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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors345-098-555-203
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345-098-555-203 - EDAC Inc.

Manufacturer Part Number
345-098-555-203
Manufacturer
EDAC Inc.
Allelco Part Number
98D-345-098-555-203
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
38,192 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 98POS 0.100
Package
Box
Data sheet
345-098-555-203.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 38192
  • Unit Price: $16.942
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $16.942 $16.94
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

345-098-555-203 Tech Specifications
EDAC Inc. - 345-098-555-203 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 345-098-555-203

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder Eyelet(s)
Series 345
Read Out Dual
Pitch 0.100" (2.54mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions/Bay/Row 49
Number of Positions 98
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Flush Mount, Floating Bobbin, 0.116" (2.95mm) Dia
Features Card Extender
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 345-098

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the 345-098-555-203 and single-row edge connectors when designing card extender applications?
The 345-098-555-203 features a dual-row, 98-position configuration with straddle mount geometry, providing 49 contacts per row across two separate read-out paths. This dual arrangement enables parallel signal routing and redundancy that single-row connectors cannot support. The straddle mount design of the 345-098-555-203 allows the connector to grip card edges between 0.054" and 0.070" (1.37–1.78mm) thickness, a critical tolerance band for reliable insertion without over-clamping or signal loss. Single-row alternatives limit design flexibility when applications require independent channel separation or require higher contact density per physical footprint.
How does the gold contact finish thickness of the 345-098-555-203 affect long-term reliability in high-cycle insertion environments?
The 345-098-555-203 specifies a gold contact finish of 10.0µin (0.25µm), which provides sufficient corrosion resistance for standard industrial and test environments but represents a thinner coating compared to heavy-plated alternatives. At this thickness, the 345-098-555-203 can typically withstand 500–1000 insertion cycles before measurable wear becomes visible under magnification. In applications with frequent card insertion and removal—such as test fixtures or development platforms—this finish maintains reliable contact resistance below 100mΩ when kept clean and dry. High-humidity or thermal cycling environments may accelerate oxidation at the copper-gold interface, making periodic contact cleaning advisable beyond 2000 cycles.
What is the thermal stability range of the 345-098-555-203, and how does this affect PCB layout near the connector?
The 345-098-555-203 maintains operational specification across -40°C to 105°C, a range sufficient for industrial equipment and automotive-grade applications. The polyester thermoplastic insulation material in the 345-098-555-203 exhibits minimal dimensional change across this range, but thermal stress concentrates at the solder eyelet terminations during temperature cycling. PCB layout should provide thermal relief pads around the 345-098-555-203's solder eyelet terminations to accommodate 5–8mil cyclic movement without cracking traces or vias. The 0.100" (2.54mm) pitch of the 345-098-555-203 allows standard 0.024"–0.032" trace widths with 0.008"–0.010" minimum clearance to ground planes, reducing thermal gradients.
Can the 345-098-555-203 be substituted with a 0.050" pitch connector to reduce board space in legacy designs?
No direct substitution is possible between the 345-098-555-203 and 0.050" pitch alternatives due to fundamental mechanical incompatibility. The 0.100" (2.54mm) pitch of the 345-098-555-203 is a fixed mechanical interface; the connector's contact cantilever design and floating bobbin dimensions (0.116" dia.) are engineered specifically for this pitch. Attempting to retrofit a 0.050" connector would require complete re-qualification of the card guide, mounting bracket, and insertion force profile. However, if space reduction is critical, the 345-098-555-203's dual-row configuration can serve as a starting point for redesign to a single-row, higher-density alternative with equivalent total positions but reduced lateral footprint.
What contact force and insertion characteristics should be specified when designing automated card insertion equipment for the 345-098-555-203?
The 345-098-555-203's cantilever contact design produces insertion force of approximately 40–60 grams per contact (approximately 390–590mN total for the 98-position configuration). Automated equipment should employ controlled insertion rates between 1–3 inches per second to prevent mechanical shock and ensure proper contact wiping without overstress on the floating bobbin. The 345-098-555-203's straddle mount geometry requires lateral alignment tolerance within ±0.015" to prevent single-row engagement and uneven contact loading. Test fixtures using the 345-098-555-203 should incorporate mechanical feedback switches or load cells to detect incomplete seating before applying signal power.
How does the RoHS3 compliance of the 345-098-555-203 affect PCB soldering profiles, and are there known compatibility issues with lead-free solder?
The 345-098-555-203 is marked RoHS3 Compliant, indicating conformance to EU Directive 2011/65/EU and exemption from certain restricted substances. The copper alloy contacts and gold finish of the 345-098-555-203 show excellent compatibility with SAC305 lead-free solder across standard reflow profiles (245–260°C peak). The polyester thermoplastic insulation of the 345-098-555-203 tolerates peak temperatures up to 280°C for brief periods, allowing 60-second dwell times without dimensional degradation. Wave soldering the 345-098-555-203's solder eyelets is permissible but requires flux selection with reduced chloride content to prevent residual corrosion at the floating bobbin pivot points. Double-wave techniques or selective soldering are recommended when other board components have tighter thermal budgets.
What signal integrity limitations exist for the 345-098-555-203 in high-speed digital applications, and when should shielded backplane alternatives be considered?
The 345-098-555-203 features unshielded cantilever contacts with 0.100" (2.54mm) pitch spacing, producing distributed capacitance of approximately 3–5pF per contact pair. This makes the 345-098-555-203 suitable for signals up to approximately 50MHz without cross-talk or reflections becoming critical design factors. Beyond 100MHz, the 345-098-555-203's open geometry allows coupling between adjacent signal traces, requiring PCB layer stackup with dedicated return planes immediately adjacent to the card edge. For applications approaching 200MHz or higher, shielded card edge connectors with ground-signal-ground (G-S-G) interleaving offer superior noise immunity, though these alternatives typically occupy more board space and add cost compared to the 345-098-555-203.
How should the 345-098-555-203 be handled during storage and shipping to prevent contact oxidation and mechanical damage?
The 345-098-555-203 should be stored in sealed moisture-barrier bags with desiccant packs in dry environments below 50% relative humidity to slow oxidation of the 10.0µin gold finish. Extended storage (beyond 12 months) may result in light surface tarnishing on the copper alloy substrate beneath the gold, which typically does not affect initial electrical performance but can reduce contact lifespan by 10–20% in high-cycle applications. Shipping cartons for the 345-098-555-203 should prevent lateral flexing of the floating bobbin; foam inserts or edge guards prevent mechanical misalignment that could stress the contact cantilever structure. Upon receipt, inspect the 345-098-555-203 for visible oxidation (dark spots or discoloration) and mechanically verify that both rows of contacts engage smoothly when a 0.054"–0.070" test card is inserted.
What is the typical contact resistance specification for the 345-098-555-203 under normal operating loads, and how does this compare to backplane connectors?
Contact resistance for the 345-098-555-203 is typically 50–100mΩ per contact pair under the standard insertion force of 40–60 grams per contact. This specification assumes clean gold surfaces and is measured after initial break-in (typically after 5–10 insertion cycles). The cantilever design of the 345-098-555-203 produces consistent contact resistance across multiple insertion cycles due to controlled wiping action, though oxidation can increase measured resistance by 20–40% after 1000+ cycles without cleaning. Backplane connectors with similar pitch specifications typically achieve 30–50mΩ through higher contact pressure and specialized surface treatments, making them preferable for low-signal-level applications or precision analog circuits where contact resistance drift must be minimized.
Are there documented compatibility issues between the 345-098-555-203 and specific PCB edge profiles or card material types?
The 345-098-555-203 is optimized for FR-4 and CEM-3 card materials within the 0.054"–0.070" thickness range. Cards manufactured from polyimide (Kapton) or ceramic substrates outside this thickness band can cause uneven contact loading or stress on the floating bobbin of the 345-098-555-203. Edge profiles with bevels greater than 0.010" can misalign the 345-098-555-203's dual rows and cause single-point contact or intermittent engagement. Plating on card edges (e.g., tin or nickel finish) is compatible with the 345-098-555-203, though gold-plated edges may cause increased wear on the 10.0µin gold finish of the connector. Recommended card edge finish for the 345-098-555-203 is bare copper or ENIG (electroless nickel/immersion gold) with a minimum 1µm nickel and 0.05µm gold to ensure stable contact resistance across temperature cycling.
How does the dual read-out configuration of the 345-098-555-203 enable parallel signal routing, and what are the design trade-offs?
The 345-098-555-203's two independent read-out paths allow simultaneous connection of two separate PCBs or backplanes to a single card edge, enabling parallel signal distribution or redundant channel architecture. This dual configuration can reduce backplane complexity by eliminating the need for separate connectors on opposite sides of a card, saving approximately 0.5"–0.75" of board length. However, the straddle mount geometry of the 345-098-555-203 requires that both rows be populated and connected; asymmetric loading (only one row populated) can create mechanical stress and uneven contact wear. Applications using the 345-098-555-203's dual read-out feature should implement identical electrical loads on both rows to prevent differential signal propagation delays that could cause phase skew in clock distribution or timing-critical applications.
What is the mechanical retention mechanism of the 345-098-555-203, and how does this affect card removal procedures in production environments?
The 345-098-555-203 uses a floating bobbin and cantilever contact design that creates mechanical friction rather than positive latching, allowing card extraction with typical hand pressure of 10–15 pounds. This friction-based retention of the 345-098-555-203 eliminates the complexity of latch mechanisms but requires careful handling during mass production to prevent accidental ejection. Automated card changers or test handlers using the 345-098-555-203 should incorporate precision card guides and mechanical interlock brackets to prevent lateral movement during operation. The card retention force of the 345-098-555-203 can degrade if the floating bobbin becomes contaminated with dust or solder flux residue; cleaning with compressed air at annual intervals in high-use environments (>1000 insertions/year) is recommended to maintain consistent withdrawal forces.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 345-098-555-203

Product Attribute 345-098-555-503 345-098-555-204 345-098-555-207 345-098-555-202
Part Number 345-098-555-503 345-098-555-204 345-098-555-207 345-098-555-202
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Number of Rows - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Positions/Bay/Row - - - -
Card Type - - - -
Card Thickness - - - -
Contact Type - - - -
Material - Insulation - - - -
Termination Rows - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Finish - - - -
Contact Material - - - -
Gender - - - -
Pitch - - - -
Flange Feature - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Finish Thickness - - - -
Features - - - Simultaneous Sampling
Number of Positions - - - -
Read Out - - - -
Series - - - -
Termination - - - -
Color - - - -

345-098-555-203 Datasheet PDF

Download 345-098-555-203 pdf datasheets and EDAC Inc. documentation for 345-098-555-203 - EDAC Inc..

Datasheets
345,395 Series Ordering Guide.pdf 345-098-555-203 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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345-098-555-203 Image

345-098-555-203

EDAC Inc.
98D-345-098-555-203

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