About us Contact Us Submit BOM
RFQs(0)
English
Close Menu
View All

Please refer to the English Version as our Official Version.Return

Europe
France(Français) Germany(Deutsch) Italy(Italia) Russian(русский) Poland(polski) Czech(Čeština) Luxembourg(Lëtzebuergesch) Netherlands(Nederland) Iceland(íslenska) Hungarian(Magyarország) Spain(español) Portugal(Português) Turkey(Türk dili) Bulgaria(Български език) Ukraine(Україна) Greece(Ελλάδα) Israel(עִבְרִית) Sweden(Svenska) Finland(Svenska) Finland(Suomi) Romania(românesc) Moldova(românesc) Slovakia(Slovenská) Denmark(Dansk) Slovenia(Slovenija) Slovenia(Hrvatska) Croatia(Hrvatska) Serbia(Hrvatska) Montenegro(Hrvatska) Bosnia and Herzegovina(Hrvatska) Lithuania(lietuvių) Spain(Português) Switzerland(Deutsch) United Kingdom(English)
Asia/Pacific
Japan(日本語) Korea(한국의) Thailand(ภาษาไทย) Malaysia(Melayu) Singapore(Melayu) Vietnam(Tiếng Việt) Philippines(Pilipino)
Africa, India and Middle East
United Arab Emirates(العربية) Iran(فارسی) Tajikistan(فارسی) India(हिंदी) Madagascar(malaɡasʲ)
South America / Oceania
New Zealand(Maori) Brazil(Português) Angola(Português) Mozambique(Português)
North America
United States(English) Canada(English) Haiti(Ayiti) Mexico(español)
HomeProductsIntegrated Circuits (ICs)MemoryS25FL256SAGBHB210
Image may be representation.
See specifications for product details.
Share
 Favorite
EXPRESS OPTION
Payment method

S25FL256SAGBHB210 - Infineon Technologies

Manufacturer Part Number
S25FL256SAGBHB210
Manufacturer
Infineon Technologies
Allelco Part Number
98D-S25FL256SAGBHB210
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
37,277 pcs available, New & Original
Parts Description
IC FLASH 256MBIT SPI/QUAD 24BGA
Package
24-BGA (8x6)
Data sheet
-
RoHs Status
 
Compare
Our certification
In stock: 37277
  • Unit Price: $10.70
  • Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $10.70 $10.70
200+ $4.27 $854.00
500+ $4.13 $2,065.00
1000+ $4.06 $4,060.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

S25FL256SAGBHB210 Tech Specifications
Infineon Technologies - S25FL256SAGBHB210 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies - S25FL256SAGBHB210

Product Attribute Attribute Value
Manufacturer Infineon Technologies
Write Cycle Time - Word, Page 750µs
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NOR (SLC)
Supplier Device Package 24-BGA (8x6)
Series FL-S
Package / Case 24-TBGA
Package Tray
Operating Temperature -40°C ~ 105°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 256Mbit
Memory Organization 32M x 8
Memory Interface SPI - Quad I/O
Memory Format FLASH
Clock Frequency 133 MHz
Access Time 6.5 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN 3A991B1A
HTSUS 8542.32.0071

Frequently Asked Questions(FAQ)

How does the S25FL256SAGBHB210 compare to other SPI NOR flash devices in terms of access time and clock frequency when used in embedded systems requiring fast code execution?
The S25FL256SAGBHB210 offers an access time of 6.5 ns and supports a maximum clock frequency of 133 MHz, which enables efficient read operations even in performance-critical applications. When compared to standard single-bit SPI devices with typical access times exceeding 25 ns, this component provides significantly faster data retrieval, reducing latency during instruction fetches. In contrast, some quad I/O variants may offer similar or higher clock speeds but often at increased power consumption or reduced reliability over temperature. For applications such as automotive control units or industrial motor controllers, where both speed and thermal stability are essential, the balance between 6.5 ns access and 133 MHz operation makes this device particularly suitable for real-time firmware execution.
What are the implications of using the S25FL256SAGBHB210 in high-temperature environments, and how does its operating range support long-term reliability in harsh conditions?
With an extended operating temperature range from -40°C to 105°C, the S25FL256SAGBHB210 is designed for deployment in demanding environments such as automotive under-hood electronics or industrial automation systems. Unlike consumer-grade flash memory limited to 0°C–70°C, this device maintains consistent performance across a wider thermal spectrum. At elevated temperatures, however, write cycle endurance can decrease due to increased electron leakage in the floating gate structure. Engineers should account for accelerated wear by limiting program/erase cycles—typically rated at 100,000 P/E cycles—and distributing writes evenly across sectors. Proper thermal management in PCB layout and system design further ensures sustained reliability throughout the component’s lifespan.
Can the S25FL256SAGBHB210 be used interchangeably with other 256Mb SPI NOR flashes in existing designs without modifying timing parameters or signal integrity measures?
While the S25FL256SAGBHB210 shares a 256Mbit capacity and SPI interface with many competitors, direct interchangeability requires careful evaluation of electrical and operational characteristics. Its 2.7V to 3.6V supply range aligns with common logic levels, but differences in command sets, status register configurations, or quad I/O enablement protocols between vendors may necessitate software changes. Additionally, while all support quad I/O mode, signal integrity at 133 MHz demands proper termination and trace routing on 8x6 BGA packages. Substituting another part without verifying timing margins and protocol compatibility risks intermittent failures in production systems, especially under temperature extremes.
How should system architects evaluate power efficiency when selecting between parallel NAND and serial NOR solutions like the S25FL256SAGBHB210 for boot code storage?
The S25FL256SAGBHB210 consumes static current in the microamp range during standby but draws tens of milliamps during active read operations at 133 MHz. This contrasts with parallel NAND architectures that typically exhibit lower active current per bit accessed but require more complex controller overhead. For boot code scenarios where random access speed outweighs bulk throughput needs, the NOR-based S25FL256SAGBHB210 excels due to its direct execution capability and deterministic access latency. However, if application firmware exceeds several megabytes and sequential streaming dominates, alternative solutions offering higher density at lower cost may justify additional decoding logic despite slower random access.
What considerations apply when implementing wear leveling or bad block management around the S25FL256SAGBHB210 in a user-data storage layer?
Although the S25FL256SAGBHB210 is SLC-type NOR flash with inherently longer endurance than MLC alternatives, it still exhibits finite program/erase cycles—approximately 100,000 cycles per block. Unlike NAND flash, NOR does not suffer from bitline coupling or inter-block interference, so traditional bad block mapping based on erase failures is less critical. Nevertheless, frequent updates to non-volatile configuration data (e.g., calibration tables or logging) can degrade specific sectors prematurely. Implementing logical-to-physical remapping with periodic background garbage collection helps distribute write load. Given NOR’s page size of 256 bytes and block erase time of 750 µs, wear leveling algorithms must account for asymmetric access patterns and avoid thrashing during sustained write workloads.
How does the 24-BGA (8x6) package of the S25FL256SAGBHB210 influence board-level reliability and manufacturing yield compared to larger QFN or SOIC formats?
The compact 24-ball BGA footprint reduces parasitic inductance and capacitance on high-speed signals, supporting stable operation up to 133 MHz. However, it introduces challenges in solder joint inspection and rework due to fine pitch and small pad sizes. During reflow soldering, voiding or bridging risks increase unless stencil printing tolerances are tightly controlled. From a reliability standpoint, the absence of exposed thermal pads limits direct heat sinking, requiring careful attention to adjacent component placement and copper pour strategies to manage junction temperatures within safe limits. Automated optical inspection (AOI) and x-ray verification become essential in high-volume assembly lines using this Infineon part.
In what scenarios would the quad I/O feature of the S25FL256SAGBHB210 provide measurable performance benefits over dual or single SPI modes?
Quad I/O mode enables eight bits of data transfer per clock edge, effectively doubling throughput compared to single I/O and quadrupling it versus standard SPI. For the S25FL256SAGBHB210, this translates to theoretical burst rates approaching 266 Mbps when configured optimally. This becomes advantageous in applications requiring rapid firmware updates, large parameter downloads, or real-time data acquisition from sensor arrays. However, enabling quad mode introduces stricter requirements on signal skew and impedance matching due to simultaneous switching of multiple data lines. On systems without hardware quad support (e.g., older MCUs), software bit-banging may negate speed gains unless optimized with tight ISR timing, making hardware-assisted implementations preferable for sustained performance.
What precautions should be taken when integrating the S25FL256SAGBHB210 into a mixed-signal PCB design with analog components sensitive to digital noise?
The S25FL256SAGBHB210 operates at 2.7V–3.6V, which overlaps with common analog supply rails, increasing susceptibility to cross-talk. To minimize interference, maintain at least 4 mm clearance between flash traces and high-impedance analog nodes. Use ground planes beneath the 24-BGA package with via stitching to reduce loop area, and route clock and data lines away from ADC inputs or reference voltages. Decoupling capacitors (100 nF ceramic + 10 µF tantalum) near VCC pins suppress transient currents during erase/write bursts. Additionally, avoid placing decoupling components far from the IC; their effectiveness diminishes beyond 5 mm due to trace inductance, especially important given the 750 µs write cycle duration.
How does the S25FL256SAGBHB210 compare to eMMC or SD card interfaces in terms of interface complexity and real-time determinism for safety-critical applications?
The S25FL256SAGBHB210 uses a simple SPI-compatible protocol with predictable latency, unlike eMMC/SD cards that rely on layered host controllers and potential arbitration delays. In safety-certified systems (e.g., ISO 26262 ASIL-B/C), the direct register access model of the S25FL256SAGBHB210 allows for deterministic response times and avoids filesystem overhead. While eMMC offers higher densities and lower cost per bit, it introduces variable access latencies due to command queuing and wear leveling firmware. For boot-critical functions requiring immediate execution, the NOR-based S25FL256SAGBHB210 provides superior temporal predictability and easier verification against timing constraints.
What impact does the 32M x 8 memory organization have on addressing granularity and sector protection schemes in firmware flashing workflows?
With a 32M x 8 organization, the S25FL256SAGBHB210 presents 32 million addressable 8-bit words, totaling 256 Mb. Each page consists of 256 bytes, and blocks—typically 64 KB or 128 KB—are erased in groups. This structure supports flexible partitioning: for instance, reserving one block for bootloader updates while protecting others via status register write protection (SRWP). The word-level addressing simplifies alignment requirements for most embedded processors, avoiding byte-wise manipulation overhead. However, firmware images must respect page boundaries during writes to prevent partial updates, which could corrupt data. Tools generating binary images should enforce padding to the nearest page size to ensure atomicity and simplify recovery mechanisms.

Parts with Similar Specifications

The three parts on the right have similar specifications to Infineon Technologies S25FL256SAGBHB210

Product Attribute S25FL256SAGBHB213 S25FL256SAGBHA203 S25FL256SAGBHBA00 S25FL256SAGBHBA03
Part Number S25FL256SAGBHB213 S25FL256SAGBHA203 S25FL256SAGBHBA00 S25FL256SAGBHBA03
Manufacturer Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Memory Interface - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Memory Organization - - - -
Write Cycle Time - Word, Page - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Voltage - Supply - - - -
Memory Type - - - -
Access Time - - - -
Memory Size - - - -
Series - - - -
Clock Frequency - - - -
Technology - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Memory Format - - - -

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
Quality Inspection Image - 01
Quality Inspection Image - 02
Quality Inspection Image - 03
Quality Inspection Image - 04

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
Infineon Technologies

S25FL256SAGBHB210

Infineon Technologies
98D-S25FL256SAGBHB210

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

Allelco
About Us
History
Certifications
Recruitment
Policies
Terms & Conditions
Privacy Policy
Cookie Policy
Services
Order Tracking
Return & Replacement
Frequently Asked Questions
Contact Us
Order
Shipping & Delivering
Payment Methods
My Account
The BlogsHot PartsChange LanguageNewsSite map
Contact Us
Headquarters Address:
Room C 13/F Harvard Commercial Building
105-111 Thomson Road Wan Chai
HongKong
Service Tel: +852-91464856
Service Email: info@allelco.com
Follow us
Copyright © 2012-2025 AllelcoElec.com. All rights reserved.
0 RFQ
Shopping cart (0 Items)
It is empty.
Submit RFQ
Compare List (0 Items)
It is empty.
Feedback

Your feedback matters! At Allelco, we value the user experience and strive to improve it constantly.
Please share your comments with us via our feedback form, and we'll respond promptly.
Thank you for choosing Allelco.

Subject
E-mail
Comments
Captcha
Drag or click to upload file
Upload File
types: .xls, .xlsx, .doc, .docx, .jpg, .png and .pdf.
Max file size: 10MB