualified for extended ambient temperatures typical of automotive and industrial environments. However, cumulative stress from thermal cycling can accelerate wear-out mechanisms such as oxide degradation and charge leakage in the floating gate transistors. Designers must account for reduced endurance cycles at elevated temperatures—typically derating write/erase cycle counts by approximately 30–50% above 85°C based on JEDEC JESD22-A104 stress testing profiles. Additionally, system-level error detection using ECC or software-based bad block management becomes essential due to increased bit error rates at temperature extremes.

Can the S25FL256SAGBAEA00 be used in parallel with other Flash devices on the same SPI bus without causing signal contention or timing conflicts?: Yes, multiple Flash devices including the S25FL256SAGBAEA00 can share an SPI bus through individual chip-select (CS) lines, provided each device supports unique instruction sets or address spaces. However, careful attention must be paid to CS assertion timing relative to clock edges and output enable delays, especially during Quad I/O operations where data transitions occur on both rising and falling clocks. Misalignment may result in partial byte reads or command corruption. Using hardware CS gating with proper hold times ensures clean transitions between devices.

What impact does supply voltage variation within the 2.7V to 3.6V range have on read/write performance and retention characteristics of the S25FL256SAGBAEA00?: Within the specified supply window, the S25FL256SAGBAEA00 maintains consistent 133 MHz operation, but lower voltages reduce internal programming voltage generation efficiency, potentially increasing page program time by up to 20%. Additionally, data retention drops significantly below 2.9V—especially near 2.7V—due to weakened oxide tunneling currents during erase operations. For mission-critical storage requiring >10-year retention, stable regulation above 3.0V is strongly recommended, particularly in battery-backed or always-on systems.

How does the Moisture Sensitivity Level (MSL) rating of MSL 3 affect handling procedures and shelf-life requirements for bulk-packaged S25FL256SAGBAEA00 components?: With an MSL 3 classification indicating susceptibility to moisture absorption over time, the S25FL256SAGBAEA00 must be stored in dry environments with humidity below 60% RH. If exposed to ambient conditions exceeding 30°C and 80% RH, reflow soldering must occur within 168 hours unless baked per IPC/JEDEC J-STD-033 guidelines. Failure to adhere increases risk of popcorning during reflow, which could compromise solder joints in the fine-pitch 24-BGA package. Proper floor life tracking is essential for high-volume production builds.

Is it feasible to use the S25FL256SAGBAEA00 as primary firmware storage in consumer electronics where cost sensitivity outweighs long-term durability concerns?: While technically viable, using the S25FL256SAGBAEA00 in cost-driven consumer applications introduces trade-offs. Its RoHS non-compliance limits deployment in certain regions, and the lack of advanced features like hardware ECC or secure boot support may necessitate additional MCU overhead. Moreover, consumer devices often experience less controlled environmental conditions than industrial counterparts, reducing effective lifetime despite nominal specifications. Alternative parts with lower BOM cost and RoHS compliance might better align with volume pricing strategies unless performance demands justify this specific model.

What are the implications of using the Quad I/O mode in the S25FL256SAGBAEA00 versus legacy SPI modes for system-level power consumption and EMI?: Enabling Quad I/O mode reduces active power consumption during large block transfers by decreasing active time—since more bits are transferred per clock cycle—but increases peak current draw due to higher switching activity. At 133 MHz, Quad I/O can cut transfer time for a 16KB page from ~1.2 seconds (single SPI) to ~0.3 seconds, improving duty cycle efficiency. However, simultaneous transitions on four data lines generate broader spectral content, potentially violating CISPR 32 radiated emission limits if layout parasitics are not minimized through impedance-controlled routing and decoupling.

How does the 32M x 8 memory organization influence physical address mapping and sector protection granularity in applications using the S25FL256SAGBAEA00?: The 256Mbit capacity organized as 32M × 8 means each row consists of 32 million addresses addressing 8-bit words, resulting in a linear 27-bit address space (128 MB equivalent). Sector protection operates at 4KB boundaries, allowing fine-grained write protection for small code segments. However, this granularity also implies that erasing a protected region requires unlocking all sectors, which can complicate field updates. Compared to larger-sector architectures (e.g., 64KB blocks), this design favors flexibility over erase efficiency in mixed-code-and-data environments.

Parts with Similar Specifications

The three parts on the right have similar specifications to Infineon Technologies S25FL256SAGBAEA00

Product Attribute
Part Number	S25FL256SAGBAEA03	S25FL256SAGBHAA00	S25FL256SAGBHAA03	S25FL256SAGBHBA00
Manufacturer	Infineon Technologies	Infineon Technologies	Infineon Technologies	Infineon Technologies
Memory Format	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Memory Type	-	-	-	-
Technology	-	-	-	-
Voltage - Supply	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Write Cycle Time - Word, Page	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Memory Organization	-	-	-	-
Memory Size	-	-	-	-
Memory Interface	-	-	-	-
Clock Frequency	-	-	-	-
Series	-	-	-	-

S25FL256SAGBAEA00 Datasheet PDF

Download S25FL256SAGBAEA00 pdf datasheets and Infineon Technologies documentation for S25FL256SAGBAEA00 - Infineon Technologies.

PCN Packaging: Ship Label REV.pdf

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

ESD

Certifications & Memberships

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ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
GB/T 27922-2011

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