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S25FL256SAGBHAA00 - Infineon Technologies

Name: Infineon Technologies S25FL256SAGBHAA00
Brand: Infineon Technologies
SKU: S25FL256SAGBHAA00
Availability: InStock
Rating: 5 (6 reviews)

Manufacturer Part Number: S25FL256SAGBHAA00

Manufacturer: Infineon Technologies

Allelco Part Number: 32D-S25FL256SAGBHAA00

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 8,332 pcs available, New & Original

Parts Description: IC FLASH 256MBIT SPI/QUAD 24BGA

Package: 24-BGA (8x6)

Data sheet: S25FL256SAGBHAA.pdf

Datasheets
S25FL128S,256S Supplement.pdf

PCN Packaging
Date Code/Shelf Life Chgs 18/Jul/2019.pdf Ship Label REV.pdf

PCN Design/Specification
Mult Dev Mark REV 9/Jul/2018.pdf

PCN Assembly/Origin
Mult Dev Site Add 14/Dec/2020.pdf

RoHs Status: ROHS3 Compliant

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In stock: 8332

Specifications

S25FL256SAGBHAA00 Tech Specifications
Infineon Technologies - S25FL256SAGBHAA00 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies - S25FL256SAGBHAA00

Product Attribute	Attribute Value
Manufacturer	Infineon Technologies
Write Cycle Time - Word, Page	-
Voltage - Supply	2.7V ~ 3.6V
Technology	FLASH - NOR
Supplier Device Package	24-BGA (8x6)
Series	Automotive, AEC-Q100, FL-S
Package / Case	24-TBGA
Package	Tray
Operating Temperature	-40°C ~ 85°C (TA)

Product Attribute	Attribute Value
Mounting Type	Surface Mount
Memory Type	Non-Volatile
Memory Size	256Mbit
Memory Organization	32M x 8
Memory Interface	SPI - Quad I/O
Memory Format	FLASH
Clock Frequency	133 MHz
Base Product Number	S25FL256

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991B1A
HTSUS	8542.32.0071

Parts Introduction

S25FL256SAGBHAA00 (1)

Manufacturer Part Number

S25FL256SAGBHAA00

Manufacturer

Infineon Technologies

Introduction

The S25FL256SAGBHAA00 is a high-performance, low-power NOR Flash memory chip from Infineon Technologies. It offers a large 256Mbit memory capacity in a compact 24-TBGA package, making it suitable for a wide range of embedded applications.

Product Features and Performance

256Mbit non-volatile FLASH memory

32M x 8 memory organization

SPI Quad I/O interface with up to 133MHz clock frequency

7V to 3.6V operating voltage

Wide operating temperature range of -40°C to 85°C

Fast write cycle time for efficient data storage

Automotive-grade AEC-Q100 qualified

Product Advantages

High memory capacity in a small form factor

Efficient SPI Quad I/O interface for fast data transfer

Wide voltage and temperature range for versatile applications

Automotive-grade quality and reliability

Key Reasons to Choose This Product

Extensive memory capacity for data-intensive applications

Exceptional performance and energy efficiency

Robust automotive-grade design for reliable operation

Compatibility with a wide range of embedded systems

Quality and Safety Features

AEC-Q100 qualified for automotive applications

Rigorous quality control and testing processes

Compliance with industry safety and environmental standards

Compatibility

The S25FL256SAGBHAA00 is compatible with a variety of embedded systems and microcontrollers that support SPI Quad I/O interface.

Application Areas

Automotive electronics

Industrial automation and control systems

Portable devices and consumer electronics

Networking and telecommunications equipment

Medical devices and instrumentation

Product Lifecycle

The S25FL256SAGBHAA00 is an active and currently available product. There are no immediate plans for discontinuation. However, as technology evolves, customers are advised to contact our website's sales team for the latest product information and availability of any potential alternative or equivalent models.

Frequently Asked Questions(FAQ)

How does the S25FL256SAGBHAA00 compare to other SPI NOR flash devices in terms of clock frequency and voltage requirements for automotive-grade applications?: The S25FL256SAGBHAA00 operates at a maximum clock frequency of 133 MHz with a supply voltage range of 2.7V to 3.6V, enabling high-speed data transfer while maintaining compatibility with low-voltage system architectures. This performance profile positions it favorably against standard commercial-grade SPI NOR flashes that typically cap at 108 MHz or operate over wider voltage ranges like 1.65V–3.6V. For automotive designs requiring both speed and voltage flexibility, this device offers a balanced solution within AEC-Q100 qualification standards.

What are the key considerations when selecting the S25FL256SAGBHAA00 for boot code storage in an automotive ECU?: When integrating the S25FL256SAGBHAA00 into automotive ECU boot sequences, engineers must evaluate its 24-BGA (8x6) package footprint, which demands precise PCB layout and reflow soldering control due to fine-pitch ball grid array requirements. Additionally, the device’s Quad I/O SPI interface supports fast read operations critical for accelerated boot times, but firmware must be optimized to leverage command sets like DTR (Double Transfer Rate) if supported. Thermal cycling from -40°C to +85°C operation ensures reliability across environmental extremes common in vehicle deployments.

Can the S25FL256SAGBHAA00 be used interchangeably with the S25FL256SAGBHB10 in production systems without hardware modifications?: No, the S25FL256SAGBHAA00 and S25FL256SAGBHB10 differ in key electrical specifications—particularly in write cycle endurance and possibly timing parameters—which may affect system-level reliability under frequent erase/write cycles. While both share the same base part number and package type, substituting one for the other without verifying datasheet alignment could introduce functional risks in safety-critical automotive contexts where consistent behavior is mandated by ISO 26262 or similar standards.

What impact does moisture sensitivity level (MSL) 3 have on handling and storage of the S25FL256SAGBHAA00 during manufacturing?: With an MSL rating of 3 (168 hours), the S25FL256SAGBHAA00 allows up to 168 hours of exposure to ambient humidity before mandatory baking becomes necessary. This necessitates careful inventory management and adherence to IPC/JEDEC guidelines during SMT assembly to prevent popcorning or interconnect failures. In high-volume automotive production lines, this requires controlled storage environments and real-time tracking of time-to-usage to maintain process integrity.

How does the memory organization of 32M x 8 bits influence system design when using the S25FL256SAGBHAA00?: The 32M x 8-bit organization provides 256 Mbit (32 MB) of addressable space in byte-addressable mode, simplifying software mapping compared to larger-word organizations. However, it also means that each write operation affects full bytes, not half-words or words, which can increase overhead in systems optimized for 16-bit or 32-bit bus widths unless proper alignment is enforced. This structure suits applications like firmware storage where sequential reads dominate access patterns.

Is the S25FL256SAGBHAA00 suitable for functional safety applications requiring ASIL compliance?: While the S25FL256SAGBHAA00 meets AEC-Q100 Grade 1 qualifications and is designed for automotive use, achieving ASIL-rated safety integration depends on additional system-level measures beyond component certification. Engineers must implement error detection mechanisms such as ECC, redundant boot sectors, and secure update protocols to satisfy ASIL requirements defined in ISO 26262. The device itself supports basic status registers and write protection features but does not inherently provide safety-certified functionality.

What trade-offs exist between using the S25FL256SAGBHAA00 versus parallel NOR flash in embedded automotive systems?: Compared to parallel NOR interfaces, the S25FL256SAGBHAA00’s SPI/Quad I/O interface reduces pin count and board complexity, enabling smaller form factors—a critical advantage in space-constrained ECUs. However, parallel flash typically offers lower latency and higher bandwidth for random access, which may benefit performance-sensitive applications. The SPI interface compensates with higher effective throughput via Quad I/O reads, making it viable for most non-real-time code execution paths despite slightly increased protocol overhead.

How should designers validate signal integrity when routing the S25FL256SAGBHAA00 in high-noise automotive environments?: Given the 24-BGA package’s dense pinout and high-speed signaling (up to 133 MHz), trace length matching and impedance control are essential to preserve signal integrity. Differential pairs should be avoided since the interface uses single-ended CMOS logic; instead, focus on minimizing crosstalk through adequate spacing, ground stitching vias, and termination strategies. Simulation models aligned with the device’s timing diagrams help preempt setup/hold violations caused by electromagnetic interference in ignition-rich zones.

What role does the REACH and RoHS compliance status play in global automotive supply chain adoption of the S25FL256SAGBHAA00?: RoHS3 compliance and REACH unaffected status eliminate concerns about restricted substances like lead, cadmium, and phthalates, streamlining regulatory approval across EU, North American, and Asian markets. These certifications reduce legal risk and simplify documentation for OEMs sourcing components globally, particularly important in Tier 1 supplier contracts where material declaration accuracy directly impacts audit outcomes.

Why might a designer choose the S25FL256SAGBHAA00 over an eMMC or SD card alternative in an infotainment system?: Unlike block-based storage solutions such as eMMC or SD cards, the S25FL256SAGBHAA00 provides direct memory-mapped access via SPI, eliminating filesystem layers and reducing software stack complexity. This results in faster boot sequences and deterministic read performance without dependency on card insertion states—critical for head-unit reliability. Additionally, soldered BGA mounting enhances mechanical robustness against vibration, outperforming removable media in harsh automotive conditions.

How does the operating temperature range (-40°C to 85°C) affect long-term reliability of the S25FL256SAGBHAA00 in engine bay-mounted modules?: The extended temperature grade ensures stable operation across cold-start conditions and hot exhaust proximity, preventing data corruption from thermal stress. Over time, repeated thermal cycling can accelerate oxide degradation in floating-gate transistors, but Infineon’s process controls and AEC-Q100 validation mitigate this risk. Still, system designers should avoid sustained operation near upper bounds and incorporate thermal derating into enclosure design to prolong flash lifetime.

What precautions are necessary when programming the S25FL256SAGBHAA00 to ensure data integrity during OTA updates?: During over-the-air updates, the S25FL256SAGBHAA00 must be erased and rewritten in uniform blocks (typically 4KB pages), requiring careful wear leveling to prevent premature failure. Firmware should verify checksums after programming and implement rollback mechanisms in case of interruption. Write protection bits should only be disabled temporarily during updates and re-enabled immediately afterward to safeguard stored calibration data from unintended modification.

Parts with Similar Specifications

The three parts on the right have similar specifications to Infineon Technologies S25FL256SAGBHAA00

Product Attribute
Part Number	S25FL256SAGBHA200	S25FL256SAGBHAA03	S25FL256SAGBHEA00	S25FL256SAGBAEA00
Manufacturer	Infineon Technologies	Infineon Technologies	Infineon Technologies	Infineon Technologies
Memory Interface	-	-	-	-
Write Cycle Time - Word, Page	-	-	-	-
Memory Format	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Memory Type	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Clock Frequency	-	-	-	-
Memory Organization	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Memory Size	-	-	-	-
Voltage - Supply	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Technology	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Series	-	-	-	-

S25FL256SAGBHAA00 Datasheet PDF

Download S25FL256SAGBHAA00 pdf datasheets and Infineon Technologies documentation for S25FL256SAGBHAA00 - Infineon Technologies.

Datasheets: S25FL128S,256S Supplement.pdf
PCN Packaging: Date Code/Shelf Life Chgs 18/Jul/2019.pdf Ship Label REV.pdf
PCN Design/Specification: Mult Dev Mark REV 9/Jul/2018.pdf
PCN Assembly/Origin: Mult Dev Site Add 14/Dec/2020.pdf

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Customer Reviews

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Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.
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FPGA***dio

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This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.
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Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.
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Jul 15, 2026

Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.
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Jul 7, 2026

The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.
Nath***oleman

Jun 29, 2026

Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.
Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

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ISO 9001: 2015
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