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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors346-040-556-804
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346-040-556-804 - EDAC Inc.

Manufacturer Part Number
346-040-556-804
Manufacturer
EDAC Inc.
Allelco Part Number
98D-346-040-556-804
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
28,827 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 40POS 0.125
Package
Box
Data sheet
346-040-556-804.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 28827
  • Unit Price: $11.206
  • Subtotal: $0.00

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1+ $11.206 $11.21
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

346-040-556-804 Tech Specifications
EDAC Inc. - 346-040-556-804 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 346-040-556-804

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 346
Read Out Dual
Pitch 0.125" (3.18mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions/Bay/Row 20
Number of Positions 40
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Top Mount Opening, Unthreaded, 0.156" (3.96mm) Dia
Features Card Extender
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 346-040

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness tolerance does the 346-040-556-804 support, and how does this affect PCB design margins?
The 346-040-556-804 is designed to accommodate card edge thicknesses between 0.054" and 0.070" (1.37mm to 1.78mm). This 0.016" (0.41mm) window is typical for FR-4 PCB assemblies and allows designers to work with standard board materials without requiring custom thickness specifications. When designing the edge connector interface for the 346-040-556-804, verify that your PCB fabrication tolerance stack-up remains within this range, as boards thinner than 0.054" may cause inconsistent contact engagement, while thicker boards risk mechanical binding during insertion.
How does the 0.125" pitch of the 346-040-556-804 compare to other common card edge connector standards for signal integrity applications?
The 346-040-556-804 features a 0.125" (3.18mm) pitch across its 20 positions per row, placing it in the coarser-pitch category alongside legacy standards like DIN 41612 and traditional VME backplane connectors. This larger pitch reduces crosstalk between adjacent contacts compared to finer-pitch alternatives (such as 0.100"), making the 346-040-556-804 better suited for mixed-signal and noisy industrial environments where signal isolation is prioritized over density. However, the trade-off is reduced contact count per unit length; the 346-040-556-804's dual-row, 40-position configuration spans approximately 2.5 inches, which may constrain applications requiring compact form factors.
What are the practical implications of the dual edge, dual read-out configuration on the 346-040-556-804 for backplane routing?
The 346-040-556-804 provides two independent signal rows (top and bottom edges), each presenting 20 positions to the mating connector. This dual read-out architecture enables designers to separate power distribution, signal lines, and ground returns into isolated layers on the backplane. When implementing the 346-040-556-804 in a backplane design, you can route the upper row contacts to one layer stack and lower row contacts to another, reducing via congestion and improving signal integrity. The straddle mount configuration of the 346-040-556-804 means the connector body straddles the PCB edge, allowing both rows to make simultaneous contact without requiring dual-side assembly complexity.
Is the gold plating thickness on the 346-040-556-804 sufficient for high cycle-count insertion applications?
The 346-040-556-804 features 10.0µin (0.25µm) of gold plating over a copper alloy base. This thickness is below the 50µin threshold typically recommended for applications exceeding 100 mating cycles, placing the 346-040-556-804 in the light-duty to moderate-duty category. For laboratory test fixtures or development environments with 50–100 planned insertions, the 346-040-556-804 plating is adequate; however, for production systems requiring frequent board swaps or hot-swap capability, consider whether the plating durability aligns with your insertion cycle budget. The thin gold layer on the 346-040-556-804 does enhance corrosion resistance in humid or salt-spray environments compared to bare copper, but does not extend the contact life in high-cycle mechanical wear scenarios.
How does the cantilever contact design of the 346-040-556-804 affect insertion force and mating reliability?
The 346-040-556-804 uses cantilever-style contacts, which provide compliant engagement by flexing during insertion rather than using rigid guide pins. This design reduces insertion force compared to board-to-board connectors with rigid contacts, typically resulting in less than 5 pounds of total insertion force across all 40 contacts of the 346-040-556-804. The trade-off is that cantilever contacts on the 346-040-556-804 are more sensitive to card skew and misalignment; if the edge card approaches the connector at an angle greater than approximately 2–3 degrees, contact engagement becomes inconsistent. When specifying the 346-040-556-804, ensure mechanical guides or alignment features are included in the carrier or backplane housing to prevent rocking during insertion.
What is the expected contact resistance stability of the 346-040-556-804 under thermal cycling between -40°C and 105°C?
The 346-040-556-804 is rated for continuous operation across -40°C to 105°C, a 145°C span typical of industrial and telecommunications equipment. Gold plating on the 346-040-556-804 provides oxidation resistance across this range, maintaining contact resistance below 50mΩ per contact even after repeated thermal excursions. However, the copper alloy substrate of the 346-040-556-804 exhibits thermal expansion behavior that, combined with the polyester thermoplastic insulation housing, can introduce mechanical stress at temperature extremes. During design validation of the 346-040-556-804, perform thermal cycling tests (–40°C to 105°C, 5–10 cycles) to verify contact resistance remains stable and no intermittent opens occur at low-temperature extremes where insulation stiffness increases and contact pressure may momentarily decrease.
How should the 346-040-556-804 be integrated into a card extender or test fixture application, and what mechanical considerations apply?
The 346-040-556-804 is explicitly designed with a card extender feature, indicated by the top-mount opening (0.156" diameter, unthreaded) in the flange. This opening accommodates a retention clip or ejector pin mechanism typical of card extender assemblies. When designing a test fixture around the 346-040-556-804, the unthreaded opening allows for spring-loaded ejection mechanisms or simple push-pin extraction without threaded fastener complexity. The board-edge straddle-mount configuration of the 346-040-556-804 simplifies fixture installation: the connector is affixed directly to the backplane PCB without requiring additional through-holes or standoff hardware. Ensure the fixture frame provides vertical support to prevent card rocking, as the cantilever contacts of the 346-040-556-804 depend on consistent pressure application.
What are the advantages of the 346-040-556-804 for legacy equipment retrofit versus newer alternatives?
The 346-040-556-804 belongs to the Mercury 346 series, a proven standard in vintage test equipment, industrial controllers, and telecommunications backplanes from the 1980s through early 2000s. For retrofit and equipment restoration projects, the 346-040-556-804 offers direct compatibility with existing PCB edge card designs without requiring redesign or adapter logic. The 0.125" pitch, dual-row, 40-position configuration of the 346-040-556-804 is difficult to source as direct equivalents from modern suppliers; newer systems favor fine-pitch alternatives like 0.100" or printed backplanes. However, when the 346-040-556-804 is the original specification, sourcing new units is preferable to designing a custom converter, which would introduce additional latency, potential signal integrity issues, and cost. The ROHS3 compliance status of the 346-040-556-804 also means you can integrate retrofit components into modern supply chains without documentation conflicts.
What solder joint reliability considerations apply to the 346-040-556-804 termination in high-vibration environments?
The 346-040-556-804 uses solder termination at the board edge, with contact tails designed to flex minimally during vibration. In high-vibration applications (such as aerospace, automotive test benches, or heavy industrial equipment), the solder joint between the 346-040-556-804 termination tail and the backplane PCB pad is the primary fatigue risk. To optimize reliability of the 346-040-556-804 in vibration environments, ensure that the solder mask relief around each termination tail on the 346-040-556-804 provides adequate fillet area (minimum 0.5mm clearance from pad edge). Use a solder alloy with appropriate shear strength (lead-free SAC305 or equivalent) when assembling the 346-040-556-804. Perform resonance testing at the backplane's first natural frequency to confirm no standing-wave excitation occurs at the solder joints of the 346-040-556-804.
How does the polyester thermoplastic insulation material of the 346-040-556-804 affect chemical compatibility in marine or corrosive atmospheres?
The 346-040-556-804 housing is molded from polyester thermoplastic, which offers good resistance to sea salt spray and acidic industrial atmospheres compared to phenolic or epoxy alternatives. However, polyester is susceptible to stress-cracking when exposed to certain solvents (such as acetone or chlorinated hydrocarbons). When deploying the 346-040-556-804 in coastal or corrosive environments, verify that cleaning solvents used during assembly and maintenance are compatible with polyester; isopropyl alcohol and aqueous flux cleaners are safe for the 346-040-556-804, while aromatic hydrocarbons should be avoided. The gold-plated contacts of the 346-040-556-804 provide additional corrosion protection, but if the insulation housing of the 346-040-556-804 is exposed to continuous salt spray (not just splashing), consider conformal coating the populated backplane assembly to extend service life.
What is the footprint and spacing requirement for multiple 346-040-556-804 connectors arranged in parallel on a single backplane?
Each 346-040-556-804 occupies approximately 2.5 inches (63.5mm) of card-edge spacing due to its 20 positions × 0.125" pitch per row configuration. When designing a backplane with multiple 346-040-556-804 connectors in parallel (side-by-side), you must account for the connector body width (typically 0.5–0.75 inches depending on contact tail configuration) in addition to the pitch footprint. The manufacturer does not specify a minimum center-to-center spacing between adjacent 346-040-556-804 connectors, but practical layouts allow 3–4 inches of edge space per connector including mounting hardware and solder tail relief areas. When planning high-density backplane layouts with the 346-040-556-804, verify clearance for card insertion tools and ensure that adjacent solder tail patterns do not create thermal stress concentrations during wave or reflow soldering of the 346-040-556-804 terminations.
Does the 346-040-556-804 require any special moisture conditioning or baking procedures before assembly?
The polyester thermoplastic material of the 346-040-556-804 absorbs minimal moisture under normal storage conditions (relative humidity ≤60%), unlike phenolic materials which require pre-bake conditioning. However, if the 346-040-556-804 has been stored in humid conditions (>80% RH) or in sealed packaging for extended periods, a brief pre-assembly bake at 80–100°C for 4–6 hours is recommended to prevent moisture-related voids in solder joints during wave or reflow assembly of the 346-040-556-804. This procedure is optional rather than mandatory for the 346-040-556-804 under typical manufacturing environments; it is most relevant for high-reliability applications or when solder joint voids exceed assembly standards for the 346-040-556-804. After bake-out, the 346-040-556-804 should be used within 24 hours or re-sealed in a desiccant bag.
What regulatory compliance confirmations should be verified for the 346-040-556-804 when integrating into medical device or aerospace applications?
The 346-040-556-804 carries RoHS3 compliance and REACH Unaffected status, confirming that the connector conforms to European hazardous substance restrictions for consumer electronics. For medical device applications, the 346-040-556-804 does not inherently carry FDA approval or biocompatibility certification; however, the materials and finishes of the 346-040-556-804 (copper alloy, gold, polyester) are generally compatible with medical device requirements if the device itself requires such approvals. For aerospace applications, verify that the 346-040-556-804 meets any procurement specifications (such as AS6081 or customer-specific QPL requirements) before using it in flight-critical systems; the 346-040-556-804 is primarily a commercial-grade connector and may not hold aerospace approvals without explicit third-party qualification. When integrating the 346-040-556-804 into regulated applications, request traceability documentation and material composition certificates from your distributor.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 346-040-556-804

Product Attribute 346-040-556-808 346-040-556-803 346-040-556-802 346-040-556-807
Part Number 346-040-556-808 346-040-556-803 346-040-556-802 346-040-556-807
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Card Type - - - -
Number of Rows - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Card Thickness - - - -
Termination Rows - - - -
Read Out - - - -
Gender - - - -
Color - - - -
Number of Positions - - - -
Flange Feature - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Material - - - -
Contact Finish - - - -
Termination - - - -
Series - - - -
Contact Finish Thickness - - - -
Pitch - - - -
Material - Insulation - - - -
Number of Positions/Bay/Row - - - -
Features - - - Simultaneous Sampling
Contact Type - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

346-040-556-804 Datasheet PDF

Download 346-040-556-804 pdf datasheets and EDAC Inc. documentation for 346-040-556-804 - EDAC Inc..

Datasheets
346,396 Series Ordering Guiide.pdf 346-040-556-804 Drawing.pdf
Environmental Information
EDAC REACH.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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346-040-556-804 Image

346-040-556-804

EDAC Inc.
98D-346-040-556-804

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