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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors345-098-555-207
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345-098-555-207 - EDAC Inc.

Manufacturer Part Number
345-098-555-207
Manufacturer
EDAC Inc.
Allelco Part Number
98D-345-098-555-207
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
44,969 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 98POS 0.100
Package
Box
Data sheet
345-098-555-207.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 44969
  • Unit Price: $16.942
  • Subtotal: $0.00

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Specifications

345-098-555-207 Tech Specifications
EDAC Inc. - 345-098-555-207 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 345-098-555-207

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder Eyelet(s)
Series 345
Read Out Dual
Pitch 0.100" (2.54mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions/Bay/Row 49
Number of Positions 98
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Flush Mount, Top Opening, Threaded Insert, M3
Features Card Extender
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 345-098

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness range does the 345-098-555-207 connector accept, and how does this affect PCB design tolerances?
The 345-098-555-207 is designed for cards with thickness between 0.054" and 0.070" (1.37–1.78 mm). This specification is critical during PCB layout because undersized cards may produce unreliable contact pressure on the cantilever contacts, while oversized cards risk damaging the connector body or contact arms. Standard FR-4 PCB material typically falls within this range when manufactured to IPC Class 2 or 3 tolerances, but designers working with specialized substrates (thick copper, metal core, or composite boards) should verify actual finished thickness before design sign-off. The dual-edge configuration of the 345-098-555-207 means both sides of the card engage simultaneously, so uneven thickness across the board can create asymmetric contact pressure and intermittent connections in high-reliability applications.
How does the 0.100" pitch of the 345-098-555-207 compare to finer-pitch edge connectors, and when should each be selected?
The 345-098-555-207 uses a 0.100" (2.54 mm) pitch, which is one of the most established standards in legacy and industrial equipment. This larger pitch offers several design trade-offs: contact spacing reduces crosstalk and EMI coupling relative to finer-pitch designs (0.05" or smaller), simplifies manual rework and troubleshooting, and provides more robust mechanical alignment during card insertion. However, the 345-098-555-207's density is lower—98 positions occupy roughly 4.9" of edge length in a dual-row configuration. Finer-pitch alternatives (e.g., 0.05" pitch connectors with similar position counts) achieve higher density in less physical space, making them preferable for compact form factors or retrofit applications where board dimensions are constrained. For new designs requiring high pin density, finer pitch is often selected; the 345-098-555-207 remains the better choice for applications prioritizing signal integrity, mechanical durability, or compatibility with existing backplane/slot designs.
What is the significance of the gold contact finish thickness (10.0µin) on the 345-098-555-207, and does it affect long-term reliability?
The 345-098-555-207 specifies a gold contact finish of 10.0 microinches (0.25 µm), which is relatively thin compared to high-reliability military or aerospace connectors (typically 50–100 µin). This thinner plating reduces material cost and is adequate for commercial and industrial applications with moderate contact-mating cycles (typically 50–500 cycles). However, thinner gold can be susceptible to faster wear in high-cycle applications or environments with abrasive particles; after repeated insertion-removal cycles, the gold may wear through to the underlying copper alloy, potentially increasing contact resistance or corrosion risk if the bare copper is exposed to moisture or corrosive gases. For designs with frequent hot-swap or test-station scenarios (>500 cycles), a thicker gold finish specification should be evaluated. The 345-098-555-207's cantilever contact design provides some mechanical compliance that helps distribute wear, but the finish thickness remains a limiting factor for extreme cycle-life applications.
Does the 345-098-555-207 require any special mounting or retention features during assembly, and what are the implications for production?
The 345-098-555-207 uses a straddle-mount, board-edge design with a flush-mount, top-opening flange that includes M3 threaded inserts. This configuration means the connector sits directly on the board edge and is typically held in place by card guides or mechanical fixtures during assembly; the threaded inserts allow optional mechanical anchoring or strain-relief attachment. Unlike traditional right-angle connectors soldered to a PCB surface, the 345-098-555-207 relies on solder eyelet terminations at the board edge, which require careful solder-reflow profile management to ensure adequate wetting without thermal shock to the connector body. Production lines must account for the connector's cantilever contact arms—excess mechanical stress during card insertion or removal before solder cure is complete can permanently deform these contacts. The straddle-mount geometry also means the connector extends along the card's edge, so routing high-speed or sensitive signals near the connector opening can introduce crosstalk; designers should maintain minimum clearance distances (typically 0.200" or more, per IPC guidelines) between signal traces and the connector perimeter.
How does the dual-row, dual-edge configuration of the 345-098-555-207 differ functionally from single-row connectors, and what design advantages does it offer?
The 345-098-555-207 provides 98 positions across two rows and two edges (49 positions per row, both sides of the card), creating redundancy and higher signal density per card width. In a dual-edge configuration, signals on the top and bottom surfaces of the card can be accessed through a single connector interface, eliminating the need for separate top and bottom connectors or internal card wiring to route signals to a single connector. This reduces assembly complexity and board real estate. The dual-row layout also enables balanced current distribution—high-current power or ground signals can be split across multiple positions to reduce resistive losses and thermal hotspots. However, the dual-edge design requires careful EMI management: signals on opposite sides of the card may couple through the substrate, and the connector's geometry creates a U-shaped electromagnetic field that can interact with nearby circuitry. Designers of the 345-098-555-207 integration should use ground planes and controlled impedance traces near the connector to minimize cross-coupling; this is particularly critical for high-speed digital or analog signals operating above 50 MHz.
What environmental and compliance certifications apply to the 345-098-555-207, and how do they influence material selection for harsh environments?
The 345-098-555-207 is RoHS3 compliant and REACH unaffected, meeting EU environmental directives for lead-free soldering and hazardous substance restrictions. The connector operates across -40°C to 105°C, suitable for industrial and commercial environments but not rated for aerospace or extreme high-temperature applications (>125°C). The insulation material is polyester thermoplastic, which provides good mechanical strength and cost efficiency but has lower temperature ratings and worse chemical resistance than liquid crystal polymer (LCP) or polyetheretherketone (PEEK). In environments with aggressive chemicals (cleaning solvents, salt spray, or industrial solvents), the polyester material can degrade or absorb moisture over time, potentially increasing contact resistance. The ECCN classification (EAR99) and HTSUS code indicate the 345-098-555-207 has standard export controls, affecting supply chain logistics for international applications. For harsh-environment applications (marine, chemical processing, or outdoor industrial systems), designers should specify conformal coating or protective potting around the connector region and validate material compatibility with expected chemical exposures before production commitment.
How should trace routing and signal layer assignment be planned around the 345-098-555-207 connector to minimize crosstalk and EMI in dense digital designs?
The 345-098-555-207's dual-row, dual-edge geometry creates a complex electromagnetic coupling region, especially when 98 positions carry mixed-signal types (digital, analog, power, ground). Best practices for the 345-098-555-207 integration include: (1) dedicate adjacent positions to power and ground to create a Faraday cage effect, minimizing radiated coupling to signal lines; (2) avoid routing high-speed differential pairs (e.g., PCIe, LVDS) immediately adjacent to the connector opening—maintain at least 0.250" clearance; (3) use symmetric trace routing on top and bottom layers to reduce loop area and differential-mode radiation; (4) employ controlled-impedance design for high-speed signals feeding the 345-098-555-207, typically 50–100 Ω for single-ended and 85–100 Ω for differential pairs, to minimize reflections and ringing; (5) if both connector edges carry analog signals, shield analog return paths from digital ground return paths using a dedicated ground layer beneath the connector. Solder eyelet terminations on the 345-098-555-207 should connect to the backplane or mating connector through short, direct traces (ideally <0.5 cm) to avoid stubs and resonance.
What mating connector or backplane interface is typically used with the 345-098-555-207, and are there compatibility concerns across different suppliers?
The 345-098-555-207 is a female card-edge connector intended to mate with a male backplane connector or test fixture. EDAC's 345 series backplane connectors use the same 0.100" pitch, dual-row, dual-edge geometry, and cantilever contact design. However, the 345-098-555-207 is sometimes used as a replacement or retrofit connector in legacy systems that originally used different manufacturers' card-edge designs (e.g., Amphenol, Samtec, or obsolete vendor products). Compatibility risks include: (1) contact pressure mismatch—if the 345-098-555-207 female contact force differs significantly from the original mating connector, cards may insertion-force spike or develop intermittent contacts; (2) gold thickness and contact material variations—mixing connectors from different suppliers can create galvanic corrosion at the contact interface if base metals differ; (3) mechanical fit tolerances—the 0.054–0.070" card thickness window for the 345-098-555-207 must align exactly with the backplane connector's acceptance window. Before specifying the 345-098-555-207 as a replacement in existing systems, request insertion-force data from both the backplane connector supplier and validate card thickness measurements across a sample of production units. For new designs, committing to the full EDAC 345 family (cards, connectors, and backplanes from the same series) eliminates compatibility ambiguity.
What is the typical insertion and extraction force for the 345-098-555-207, and how does this affect user-friendliness and mechanical reliability during field maintenance?
The 345-098-555-207 datasheet typically specifies insertion and extraction forces around 10–20 lbf (45–90 N) total for the full 98-position connector, translating to approximately 0.1–0.2 lbf per position. This force level is designed to be manageable by a technician with one hand but provides sufficient contact pressure for reliable electrical connection over the connector's service life. However, the dual-edge, dual-row configuration concentrates this force into a relatively compact area, which can create uneven pressure distribution if the card is not perfectly aligned during insertion. Excessive force during insertion can bend or permanently deform the cantilever contact arms on the 345-098-555-207, reducing contact spring force and creating intermittent connections on that position. Field maintenance protocols should include tactile feedback training—the correct insertion should feel smooth and relatively uniform; sudden resistance spikes or 'catches' indicate potential misalignment or a bent pin. For applications where cards are hot-swapped frequently (e.g., test benches, military vehicles), the 345-098-555-207's insertion force is generally acceptable, but regular inspection of contact arms (via visual or fluoroscopy) is recommended to detect mechanical degradation before field failures occur.
How does the cantilever contact design of the 345-098-555-207 compare to other contact geometries in terms of performance trade-offs?
The 345-098-555-207 employs cantilever contacts—spring-like arms that flex inward during card insertion, then return to their original position to grip the card edge. This design offers low contact resistance (typically <50 mΩ) due to the large contact area and wiping action during insertion, and it provides inherent compliance that tolerates minor variations in card thickness or connector alignment. However, cantilever contacts are more susceptible to permanent deformation under excessive insertion force or mechanical shock; unlike tulip or bifurcated contact designs (which use two independent contact points for redundancy), the 345-098-555-207's single cantilever arm per position creates a single point of failure if that arm is bent or fatigued. In high-vibration environments (aircraft, military vehicles), the cantilever design can experience micro-motion and fretting corrosion at the contact interface, potentially increasing resistance over time. Alternative contact geometries—such as dual-blade or scalloped designs—distribute contact forces more evenly and are more resistant to fatigue, but at the cost of higher insertion force and reduced compliance. For general industrial and commercial applications, the 345-098-555-207's cantilever design balances cost, insertion ease, and performance; for aerospace or high-reliability (>100 insertion cycles) applications, evaluation of alternative contact styles is warranted.
What solder reflow profile and thermal management considerations are specific to the 345-098-555-207's solder eyelet terminations?
The 345-098-555-207 uses solder eyelets—hollow, tubular terminations that extend through the PCB and are soldered on the back side during wave or reflow soldering. Unlike flat SMD pads, eyelets have significant thermal mass, which can create challenges during reflow: (1) eyelet-to-PCB thermal conductivity is relatively low, so the eyelet may not reach full solder melt temperature during a standard reflow profile, resulting in cold solder joints or insufficient wetting; (2) the connector body (polyester thermoplastic, Tg ~80–100°C) is in close proximity to the solder joint and can be damaged if the reflow peak temperature exceeds 260°C or dwell time above 240°C is extended; (3) thermal gradients across the 345-098-555-207's 98 eyelets can be uneven if solder paste volume or thermal profiling is inconsistent. Recommended practices: use a slower ramp rate (1–2°C/sec) to allow eyelets to heat uniformly; maintain peak reflow temperature at 245–255°C (5–10°C below the connector's thermal limit); use a two-zone heating profile if available (first zone heats the connector body, second zone brings eyelets to full solder melt); inspect solder joints under magnification (10× minimum) for voids or insufficient wetting. For wave soldering, the connector can typically withstand dipping temperatures up to 250°C for 3–5 seconds, but extended dwell times risk insulation degradation. Post-reflow, allow the 345-098-555-207 to cool naturally without forced air; rapid cooling can create residual stress in the solder-eyelet interface and lead to latent mechanical failures.
In high-speed digital applications, what signal integrity challenges are introduced by the 345-098-555-207's dual-edge configuration, and how can they be mitigated?
The 345-098-555-207's dual-edge, dual-row layout introduces several signal integrity challenges in high-speed applications (e.g., PCIe Gen 3+ or high-frequency analog >100 MHz): (1) differential impedance mismatch—because signals on opposite sides of the card are routed through separate connector paths, the loop area and propagation delay can differ, creating mode conversion and differential skew; (2) common-mode coupling—the symmetric geometry of the 345-098-555-207 creates balanced capacitive coupling between top and bottom signal layers, which can generate common-mode noise on differential pairs; (3) crosstalk between adjacent positions—at 0.100" pitch, capacitive coupling between neighboring signal lines is approximately 30–50 pF per inch of routing length, significant enough to cause near-end and far-end crosstalk in high-speed designs. Mitigation strategies: (1) use differential pair spacing rules appropriate for the pitch (minimum 3× the trace width between pairs); (2) route differential pairs symmetrically from the 345-098-555-207 connector through the card, maintaining equal path lengths to <100 mils; (3) insert ground vias adjacent to each signal eyelet on the 345-098-555-207 to suppress common-mode radiation; (4) use series termination (25–50 Ω) near the connector for fast edge-rate signals (rise time <1 ns) to control overshoot; (5) perform frequency-domain analysis (TDR/VNA) on sample cards to validate impedance continuity across the connector transition.
What is the card extender feature of the 345-098-555-207, and what debugging or testing scenarios justify its use?
The 345-098-555-207 is specified with a card-extender feature, which typically means the connector is designed to accommodate mating with a card-extender accessory—a mechanical spacer or lever arm that extends the card outward from the backplane, allowing physical access to component-side testing points or signal injection without removing the card from the system. This feature is valuable in debugging and production-test scenarios: (1) in-circuit testing (ICT) or functional test—technicians can probe signals on the extended card while the backplane remains powered and connected, accelerating fault diagnosis; (2) thermal imaging or current measurement—extended access allows non-contact thermal measurement or oscilloscope probes to be positioned near hot components without obstruction; (3) design validation—during prototype phases, the 345-098-555-207's extender capability simplifies signal injection for design-in validation or performance characterization. However, card extenders introduce mechanical risks: extended cards experience increased bending moment at the connector interface, potentially causing damage to the 345-098-555-207's cantilever contacts if the extender is removed abruptly or if the card is subjected to lateral shock. For production use, card extenders should be temporary fixtures with documented mechanical limits (maximum unsupported length, acceptable lateral force); for high-reliability systems, extender use should be restricted to initial debug phases and disabled in field-deployed systems.
What lead-time or design-cycle considerations apply to the 345-098-555-207 compared to more modern connector alternatives?
The 345-098-555-207 is listed as an active part (in production), which typically means stock availability and lead times are stable—commonly 2–6 weeks from major distributors for standard configurations. However, the 0.100" pitch and dual-edge form factor are legacy designs, and some variants or custom configurations (e.g., partial-position versions, alternative contact finishes, or reduced-thickness options for specific card types) may have longer lead times or minimum-order quantities. The design-cycle risk for the 345-098-555-207 is moderate: if a project relies on a specific EDAC 345-series backplane or card design, committing to the 345-098-555-207 connector is straightforward; however, if the application must integrate with third-party backplane equipment or future product generations, compatibility should be validated early. Modern alternatives—such as micro-pitch connectors (0.05" or smaller) or high-speed mezzanine standards (e.g., FMC, VITA, or custom high-density designs)—offer better density and performance for new designs, but they typically require longer design cycles and custom PCB layout expertise. For retrofit, legacy-system support, or applications where 0.100" pitch is already standardized, the 345-098-555-207 offers predictable supply and immediate integration; for new designs with high-density or high-speed requirements, evaluation of alternatives is recommended to avoid over-specifying legacy technology.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 345-098-555-207

Product Attribute 345-098-555-203 345-098-555-507 345-098-555-202 345-098-555-201
Part Number 345-098-555-203 345-098-555-507 345-098-555-202 345-098-555-201
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Flange Feature - - - -
Gender - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Rows - - - -
Series - - - -
Color - - - -
Contact Type - - - -
Termination Rows - - - -
Contact Material - - - -
Pitch - - - -
Features - - - Simultaneous Sampling
Material - Insulation - - - -
Number of Positions/Bay/Row - - - -
Termination - - - -
Card Thickness - - - -
Card Type - - - -
Number of Positions - - - -
Read Out - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Finish - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Finish Thickness - - - -

345-098-555-207 Datasheet PDF

Download 345-098-555-207 pdf datasheets and EDAC Inc. documentation for 345-098-555-207 - EDAC Inc..

Datasheets
345,395 Series Ordering Guide.pdf 345-098-555-207 Drawing.pdf
HTML Datasheet
345-098-555-207 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

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    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
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    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

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    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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345-098-555-207 Image

345-098-555-207

EDAC Inc.
98D-345-098-555-207

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