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HomeProductsDiscrete Semiconductor ProductsDiodes - Rectifiers - SingleMUR130
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MUR130 - Diotec Semiconductor

Manufacturer Part Number
MUR130
Manufacturer
Diotec Semiconductor
Allelco Part Number
98D-MUR130
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
46,593 pcs available, New & Original
Parts Description
DIODE SFR DO-41 300V 1A
Package
DO-41/DO-204AC
Data sheet
MUR130.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 46593
  • Unit Price: $0.089
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $0.089 $0.09
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MUR130 Tech Specifications
Diotec Semiconductor - MUR130 technical specifications, attributes, parameters and parts with similar specifications to Diotec Semiconductor - MUR130

Product Attribute Attribute Value
Manufacturer Diotec Semiconductor
Voltage - Forward (Vf) (Max) @ If 1.25 V @ 1 A
Voltage - DC Reverse (Vr) (Max) 300 V
Technology Standard
Supplier Device Package DO-41/DO-204AC
Speed Fast Recovery =< 500ns, > 200mA (Io)
Series -
Reverse Recovery Time (trr) 75 ns
Product Attribute Attribute Value
Package / Case DO-204AC, DO-41, Axial
Package Tape & Reel (TR)
Operating Temperature - Junction -50°C ~ 175°C
Mounting Type Through Hole
Current - Reverse Leakage @ Vr 5 µA @ 300 V
Current - Average Rectified (Io) 1A
Capacitance @ Vr, F -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the MUR130 for high-frequency switching applications compared to standard rectifier diodes?
The MUR130 offers a reverse recovery time (trr) of 75 ns, which is significantly faster than typical standard rectifier diodes that often exceed 2 µs. This speed advantage reduces switching losses in power converters and SMPS designs operating above 50 kHz. However, this comes at the cost of higher forward voltage drop—up to 1.25 V at 1 A—which increases conduction losses under continuous load compared to ultra-low Vf devices like Schottky types. Additionally, while the MUR130’s fast recovery enables efficient operation in bridge rectifiers and buck/boost topologies, its non-compliance with RoHS may limit use in consumer electronics where lead-free assembly is required.
How does the MUR130 compare to the UF4004-E3/54 in terms of switching behavior and thermal management requirements for 12V automotive lighting systems?
In a 12V automotive lighting application drawing 800 mA continuously, the MUR130 dissipates approximately 1 W due to its 1.25 V forward drop, requiring modest heatsinking or adequate PCB copper area. The UF4004-E3/54, being a Schottky variant, exhibits lower Vf (~0.55 V at 800 mA) and zero reverse recovery current, resulting in roughly half the conduction loss. However, the UF4004’s slower trr (~30 ns but with soft recovery characteristics) can introduce ringing in inductive loads unless snubbed. The MUR130’s superior avalanche ruggedness and consistent fast recovery make it preferable where inductive kickback is severe, despite its higher thermal footprint.
Can the MUR130 be used as a substitute for EGP10F in a flyback converter design without modifying the transformer or control IC configuration?
While both diodes operate at similar voltages (EGP10F rated at 1000 V), direct substitution of the MUR130 for the EGP10F may not be advisable without redesign considerations. The MUR130 has a peak repetitive reverse voltage of 300 V, whereas the EGP10F supports up to 1000 V, making the MUR130 unsuitable if the primary winding induces transient spikes approaching or exceeding 400 V during turn-off. Even if the average current matches, the lower Vr rating could compromise reliability over time. Additionally, the EGP10F typically features a much lower trr (~50 ns) and better thermal resistance per ampere, offering superior efficiency in high-voltage flyback stages.
What impact does the MUR130’s reverse leakage current have on battery-powered systems with sleep-mode drawdown concerns?
With a reverse leakage current of 5 µA at 300 V, the MUR130 contributes negligible standby drain in most battery systems—far below microamps drawn by MCU sleep currents. For example, in a Li-ion backup circuit maintaining 4.2 V across the diode, the annual self-discharge from leakage alone would be less than 0.5% of capacity. This makes the MUR130 acceptable even in low-power always-on monitoring circuits, provided the bias voltage remains within operational limits. However, if the system occasionally experiences floating inputs near 300 V (e.g., solar panel arrays with partial shading), cumulative leakage through multiple parallel paths could become non-trivial.
Why might a designer choose the MUR130 over a surface-mount equivalent like MUR130G despite the latter offering modern packaging benefits?
The axial DO-41 package of the MUR130 provides mechanical robustness and ease of manual soldering in prototyping or legacy assembly lines, which justifies its continued availability despite the dominance of SMD formats like the MUR130G in mass production. In high-vibration environments such as industrial motor drives, the stranded lead construction resists fatigue failure better than gull-wing terminations. Furthermore, the MUR130’s lead-free version (if available) may still meet environmental standards, though the original part is RoHS non-compliant, necessitating supply chain verification before deployment in regulated markets.
How does the junction temperature range of the MUR130 influence derating strategies in sealed enclosures without active cooling?
Operating the MUR130 up to 175°C allows deployment in thermally constrained spaces such as LED drivers or compact power supplies where airflow is limited. Assuming an ambient temperature of 70°C in a sealed enclosure, the maximum allowable power dissipation drops from 1.5 W (at 25°C) to approximately 800 mW due to thermal impedance limitations. Given the device’s 1.25 V forward drop at 1 A, continuous conduction must be capped around 640 mA to avoid exceeding Tj(max). This derating ensures long-term reliability but may require layout adjustments or shared heatsinking with adjacent components to maintain uniform thermal distribution.
What are the implications of using the MUR130 in parallel configurations for higher-current applications such as 2.5 A DC-DC converters?
Paralleling two MUR130 diodes to achieve 2.5 A introduces challenges due to current imbalance caused by slight mismatches in Vf and trr. Without emitter resistors or careful layout symmetry, one device may carry up to 1.4 A while the other carries only 1.1 A, leading to localized heating and premature aging. The recommended approach includes adding small-value emitter sense resistors (e.g., 0.1 Ω) or using thermally coupled placement with matched parts from the same batch. Alternatively, selecting a single diode rated for 3 A or more—such as the MUR3040PT—would simplify design and improve reliability, despite the increased BOM cost.
Is the MUR130 suitable for use in a half-wave rectifier stage of a universal AC input SMPS targeting 90–264 Vac input ranges?
No, the MUR130 is not ideal for universal AC input rectification due to its limited voltage rating. During startup transients or brownout conditions, line surges can exceed 400 V peak in 264 Vac systems, risking avalanche breakdown even though the MUR130 includes intrinsic protection. Devices like the FR107 or UF4007, rated at 1000 V, are standard in such applications because they accommodate full line transients safely. The MUR130’s 300 V Vr is sufficient only for isolated DC bus scenarios where input filtering ensures clamped voltages remain below 280 V, eliminating the need for high-voltage margin.
How does the absence of specified capacitance affect EMI performance in switching circuits using the MUR130?
Although the datasheet lists capacitance @ Vr,F as “not specified,” the MUR130’s fast recovery mechanism inherently minimizes junction capacitance buildup during reverse bias, which helps suppress high-frequency oscillations caused by parasitic inductance in the diode loop. Compared to slow-recovery diodes, the abrupt depletion layer collapse reduces di/dt-related emissions. Nevertheless, in systems sensitive to conducted EMI above 15 MHz, adding a small ceramic bypass capacitor (e.g., 100 pF) across the diode can dampen resonant peaks arising from PCB trace inductance, especially when routing leads are longer than 10 mm.
What role does the Base Product Number MUR13 play in identifying compatible replacements or alternative packages for the MUR130?
The MUR13 base product number indicates a family of 300 V fast recovery diodes with 1 A current handling, enabling designers to evaluate variants like the MUR130H (higher surge capability) or MUR130T (tape-and-reel format). Substitutes such as EGP10F or UF4004-E3/54 fall outside this family due to differing voltage ratings, so compatibility cannot be assumed solely from series membership. Always verify electrical parameters against the target application’s worst-case conditions—particularly Vr, Io, and trr—before substituting any part claiming interchangeability with the MUR130.

Parts with Similar Specifications

The three parts on the right have similar specifications to Diotec Semiconductor MUR130

Product Attribute MUR130RL MUR130RLG MUR130 MUR130G
Part Number MUR130RL MUR130RLG MUR130 MUR130G
Manufacturer onsemi onsemi onsemi onsemi
Current - Reverse Leakage @ Vr - - - -
Operating Temperature - Junction - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Mounting Type - Surface Mount Through Hole Surface Mount
Speed - - - -
Series - - - -
Current - Average Rectified (Io) - - - -
Voltage - DC Reverse (Vr) (Max) - - - -
Voltage - Forward (Vf) (Max) @ If - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Capacitance @ Vr, F - - - -
Technology - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Reverse Recovery Time (trr) - - - -

MUR130 Datasheet PDF

Download MUR130 pdf datasheets and Diotec Semiconductor documentation for MUR130 - Diotec Semiconductor.

Datasheets
MUR1x0 Datasheet.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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(Different time frame / countries / package size has different price.)

Delivery Method

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

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  • ISO 9001: 2015
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  • ISO 28000: 2007
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MUR130

Diotec Semiconductor
98D-MUR130

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