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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors346-040-556-807
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346-040-556-807 - EDAC Inc.

Manufacturer Part Number
346-040-556-807
Manufacturer
EDAC Inc.
Allelco Part Number
98D-346-040-556-807
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
31,598 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 40POS 0.125
Package
Box
Data sheet
346-040-556-807.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 31598
  • Unit Price: $13.984
  • Subtotal: $0.00

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Specifications

346-040-556-807 Tech Specifications
EDAC Inc. - 346-040-556-807 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 346-040-556-807

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 346
Read Out Dual
Pitch 0.125" (3.18mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions/Bay/Row 20
Number of Positions 40
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Top Mount Opening, Threaded Insert, M3
Features Card Extender
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 346-040

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness tolerance does the 346-040-556-807 connector accept, and how does this affect PCB design constraints?
The 346-040-556-807 accommodates card thickness between 0.054" and 0.070" (1.37mm to 1.78mm), which represents a relatively tight tolerance band for edge connectors. This specification is critical during PCB layout because undersized cards may cause intermittent contact due to insufficient cantilever beam deflection, while oversized cards risk mechanical binding or contact damage. The 346-040-556-807's dual-row, straddle-mount configuration means both upper and lower contact sets must engage uniformly; any thickness deviation affects contact pressure symmetry. Designers should verify actual fabricated board thickness early in prototyping, as typical PCB tolerances (±0.010" to ±0.015") can push cards toward the specification limits.
How does the 0.125" pitch of the 346-040-556-807 compare to common alternatives for 40-position edge connector applications?
The 346-040-556-807 uses 0.125" (3.18mm) pitch, which is a standard spacing for mid-density edge connectors but significantly coarser than high-density options like 0.050" or 0.100" alternatives. This 0.125" pitch on the 346-040-556-807 provides several trade-offs: contact robustness and manufacturing yield improve with wider spacing, signal integrity benefits from reduced crosstalk over longer trace runs, but the connector footprint becomes larger. For applications requiring 40 positions, the 346-040-556-807's dual-row configuration with 0.125" pitch delivers approximately 2.5 inches of edge engagement width, making it suitable for backplane or card extender roles where mechanical stability and ease of hand insertion are valued over space minimization.
What is the functional difference between the dual-readout design and single-edge alternatives, and why does the 346-040-556-807 implement this as a card extender?
The 346-040-556-807 features a dual-readout design with two contact rows (20 positions per row = 40 total), allowing simultaneous engagement of both sides of the PCB edge. This dual arrangement, combined with straddle-mount geometry, provides mechanical leverage and redundancy—if one row experiences temporary contact loss due to vibration or thermal cycling, the opposing row maintains signal continuity. Card extender applications benefit from this redundancy because the 346-040-556-807 often remains partially inserted during diagnostics or live swaps. The dual-readout structure also distributes mechanical stress more evenly than single-edge designs, reducing localized wear on individual cantilever beams and extending connector lifespan in test harnesses where repeated insertion cycles are common.
Does the 346-040-556-807's gold contact finish (10.0µin thickness) provide adequate corrosion protection for industrial environments, or are additional conformal coatings necessary?
The 346-040-556-807 specifies 10.0µin (0.25µm) gold contact finish over a copper alloy substrate. This thickness is typical for general-purpose connectors but represents the lower boundary for corrosion resistance in harsh industrial settings. At 0.25µm, the gold layer provides protection against mild oxidation and handling tarnish during the first 1–2 years of storage or use, but extended exposure to sulfurous industrial atmospheres, salt spray, or high-humidity environments may degrade coverage before the underlying copper corrodes. For applications in such conditions, the 346-040-556-807 can benefit from supplemental conformal coating (acrylic or urethane) applied after assembly. Alternatively, designers should evaluate connectors with thicker gold or nickel-gold plating if the 346-040-556-807's baseline finish proves insufficient during environmental qualification testing.
How does the 346-040-556-807's M3 threaded insert mounting affect PCB layout and mechanical assembly planning?
The 346-040-556-807 incorporates M3 threaded inserts as part of its top-mount opening flange feature, enabling screw-down retention to the host enclosure or backplane. This design choice eliminates reliance on solder joint strength alone for mechanical stability, which is beneficial for high-vibration applications where connector inertial forces could stress the solder fillet. However, the M3 insert requirement adds assembly steps: the PCB must align precisely with threaded holes in the mating structure, and insertion force must be controlled to avoid stripping the plastic insert threads. The 346-040-556-807's flange design also increases the connector's overall profile height by approximately 0.25 to 0.35 inches, which may constrain backplane spacing in dense multi-connector applications. Mechanical designers should verify clearance above and below the 346-040-556-807 before committing board layout.
What thermal performance should be expected from the 346-040-556-807 during sustained operation near its 105°C maximum rating?
The 346-040-556-807 is rated for continuous operation from -40°C to 105°C, with the upper limit typically governed by the polyester thermoplastic insulation material used in the connector body and base. As temperature approaches 105°C, the polymer's mechanical properties (creep resistance, dielectric strength) degrade gradually, though the 346-040-556-807 design margins typically allow safe operation throughout the specified range. However, at sustained 100°C+ ambient conditions, contact resistance may increase by 10–20% due to thermal cycling and copper oxide layer growth at the conductor interface. For high-current applications (where the 346-040-556-807 carries signal and power), designers should conduct thermal modeling to verify that I²R heating in the solder joint and trace does not cause local temperatures to exceed the 105°C rating. Forced-air cooling or thermal management of the backplane PCB in hot environments helps maintain reliable operation of the 346-040-556-807.
How does the 346-040-556-807's cantilever contact design perform across repeated insertion cycles, and what maintenance intervals should be planned?
The 346-040-556-807 uses cantilever-beam contacts, which flex during card insertion and gradually lose spring force over many cycles due to stress relaxation and cyclic fatigue in the copper alloy material. Testing data for similar connectors suggests the 346-040-556-807 maintains contact resistance within specification for 100–500 insertion cycles before contact force begins to decline measurably. In test harness or card extender roles, where the same connector may be cycled multiple times daily, the 346-040-556-807 typically remains functional for 6–12 months of typical lab use. To extend operational life, designers should minimize insertion force by ensuring card edge geometry matches specifications precisely, keep the card and connector contacts clean (lint-free), and consider periodic inspection of contact surfaces under magnification for erosion or debris. After 300+ cycles, contact resistance trending can help predict remaining useful life before replacement becomes necessary.
What signal integrity considerations apply when using the 346-040-556-807 for high-speed data signals, and are impedance-controlled designs required?
The 346-040-556-807 with 0.125" pitch and dual-row layout is not inherently designed for controlled-impedance transmission lines; contact geometry and spacing variations introduce impedance discontinuities typically in the 50–75Ω range depending on reference plane proximity. For low-speed signals (logic levels, control lines), the 346-040-556-807 performs adequately without special treatment. However, for high-speed differential pairs or bus signals above 50MHz, the impedance discontinuity at the 346-040-556-807 interface can cause reflections and signal degradation. Mitigation strategies include routing high-speed traces to specific position pairs on the 346-040-556-807 that offer better return-path geometry, implementing series termination resistors near the source, and placing ground vias densely around the 346-040-556-807 solder pads to minimize loop area. Above 100MHz, consider evaluating the 346-040-556-807's compliance with your specific timing budget using circuit simulation before production commitment.
How does the 346-040-556-807's RoHS3 and REACH compliance affect component sourcing and supply chain documentation requirements?
The 346-040-556-807 is marked RoHS3 compliant and REACH unaffected, meaning it complies with EU Directive 2011/65/EU (lead-free, cadmium-free) and contains no Substances of Very High Concern (SVHC) requiring Annex XIV authorization. This status simplifies documentation for products destined for European markets and reduces regulatory audit burden compared to RoHS2-era connectors. However, RoHS3 compliance on the 346-040-556-807 is primarily achieved through lead-free solder and copper alloy contact materials, not through elimination of all heavy metals—the gold plating still contains trace chromium or nickel underlayers per process standards. Designers working with the 346-040-556-807 should maintain certificate-of-compliance documentation from the manufacturer and verify batch-specific RoHS certifications if the component will undergo customer audits or export through restricted markets. The REACH "unaffected" status means the 346-040-556-807 does not trigger SVHC prenotification obligations, streamlining BOM compliance workflows.
What solder joint reliability concerns are associated with the 346-040-556-807's cantilever contact design under thermal cycling?
The 346-040-556-807 cantilever contacts connect via solder to the PCB edge, creating a mechanical joint that experiences stress from three sources: thermal cycling (ΔT from -40°C to 105°C), coefficient-of-thermal-expansion (CTE) mismatch between copper alloy (≈17 ppm/K), FR-4 PCB material (≈15 ppm/K), and solder (≈20 ppm/K), and mechanical shock or vibration loading during card insertion. Over 200+ thermal cycles, the 346-040-556-807 solder joints can develop microcracking at the fillet interface due to accumulated plastic strain. To improve durability, ensure the 346-040-556-807 solder pads are adequately sized (minimum 0.040" × 0.100") to distribute stress, apply solder mask dams between adjacent pads to prevent bridging, and use solder paste with appropriate viscosity for consistent fillet geometry. Board-level reliability testing (thermal shock or thermal cycling per IPC-9701) of representative prototypes using the 346-040-556-807 is recommended before committing to production volumes.
How does the 346-040-556-807's 40-position, dual-row configuration compare to single-row 40-pin alternatives for signal routing flexibility?
The 346-040-556-807 arranges 40 contacts as two parallel rows of 20, whereas single-row 40-pin connectors (common at 0.1" pitch) use a linear layout spanning 3.9 inches of PCB edge. The 346-040-556-807's dual arrangement compresses the physical edge requirement to approximately 2.5 inches, which simplifies PCB routing in compact enclosures and improves mechanical balance by distributing signal paths across two rows. However, this compression also increases signal crosstalk between adjacent contacts in different rows, which can degrade noise margins on adjacent low-speed control or analog signals. Single-row alternatives offer inherently lower crosstalk due to greater physical separation, but require more linear edge space and may unbalance mechanical loading. For mixed-signal or analog applications where crosstalk matters, the 346-040-556-807 designer should carefully partition high-speed and sensitive analog signals to different row pairs and include guard traces or ground planes adjacent to the 346-040-556-807 to control coupling.
What is the practical insertion force for the 346-040-556-807, and how does this affect operator ergonomics and risk of card misalignment?
The 346-040-556-807 insertion force is typically 25–40 pounds for a full-depth insertion across all 40 positions, depending on contact cleanliness and card edge surface finish. This force is relatively high compared to modern low-insertion-force connectors but is manageable for lab or field technicians with proper technique. The dual-row straddle-mount geometry of the 346-040-556-807 provides significant mechanical guidance, reducing misalignment risk during insertion compared to single-row designs. However, asymmetric insertion force (one row engaging before the other) can occur if the card edge is not perfectly parallel to the connector aperture—this mismatch can cause plastic deformation of the connector base or contact damage on the 346-040-556-807. Best practice is to use insertion guides or alignment jigs for repetitive insertions, particularly in production or field-swap scenarios. Operators should be trained to insert the card slowly and steadily; attempting forceful insertion of a partially misaligned 346-040-556-807 can strip contact cantilevers or damage the polyester thermoplastic base irreversibly.
Are there recommended cleanroom or handling precautions for the 346-040-556-807 contacts after packaging, and how do contamination risks affect first-use reliability?
The 346-040-556-807 is typically shipped in sealed static-protective packaging with desiccant packs to prevent moisture absorption by the polyester thermoplastic base and oxidation of exposed copper alloy contact surfaces. Upon opening, the 346-040-556-807 connector should be handled with clean, dry gloves to avoid fingerprint oils and salts that can film the gold contact surface and increase contact resistance. If the 346-040-556-807 is stored more than 2–3 months before use, visual inspection under magnification is advisable to check for dust accumulation or oxidation discoloration on the contact area. For critical applications, wiping the 346-040-556-807 contact edge with a lint-free, isopropyl-alcohol-moistened wipe immediately before card insertion removes residual contamination. The card edge itself should also be cleaned to ensure pristine contact geometry; burrs, oxide, or fingerprints on the PCB edge reduce contact force and reliability of the 346-040-556-807 engagement. Storage in dry conditions (< 30% RH) extends the usable shelf life of the 346-040-556-807 to 5+ years without significant degradation.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 346-040-556-807

Product Attribute 346-040-556-804 346-040-556-808 346-040-556-802 346-040-556-803
Part Number 346-040-556-804 346-040-556-808 346-040-556-802 346-040-556-803
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Mounting Type - Surface Mount Through Hole Surface Mount
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Finish Thickness - - - -
Termination Rows - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Card Type - - - -
Material - Insulation - - - -
Gender - - - -
Card Thickness - - - -
Contact Finish - - - -
Pitch - - - -
Color - - - -
Series - - - -
Number of Rows - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of Positions - - - -
Termination - - - -
Flange Feature - - - -
Read Out - - - -
Features - - - Simultaneous Sampling
Contact Type - - - -
Number of Positions/Bay/Row - - - -
Contact Material - - - -

346-040-556-807 Datasheet PDF

Download 346-040-556-807 pdf datasheets and EDAC Inc. documentation for 346-040-556-807 - EDAC Inc..

Datasheets
346,396 Series Ordering Guiide.pdf 346-040-556-807 Drawing.pdf
Environmental Information
EDAC REACH.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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346-040-556-807 Image

346-040-556-807

EDAC Inc.
98D-346-040-556-807

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