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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors337-011-521-102
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337-011-521-102 - EDAC Inc.

Manufacturer Part Number
337-011-521-102
Manufacturer
EDAC Inc.
Allelco Part Number
98D-337-011-521-102
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
28,972 pcs available, New & Original
Parts Description
CONN EDGE SGL FMALE 11POS 0.156
Package
Box
Data sheet
337-011-521-102.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 28972
  • Unit Price: $5.418
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $5.418 $5.42
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

337-011-521-102 Tech Specifications
EDAC Inc. - 337-011-521-102 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 337-011-521-102

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 1
Termination Solder
Series 337
Read Out Single
Pitch 0.156" (3.96mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 1
Number of Positions/Bay/Row 11
Number of Positions 11
Mounting Type Through Hole
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Flush Mount, Top Opening, Unthreaded, 0.128" (3.25mm) Dia
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Single Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 337-011

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the maximum card thickness tolerance that the 337-011-521-102 connector can reliably accept without contact compression issues?
The 337-011-521-102 is designed to accept card edges between 0.054" and 0.070" (1.37mm to 1.78mm) thickness. This tolerance window is critical for ensuring consistent contact pressure from the cantilever springs without over-compression that could degrade contact life or under-compression that creates intermittent connections. PCB thickness drift beyond these limits—particularly toward thicker substrates—will compromise the female contact engagement. The 0.016" (0.41mm) total tolerance band reflects typical card-edge connector design practice, requiring tight PCB thickness control during fabrication to avoid field reliability issues.
How does the 0.156" pitch specification of the 337-011-521-102 compare to other common edge connector standards, and what does this mean for board layout?
The 337-011-521-102 uses 0.156" (3.96mm) pitch, which is a legacy but still-active standard in industrial control and test equipment applications. This pitch is notably larger than modern 0.100" (2.54mm) or 0.050" (1.27mm) standards, allowing the 11-position 337-011-521-102 to span approximately 1.56 inches of board edge. The wider spacing simplifies manual assembly and reduces cross-talk between signal lines, but consumes more valuable edge real estate compared to higher-density alternatives. When evaluating the 337-011-521-102 against denser connectors, consider both the mechanical footprint constraint and the signal integrity benefit of increased conductor separation.
What precautions should be taken during PCB layout and assembly to prevent the gold contact finish on the 337-011-521-102 from being damaged during card insertion cycles?
The 337-011-521-102 features 10.0µin (0.25µm) gold plating over copper alloy contacts, which is a thin finish designed for low contact resistance in low-insertion-force applications rather than extreme durability. During repeated insertion and removal, abrasive wear on the plated surface can expose the underlying copper, accelerating oxidation and contact degradation. To protect the 337-011-521-102 contacts: ensure card edge connector mating surfaces are free from debris, minimize insertion cycles during development and testing, consider gold-plated guide rails or protective shims if frequent removal is necessary, and avoid storing unplugged cards in humid environments where exposed copper can oxidize. In applications requiring 100+ mating cycles, verify with Mercury United Electronics that the 337-011-521-102 finish thickness meets your wear-life expectations.
Is the 337-011-521-102 suitable for high-speed digital signals, or does the single-edge card geometry introduce signal integrity constraints?
The 337-011-521-102 is a single-edge, single-row connector designed primarily for moderate-frequency control signaling and low-speed data. The cantilever contact design and the geometric spacing inherent to the 0.156" pitch connector create inductive effects and impedance discontinuities that are problematic for high-speed digital interfaces. Signal integrity analysis of the 337-011-521-102 becomes critical above approximately 10 MHz; rise times, crosstalk, and reflections become measurable and can degrade bus reliability. For high-speed applications, consider whether the 337-011-521-102 is truly necessary or whether a card-edge connector with differential pairs, controlled impedance, and ground plane integration would be more appropriate. If the 337-011-521-102 must be used for faster signals, implement careful PCB trace routing, include series termination resistors, and perform oscilloscope validation of actual insertion loss and crosstalk.
How should the 337-011-521-102 connector be integrated into a design where the card will experience thermal cycling between -40°C and 105°C?
The 337-011-521-102 operates across a -40°C to 105°C range, but thermal cycling—repeated expansion and contraction—poses a hidden reliability risk. The copper alloy contact material and gold finish have different coefficients of thermal expansion than the polyester thermoplastic insulation and the PCB substrate. Over multiple thermal cycles, this mismatch can generate micro-motion at the solder interface, eventually leading to cold solder joints or cracked traces around the 337-011-521-102 mounting holes. Mitigation strategies include: use solder compositions with reliable wetting properties to the copper alloy contacts, avoid mechanical stress concentration near the 337-011-521-102 through-hole terminations by routing traces away from connector pad clusters, consider conformal coating to reduce moisture ingress that accelerates galvanic corrosion during thermal stress, and plan for periodic inspection or re-flow of the 337-011-521-102 solder joints if the product operates in continuous high-cycle thermal environments.
What is the expected current-carrying capacity per contact on the 337-011-521-102, and how does this affect power distribution designs?
While the 337-011-521-102 specification does not explicitly state per-contact amperage, Mercury United Electronics' 337 series edge connectors are typically rated for 2–5 amperes per contact under moderate conditions. However, this rating depends heavily on contact plating integrity, insertion force consistency, and environmental cleanliness. The 337-011-521-102, with its 10.0µin gold finish, is optimized for signal-level circuits rather than power delivery. If the 337-011-521-102 is used to carry currents above 2 amperes per contact, contact resistance increases non-linearly with current, generating localized heat that can soften the polyester insulation or degrade the gold plating. For power-hungry applications, use multiple contacts in parallel on the 337-011-521-102 to distribute current, verify contact temperature rise through thermal analysis, and consider dedicated power connectors outside the 337-011-521-102 framework if currents exceed 5 amperes total.
How does the flush-mount, top-opening flange design of the 337-011-521-102 affect insertion force and card alignment?
The 337-011-521-102 features a flush-mount, top-opening flange with 0.128" (3.25mm) diameter unthreaded mounting holes, which constrains the insertion approach to direct axial engagement without mechanical guidance. This design reduces assembly cost and footprint but transfers alignment responsibility to the card edge itself. If the card edge is warped, twisted, or misaligned by more than ±0.010", insertion into the 337-011-521-102 will result in uneven contact engagement, leading to intermittent connections or bent cantilever springs. The top-opening geometry also means that cards are inserted from above, requiring clear vertical clearance and careful positioning. For reliable 337-011-521-102 engagement in high-volume or service-field scenarios, integrate mechanical guides or card slots into the backplane design, specify PCB warpage limits to ±0.020", and provide operator training to emphasize straight insertion alignment.
What cleanup or maintenance procedures should follow soldering the 337-011-521-102 to prevent flux residue from affecting long-term reliability?
The 337-011-521-102 termination is solder, and residual flux—particularly from lead-free processes—can remain on the polyester thermoplastic insulation and in crevices around the cantilever springs. Acidic or corrosive flux residue is hygroscopic and will absorb moisture, creating an electrochemical pathway that promotes galvanic corrosion of the copper alloy contacts and copper traces connected to the 337-011-521-102. Standard isopropanol or aqueous cleaning removes most flux, but thorough drying is essential. For applications with humidity exposure or extended storage before deployment, consider conformal coating the 337-011-521-102 assembly with acrylic or urethane to seal out moisture entirely. If the 337-011-521-102 is reworked or re-flowed during assembly or repair, clean more aggressively and extend drying time to prevent trapped moisture from outgassing during field operation.
Can the 337-011-521-102 be used as a hot-swap connector, or will repeated insertion damage the contacts?
The 337-011-521-102 is not recommended for hot-swap applications where cards are inserted and removed while power is applied. Hot-plugging creates transient arcing across the 337-011-521-102 contacts, which locally melts the gold plating and the copper alloy substrate, accelerating wear. Additionally, the contact force on the 337-011-521-102 cantilever springs varies slightly with each insertion; repeated insertion under power increases the risk of contact chatter, signal glitches, and eventual contact erosion. If hot-swap is operationally necessary, implement a mechanical interlock that isolates power before the 337-011-521-102 is fully disengaged, or migrate to a connector specifically designed for hot-swap duty with higher contact force stability and erosion-resistant plating. Manual plug-and-play scenarios with the 337-011-521-102 are acceptable if power is always disconnected first and insertion cycles remain infrequent (fewer than 10–20 per year).
How should the 337-011-521-102 be specified or handled to ensure RoHS3 compliance is maintained through the product lifecycle?
The 337-011-521-102 is stamped RoHS3 Compliant, confirming that the copper alloy contact material, gold finish, and polyester thermoplastic insulation meet ROHS3 restrictions on lead, mercury, cadmium, hexavalent chromium, and brominated flame retardants. However, RoHS3 compliance of the 337-011-521-102 alone does not guarantee full board-level compliance if solder, cable assemblies, or other associated components are non-compliant. During PCB assembly, use lead-free solder compatible with the 337-011-521-102 gold finish to avoid intermetallic brittleness and thermal fatigue. Document the 337-011-521-102 part number and RoHS status in your bill of materials; if counterfeit or grey-market 337-011-521-102 connectors enter the supply chain, RoHS certification may not be honored. Conduct supplier audits and traceability checks if compliance certification is required for end-customer delivery.
What environmental stress-screening (ESS) or burn-in procedures are recommended for boards populated with the 337-011-521-102?
The 337-011-521-102 itself does not require specialized ESS, but edge-connector assemblies benefit from thermal cycling and electrical stress screening to detect latent defects in solder joints and contact engagement. A recommended screening profile includes: thermal cycling from -40°C to +105°C (the full operating range of the 337-011-521-102) for 5–10 cycles, with dwell times of 15–30 minutes at each extreme to induce solder joint stress; electrical continuity and resistance measurement of all 11 pins on the 337-011-521-102 before and after cycling to detect intermittent opens; and optionally, low-current signal injection on the 337-011-521-102 during thermal cycling to stress contacts under dynamic conditions. This ESS approach exposes assembly defects—cold solder joints on the 337-011-521-102, misaligned card edges, and marginal contact pressure—before field deployment, significantly reducing early-life failure rates.
How do environmental factors like humidity and salt fog affect the long-term performance of the 337-011-521-102 in outdoor or corrosive industrial settings?
The 337-011-521-102 gold plating (10.0µin) and polyester thermoplastic insulation are moderately resistant to corrosion but not designed for severe salt-fog or marine environments. Moisture ingress through the polyester insulation creates galvanic cells between the copper alloy contacts and any exposed copper traces or solder, leading to green or white corrosion products that increase contact resistance. In outdoor or corrosive environments, the 337-011-521-102 should be protected by conformal coating (acrylic, urethane, or silicone), mechanical shielding (potting or enclosure), or both. If the 337-011-521-102 is exposed to salt spray or acidic atmospheres, specify periodic inspection schedules and consider upgrading to connectors with thicker palladium or nickel-plated finishes if available. The -40°C to 105°C operating range of the 337-011-521-102 does not inherently protect against chemical attack; environmental sealing is a separate design responsibility.
What is the dielectric strength and insulation resistance expected from the 337-011-521-102, and how should this be verified during incoming inspection?
The 337-011-521-102 polyester thermoplastic insulation provides adequate dielectric isolation for low-voltage control circuits but is not specified for high-voltage isolation. Typical dielectric strength for polyester is approximately 1000–1500 V/mil, implying that the 337-011-521-102 insulation thickness will sustain several hundred volts under brief exposure without breakdown. However, the manufacturer datasheet does not explicitly state dielectric breakdown voltage or insulation resistance for the 337-011-521-102. For incoming quality verification, perform insulation resistance testing at 500 VDC (per IEC 60512) between adjacent pins on the 337-011-521-102 to establish a baseline and detect moisture ingress or manufacturing defects. Acceptance criteria should be ≥100 MΩ per pin-pair on the 337-011-521-102; lower values signal contamination or inadequate drying during assembly. If the 337-011-521-102 is used in circuits above 50 V, confirm insulation clearance spacing with Mercury United Electronics and validate isolation via benchtop high-potential testing before field deployment.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 337-011-521-102

Product Attribute 337-011-521-108 337-011-521-104 337-011-521-602 337-011-521-103
Part Number 337-011-521-108 337-011-521-104 337-011-521-602 337-011-521-103
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Card Thickness - - - -
Features - - - Simultaneous Sampling
Flange Feature - - - -
Contact Type - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Pitch - - - -
Number of Positions - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of Positions/Bay/Row - - - -
Card Type - - - -
Series - - - -
Contact Finish Thickness - - - -
Termination Rows - - - -
Termination - - - -
Contact Material - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Gender - - - -
Read Out - - - -
Material - Insulation - - - -
Number of Rows - - - -
Contact Finish - - - -
Color - - - -

337-011-521-102 Datasheet PDF

Download 337-011-521-102 pdf datasheets and EDAC Inc. documentation for 337-011-521-102 - EDAC Inc..

Datasheets
337-011-521-102 Drawing.pdf 337,387 Series Ordering Guide.pdf
Environmental Information
EDAC REACH.pdf

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337-011-521-102 Image

337-011-521-102

EDAC Inc.
98D-337-011-521-102

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