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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors333-036-520-202
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333-036-520-202 - EDAC Inc.

Manufacturer Part Number
333-036-520-202
Manufacturer
EDAC Inc.
Allelco Part Number
98D-333-036-520-202
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
40,856 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 36POS 0.156
Package
Bulk
Data sheet
333-036-520-202.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 40856
  • Unit Price: $7.362
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $7.362 $7.36
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

333-036-520-202 Tech Specifications
EDAC Inc. - 333-036-520-202 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 333-036-520-202

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 333
Read Out Dual
Pitch 0.156' (3.96mm)
Package Bulk
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions/Bay/Row 18
Number of Positions 36
Mounting Type Through Hole
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Flush Mount, Top Opening, Unthreaded, 0.128' (3.25mm) Dia
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054' ~ 0.070' (1.37mm ~ 1.78mm)
Base Product Number 333-036

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness tolerance does the 333-036-520-202 connector accommodate, and how does this affect PCB design margins?
The 333-036-520-202 is rated for card thickness between 0.054" and 0.070" (1.37mm to 1.78mm). This 0.016" (0.41mm) tolerance window requires careful PCB thickness control during design. Standard FR-4 PCB thickness of 0.062" ±0.005" falls within this range, but designs approaching the lower or upper tolerance limits may experience inconsistent contact pressure or mechanical misalignment. When designing for the 333-036-520-202, validate PCB thickness with your fabricator and consider adding test points to verify connector engagement during prototyping, as undersized cards may result in weak electrical contact while oversized cards risk mechanical damage to the cantilever contacts.
How does the dual-row, 18-position-per-row configuration of the 333-036-520-202 compare to single-row edge connectors in terms of density and signal integrity?
The 333-036-520-202 provides 36 total contact positions across two rows with a 0.156" (3.96mm) pitch, achieving approximately 2.56 contacts per inch in the dual-row arrangement. This configuration delivers higher connection density than single-row alternatives while maintaining the industry-standard 0.156" pitch spacing. However, the dual-row layout in the 333-036-520-202 requires careful impedance management if high-speed signals are routed through both rows, as the staggered row geometry introduces slight propagation delay differences. For applications mixing analog and digital signals, consider dedicating one row to power/ground and the other to signal lines, as this practice reduces cross-talk and simplifies return path management in the 333-036-520-202 layout.
Why is the gold contact finish thickness of 10.0µin (0.25µm) on the 333-036-520-202 relevant for connector longevity and mating cycle durability?
The 333-036-520-202 specifies a 10.0µin (0.25µm) gold finish over copper alloy contacts. This relatively thin gold plating (compared to thicker 50µin specifications in premium connectors) is sufficient for typical office and light industrial environments but offers limited protection against corrosion in humid or salt-air conditions. The copper alloy substrate beneath the 333-036-520-202 gold finish remains susceptible to oxidation if the plating is compromised by repeated mating cycles or mechanical wear. In applications requiring 100+ mating cycles or outdoor deployment, the 333-036-520-202 may warrant supplementary conformal coating or periodic contact cleaning to maintain reliable electrical contact over the product lifetime.
How do the cantilever contact design and flush-mount flange of the 333-036-520-202 affect insertion force and PCB mechanical stress?
The 333-036-520-202 employs cantilever contacts with a flush-mount, top-opening flange design. This geometry allows the card to be inserted horizontally without vertical deflection of the connector body, reducing mechanical stress on the PCB solder joints. However, cantilever contacts in the 333-036-520-202 generate insertion force primarily during the initial engagement phase, requiring adequate guide alignment to prevent skewing. The flush-mount flange with 0.128" (3.25mm) diameter unthreaded opening accommodates guide pins but lacks threaded locking provisions, so the 333-036-520-202 relies on friction-fit retention. For applications with frequent hot-swap or vibration environments, mechanical retention brackets or keying features external to the 333-036-520-202 connector itself should be evaluated to prevent accidental card withdrawal.
What are the practical differences between the 333-036-520-202 and other edge connectors in the 333 series regarding application compatibility?
The 333-036-520-202 belongs to the 333 series family, which shares common pitch (0.156") and contact material specifications but varies in position count, row configuration, and flange design. The 333-036-520-202 specifically offers a dual-row, 36-position arrangement suited for moderate-bandwidth backplane applications. Compared to smaller 333 series variants with fewer positions, the 333-036-520-202 supports more complex signal routing but introduces higher capacitive loading. When selecting within the 333 series, verify that the 333-036-520-202 contact pitch and card thickness tolerance align with your PCB design rules, as interchanging different 333 series models may result in electrical performance degradation or mechanical incompatibility despite superficial structural similarities.
Is the 333-036-520-202 suitable for high-speed digital signal transmission, and what signal integrity considerations apply?
The 333-036-520-202 is a passive female connector with no integrated active components or controlled impedance transmission line geometry. For clock speeds below 10 MHz, the 333-036-520-202 performs adequately in standard TTL or CMOS logic applications. Above 10 MHz, signal integrity is compromised by the parallel-plate capacitance between the two rows of the 333-036-520-202 and reflections caused by the abrupt impedance discontinuity at connector entry. If the 333-036-520-202 is used in applications exceeding 20 MHz, employ series termination resistors (22–50 Ω) on the driver side and place decoupling capacitors close to the connector pins. Propagation delay skew between signals routed through different rows of the 333-036-520-202 typically ranges from 200 to 400 ps and may require timing adjustment in high-speed synchronous designs.
How does the -40°C to 105°C operating temperature range of the 333-036-520-202 affect long-term reliability in industrial applications?
The 333-036-520-202 is rated for -40°C to 105°C operation, covering typical industrial temperature ranges. The polyester thermoplastic insulation material in the 333-036-520-202 exhibits reduced mechanical stiffness above 85°C, potentially affecting cantilever contact force consistency. In sustained high-temperature environments near 105°C, the 333-036-520-202 solder joints experience accelerated tin whisker growth and thermal cycling fatigue. For applications in temperature extremes (outdoor, automotive, or sealed equipment), validate 333-036-520-202 connector performance at 0.5–1.0°C above the upper operating limit during thermal cycling testing. The gold finish on the 333-036-520-202 remains stable across the specified range, but the underlying copper alloy may develop oxidation during storage at elevated humidity if the board is not hermetically sealed.
What does RoHS3 compliance mean for the 333-036-520-202, and are there any material substitution implications?
The 333-036-520-202 is RoHS3 compliant, confirming the absence of lead, cadmium, mercury, hexavalent chromium, and restricted brominated flame retardants in manufacturing. The copper alloy contacts and 10.0µin gold plating of the 333-036-520-202 inherently meet RoHS3 restrictions. RoHS3 compliance does not indicate hermetic sealing or enhanced environmental resistance; the 333-036-520-202 still requires protection from moisture and corrosion through conformal coating or controlled storage. When sourcing replacement 333-036-520-202 units, verify that substitutes maintain identical RoHS3 certification status and material composition, as manufacturers may alter plating thickness or substrate alloy formulation while retaining the same part number designation.
How should the 333-036-520-202 be stored and handled to prevent contact degradation and maintain electrical performance?
The 333-036-520-202 carries Moisture Sensitivity Level (MSL) 1 designation, indicating unlimited shelf life without moisture-control packaging requirements. However, this does not eliminate oxidation risk during long-term storage. Recommend storing the 333-036-520-202 in dry conditions (relative humidity below 60%) at room temperature, as the gold plating and copper alloy substrate in the 333-036-520-202 may develop tarnish or corrosion in humid environments. Avoid touching the 333-036-520-202 contact surfaces with bare hands, as skin oils accelerate oxidation. When preparing the 333-036-520-202 for assembly, inspect for discoloration or debris and clean contact areas with isopropyl alcohol and a soft brush if necessary. Store assembled boards with the 333-036-520-202 in sealed anti-static bags with desiccant packets if long-term storage exceeds six months.
What solder joint design practices minimize mechanical stress on 333-036-520-202 pins during thermal cycling?
The 333-036-520-202 uses solder termination on through-hole pins, making thermal cycling fatigue a potential failure mechanism. The coefficient of thermal expansion (CTE) mismatch between PCB (CTE ~16 ppm/°C), solder (CTE ~24 ppm/°C), and the copper alloy contact posts in the 333-036-520-202 creates shear stress during temperature transitions. Design PCB landing pads for the 333-036-520-202 with generous copper area around each pin (minimum 0.050" beyond pin diameter) to distribute stress. Use reflow profiles with slow ramp rates (less than 2°C/second) to minimize thermal shock at the 333-036-520-202 solder interface. If the application requires frequent thermal cycling across the full -40°C to 105°C range, implement solder joint fill-through vias under the 333-036-520-202 connector to increase joint mechanical stiffness and fillet coverage, reducing the risk of cold solder joints or fatigue cracks in high-cycle applications.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 333-036-520-202

Product Attribute 333-036-520-212 333-036-520-208 333-036-520-102 333-036-520-207
Part Number 333-036-520-212 333-036-520-208 333-036-520-102 333-036-520-207
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Contact Material - - - -
Pitch - - - -
Read Out - - - -
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Termination - - - -
Contact Finish Thickness - - - -
Gender - - - -
Contact Finish - - - -
Card Thickness - - - -
Contact Type - - - -
Number of Rows - - - -
Color - - - -
Features - - - Simultaneous Sampling
Number of Positions - - - -
Number of Positions/Bay/Row - - - -
Termination Rows - - - -
Material - Insulation - - - -
Card Type - - - -
Flange Feature - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Base Product Number - DAC34H84 MAX500 ADS62P42
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C

333-036-520-202 Datasheet PDF

Download 333-036-520-202 pdf datasheets and EDAC Inc. documentation for 333-036-520-202 - EDAC Inc..

HTML Datasheet
333-036-520-202 Drawing.pdf 333 Series Ordering Guide.pdf

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DHL & FedEx Shipment Charges Reference
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1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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333-036-520-202 Image

333-036-520-202

EDAC Inc.
98D-333-036-520-202

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