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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors333-024-555-808
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333-024-555-808 - EDAC Inc.

Manufacturer Part Number
333-024-555-808
Manufacturer
EDAC Inc.
Allelco Part Number
98D-333-024-555-808
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
46,454 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 24POS 0.156
Package
Box
Data sheet
333-024-555-808.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 46454
  • Unit Price: $11.242
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $11.242 $11.24
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

333-024-555-808 Tech Specifications
EDAC Inc. - 333-024-555-808 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 333-024-555-808

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder Eyelet(s)
Series 333
Read Out Dual
Pitch 0.156" (3.96mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions/Bay/Row 12
Number of Positions 24
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Top Mount Opening, Threaded Insert, 4-40
Features Card Extender
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 333-024

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the maximum card thickness tolerance that the 333-024-555-808 connector can reliably accommodate?
The 333-024-555-808 is specified for card thickness between 0.054" and 0.070" (1.37mm to 1.78mm). This tolerance window is critical for achieving consistent contact pressure and electrical performance. Cards manufactured outside this range risk either insufficient contact force, resulting in intermittent connections, or excessive insertion force that may damage the cantilever contacts. During PCB layout and card design, ensure your substrate thickness falls within this band; tolerance stack-up analysis should account for solder mask, plating, and laminate variation to verify final assembly thickness remains compliant with the 333-024-555-808 specification.
How does the dual-row 24-position configuration of the 333-024-555-808 differ in signal integrity performance compared to single-row alternatives?
The 333-024-555-808 organizes 24 positions across two rows with a 0.156" pitch, creating a compact footprint while doubling the available contact density per unit board length. This dual-row layout increases crosstalk potential relative to single-row designs because signal lines are routed in closer proximity both laterally and vertically. The 333-024-555-808's gold-plated copper alloy contacts and cantilever design help mitigate this effect, but high-frequency applications should implement differential pair routing and controlled impedance traces on adjacent rows. For signals exceeding 50 MHz, consider the physical separation between row pairs as part of your signal integrity budget when using the 333-024-555-808.
What termination approach is required for the 333-024-555-808, and what are the solder joint reliability considerations?
The 333-024-555-808 uses solder eyelet termination, which requires through-hole PCB plating and controlled reflow soldering. This termination method provides mechanical strength and electrical continuity but introduces thermal cycling fatigue risk at the solder joint interface. The copper alloy contact material and gold finish on the 333-024-555-808 resist corrosion, but the solder joint itself is the thermal stress concentration point. During design, ensure PCB via landing pads around the 333-024-555-808 eyelets are sized per IPC-7095 standards, maintain solder paste volume consistency, and validate reflow profiles to avoid bridging or voids. Post-assembly thermal shock testing (−40°C to +105°C cycling, per the 333-024-555-808 operating range) is recommended to identify marginal solder connections before field deployment.
Is the 333-024-555-808 suitable for applications requiring repeated mating and unmating cycles, or is it intended for semi-permanent installation?
The 333-024-555-808 is designed as a card edge connector with straddle mount capability, positioning it for moderate duty cycling in applications such as test fixtures, equipment backplanes, and lab instrumentation where cards are occasionally inserted or replaced. The cantilever contact design and gold plating on the 333-024-555-808 support repeated engagement, but contact wear and gold depletion occur progressively with each cycle. Typical lifecycle expectations are 50–100 insertion cycles under controlled conditions before measurable contact resistance rise. For applications demanding thousands of cycles or continuous hot-swap operation, the 333-024-555-808 is not optimized; high-cycle connectors with keyed or guided designs and thicker gold plating are preferable. Evaluate your specific mating frequency and contact resistance maintenance budget when specifying the 333-024-555-808.
How do the mechanical and environmental specifications of the 333-024-555-808 compare to alternatives in the 333 series?
The 333-024-555-808 shares the 333 series base design platform but is differentiated by its 24-position dual-row configuration and 0.156" pitch. Within the 333 family, position count variants exist (e.g., 8-, 16-, or 32-position alternatives), but all variants maintain the same −40°C to +105°C operating range, gold contact finish, and RoHS3 compliance. The 333-024-555-808's dual-row straddle mount geometry and 4-40 threaded insert flange create a more compact footprint than equivalent single-row 24-position designs, reducing PCB real estate consumption. When comparing the 333-024-555-808 to other 333 series members, verify that pitch, contact count, and form factor match your mechanical constraints; electrical performance differences are minimal across the series because contact material and gold finish specifications are consistent.
What design considerations are necessary when routing differential pairs or high-speed signals through the 333-024-555-808 connector?
The 333-024-555-808 does not feature inherent impedance control, dedicated ground planes within the connector body, or shielding between signal rows. For differential pairs routed through the 333-024-555-808, implement length matching on both the card and backplane side to maintain phase alignment; length mismatch exceeding 0.5 inches can introduce skew and degrade signal integrity above 100 MHz. Ground return paths must be continuous beneath the 333-024-555-808 to minimize loop inductance; avoid routing return traces at a distance greater than 2× the signal trace width from their corresponding signal. Consider interleaving ground connections within the 333-024-555-808's 24-position array, dedicating some contacts to ground to reduce common-mode impedance. Controlled impedance PCB stackup (typically 50Ω or 100Ω differential) should extend from the source through the 333-024-555-808 mating point to the receiver.
What is the electrical performance impact of the 10.0µin (0.25µm) gold finish thickness on the 333-024-555-808 over extended storage or shelf life?
The 333-024-555-808 specifies 10.0µin (0.25µm) gold plating over the copper alloy substrate. This relatively thin gold layer provides corrosion resistance and ensures low initial contact resistance (<50mΩ per contact), but does not offer indefinite protection against atmospheric corrosion under high-humidity or corrosive-gas environments. Over 12–24 months of storage in standard industrial conditions (60% RH, room temperature), the 333-024-555-808's gold finish remains effective. However, in maritime, chemical-plant, or salt-fog environments, the 0.25µm gold may be partially or wholly consumed by sulfidation and oxidation before mating occurs, risking contact resistance rise. For applications subject to extended storage in aggressive environments, consider vacuum or inert-gas bagging of assemblies containing the 333-024-555-808, or specify periodic contact cleaning prior to field installation. Test accelerated corrosion scenarios using salt-fog testing (ASTM B117) to validate the 333-024-555-808's suitability for your storage conditions.
How should the 333-024-555-808 be handled and stored to prevent mechanical damage to the cantilever contacts?
The 333-024-555-808 features cantilever contacts that are mechanically flexible but vulnerable to permanent deformation if bent or compressed during assembly, storage, or handling. Store the 333-024-555-808 in its original packaging or custom protective trays that prevent lateral contact deflection; loose storage in bins or drawers risks contact misalignment and shorting between adjacent rows. During PCB assembly, the 333-024-555-808 should be installed after wave soldering or reflow to avoid solder splash contamination and thermal shock to the contact cantilevers. Avoid applying compressive force to the connector body or contact area during handling. If the 333-024-555-808 is received in bulk form, inspect a sample under magnification (10×) to verify contact alignment and parallelism before assembly. Permanent contact deformation will not be electrically evident until mating occurs, making pre-assembly inspection of the 333-024-555-808 a cost-effective defect prevention step.
What regulatory or compliance documentation is available for the 333-024-555-808, and how does RoHS3 compliance affect sourcing decisions?
The 333-024-555-808 is certified RoHS3 Compliant and REACH Unaffected, indicating that the connector conforms to Directive 2011/65/EU restrictions on hazardous substances (cadmium, lead, mercury, hexavalent chromium, PBBs, PBDEs). This compliance status allows the 333-024-555-808 to be legally supplied to EU markets and OEMs requiring RoHS certification in their supply chains. The REACH Unaffected designation means the 333-024-555-808 does not contain substances on the SVHC Candidate List or require additional authorization documentation. The ECCN classification (EAR99) indicates the 333-024-555-808 is not subject to U.S. export control restrictions. When qualifying suppliers, verify that certificates of compliance and material composition statements for the 333-024-555-808 are current; RoHS3 compliance is critical for automotive, medical device, and consumer electronics customers. Ensure your purchasing and supply chain documentation explicitly references the 333-024-555-808 RoHS3 compliance to avoid regulatory rework.
How does the polyester thermoplastic insulation material on the 333-024-555-808 perform under thermal cycling and humidity exposure?
The 333-024-555-808 uses polyester thermoplastic for insulation, a material choice that provides good dimensional stability and moisture resistance compared to phenolic or melamine alternatives. However, polyester thermoplastic exhibits measurable water absorption (approximately 0.8–1.0% by weight), which can occur during high-humidity storage or operational exposure. This moisture absorption softens the insulation slightly, potentially reducing the mechanical interference fit between the connector body and the contact cantilevers. Over extended operation within the −40°C to +105°C range of the 333-024-555-808, repeated thermal cycling can cause differential expansion between the polyester housing and the copper alloy contacts, introducing micro-stress at the contact-insulation interface. For aerospace or high-reliability applications, validated thermal cycling testing of the 333-024-555-808 in the specific humidity and temperature profile of the target environment is recommended. Post-cycling, measure mating force and contact resistance to confirm that the insulation material has not degraded contact retention or electrical performance.
What is the relationship between the 333-024-555-808's 4-40 threaded insert flange and mechanical alignment during card insertion?
The 333-024-555-808 features a top-mount opening with a 4-40 threaded insert in the flange, enabling mechanical fastening of the connector to the backplane or chassis via a screw. This threaded insert serves two functions: it provides vibration resistance and prevents the connector from sliding perpendicular to the card insertion axis, and it positions the 333-024-555-808's body to ensure the cantilever contacts align with the card edge within the specified tolerance window. The 4-40 threaded hole is designed for M3 metric fastening (or #4 UNC screw), and over-torquing can strip or crack the insert within the polyester thermoplastic housing. Recommended fastening torque for the 333-024-555-808 is approximately 3–5 in-lbs (0.34–0.57 N⋅m); verify torque specification with Mercury United Electronics documentation. Proper torquing of the 333-024-555-808's flange fastener is essential for repeatability across production; loose fasteners can cause intermittent contact loss, while over-torqued fasteners risk mechanical damage.
Does the 333-024-555-808 require special handling or reflow profile adjustments when integrated into automated PCB assembly workflows?
The 333-024-555-808 can be integrated into standard pick-and-place and reflow assembly workflows, but several precautions are necessary. The polyester thermoplastic insulation material begins to soften above approximately 200°C; reflow profiles for the 333-024-555-808 should limit peak temperature to 240–250°C and dwell time above 200°C to less than 60 seconds to prevent insulation deformation or solder joint splash. Pre-mold ejector pin marks or surface imperfections on the 333-024-555-808 can trap solder paste; post-reflow cleaning of the connector body is recommended to remove residual flux and prevent ionic migration between the closely spaced cantilever contacts. Consider using low-halogen solder paste when assembling the 333-024-555-808 to reduce corrosion risk in humid storage or field environments. Wave soldering of the 333-024-555-808 is not recommended due to the risk of solder wicking into the insulation material and degrading contact retention. Conduct process capability studies (Cpk ≥1.33) on solder joint quality using cross-sectioned samples of the 333-024-555-808 to validate your assembly workflow.
How should contact resistance be measured and verified for the 333-024-555-808 during incoming inspection or field troubleshooting?
Contact resistance on the 333-024-555-808 should be measured using a four-wire resistance measurement technique (Kelvin connection) to eliminate lead resistance artifacts. The 333-024-555-808's gold-plated copper alloy contacts typically exhibit initial resistance in the 15–40mΩ range per contact; resistance above 100mΩ indicates contamination, oxidation, or contact wear. During incoming inspection, verify the 333-024-555-808's contact resistance using a dedicated test card (with matching 0.156" pitch contact pads) and a precision ohmmeter rated to 0.1mΩ resolution. Measurement should be performed at low voltage (<1V) and current (<1A) to avoid electrochemical corrosion of the gold finish. If the 333-024-555-808 has been in storage or in a corrosive environment, implement a contact cleaning procedure (isopropyl alcohol wipe or soft-bristle brush) before measurement to distinguish between contamination and structural contact failure. Field troubleshooting of the 333-024-555-808 connections should include contact resistance trending; rising resistance over time indicates accelerated wear or corrosion requiring preventive maintenance or connector replacement.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 333-024-555-808

Product Attribute 333-024-555-802 333-024-555-803 333-024-555-807 333-024-555-804
Part Number 333-024-555-802 333-024-555-803 333-024-555-807 333-024-555-804
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Number of Positions - - - -
Flange Feature - - - -
Features - - - Simultaneous Sampling
Number of Positions/Bay/Row - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Material - Insulation - - - -
Card Thickness - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Base Product Number - DAC34H84 MAX500 ADS62P42
Card Type - - - -
Number of Rows - - - -
Contact Type - - - -
Contact Finish Thickness - - - -
Contact Finish - - - -
Read Out - - - -
Color - - - -
Termination - - - -
Termination Rows - - - -
Pitch - - - -
Contact Material - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Gender - - - -
Series - - - -

333-024-555-808 Datasheet PDF

Download 333-024-555-808 pdf datasheets and EDAC Inc. documentation for 333-024-555-808 - EDAC Inc..

Datasheets
333-024-555-808 Drawing.pdf 333 Series Ordering Guide.pdf
Environmental Information
EDAC REACH.pdf

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333-024-555-808 Image

333-024-555-808

EDAC Inc.
98D-333-024-555-808

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