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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors346-040-556-808
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346-040-556-808 - EDAC Inc.

Manufacturer Part Number
346-040-556-808
Manufacturer
EDAC Inc.
Allelco Part Number
98D-346-040-556-808
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
34,384 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 40POS 0.125
Package
Box
Data sheet
346-040-556-808.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 34384
  • Unit Price: $13.446
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $13.446 $13.45
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

346-040-556-808 Tech Specifications
EDAC Inc. - 346-040-556-808 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 346-040-556-808

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 346
Read Out Dual
Pitch 0.125" (3.18mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions/Bay/Row 20
Number of Positions 40
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Top Mount Opening, Threaded Insert, 4-40
Features Card Extender
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 346-040

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the actual card thickness tolerance for the Mercury 346-040-556-808, and how does it affect PCB edge connector compatibility?
The 346-040-556-808 accommodates card thicknesses between 0.054" and 0.070" (1.37mm to 1.78mm), which corresponds to standard FR-4 PCB materials. The dual-row configuration of the 346-040-556-808 requires precise thickness control because undersized cards may not achieve full cantilever contact pressure, while oversized cards risk permanent deformation of the contact springs. When designing for the 346-040-556-808, verify your PCB fabrication tolerance stack-up early in layout—many design delays occur when board thickness drifts beyond ±0.005" without coordination with connector supplier specifications.
How does the 0.125" pitch of the 346-040-556-808 compare to modern fine-pitch connectors, and when should you consider alternatives?
The 346-040-556-808 uses 0.125" (3.18mm) pitch, which is legacy spacing typical of industrial and telecom backplane applications. Current high-density designs often employ 0.100" or finer pitch to reduce board footprint, but the 346-040-556-808 remains preferable in applications where signal integrity and mechanical robustness outweigh density constraints. The larger pitch of the 346-040-556-808 allows thicker copper traces on the PCB edge, supporting higher current distribution and reducing crosstalk between adjacent signal lines. Switching from the 346-040-556-808 to finer pitch connectors typically requires re-qualification of mechanical insertion forces and may introduce impedance discontinuities.
Why is the contact finish thickness specification of 10.0µin on the 346-040-556-808 relevant for mating cycle life?
The 346-040-556-808 specifies 10.0µin (0.25µm) gold plating over copper alloy contacts. This thickness is a practical minimum that balances corrosion resistance with cost; thinner plating (<5µin) on the 346-040-556-808 would permit copper substrate oxidation within 1–2 years in high-humidity storage, while substantially thicker plating increases material brittleness. The 10.0µin specification on the 346-040-556-808 assumes solderability windows of 6–12 months post-manufacture under standard climate conditions. In applications requiring extended shelf life (18+ months) or exposure to salt-fog environments, verify that your procurement contract includes receipt inspection and humidity-controlled storage protocols for the 346-040-556-808.
What design trade-offs exist between the dual-edge, dual-row configuration of the 346-040-556-808 and single-edge alternatives?
The 346-040-556-808 straddle-mount dual-edge design provides symmetrical signal and ground distribution across two rows, which reduces loop inductance in high-speed applications compared to single-row variants. However, the dual-row geometry of the 346-040-556-808 increases insertion force and requires tighter mechanical tolerances on the PCB edge slot. In backplane systems, the 346-040-556-808 dual configuration also simplifies thermal management by distributing current across more contact points, but adds complexity to fixture design for manufacturing test. Single-row alternatives typically consume less board space and require simpler pick-and-place tooling, but cannot match the current capacity and signal integrity performance of the 346-040-556-808 in high-throughput applications.
How should the operating temperature range of -40°C to 105°C for the 346-040-556-808 inform thermal design of the PCB edge region?
The 346-040-556-808 specifies -40°C to 105°C operation, which defines the thermal envelope for polyester thermoplastic insulation stability and copper alloy contact spring properties. At 105°C, the 346-040-556-808 insulation approaches its glass transition temperature, reducing mechanical stiffness and contact force retention by approximately 10–15%. In high-power backplane applications, the PCB edge near the 346-040-556-808 mounting zone typically generates localized heating; thermal modeling should account for solder joint conduction, contact resistance dissipation, and board-mounted power components. If PCB edge temperatures are predicted to exceed 85°C during normal operation, implement thermal barriers or mechanical standoffs on adjacent high-heat components to preserve long-term contact reliability of the 346-040-556-808.
What is the functional difference between the card extender and straddle-mount configurations on the 346-040-556-808?
The 346-040-556-808 features both card extender and straddle-mount mounting, meaning the connector body bridges the PCB edge (straddle) while also providing mechanical support for daughtercard insertion and withdrawal. The threaded insert with 4-40 hardware on the 346-040-556-808 allows positive mechanical clamping, preventing card displacement during vibration or impact. In military and aerospace backplanes, the straddle-mount with threaded hardware on the 346-040-556-808 is often specified to meet shock and vibration retention requirements per MIL-STD-810. Without this dual-mount architecture, the 346-040-556-808 would rely solely on cantilever contact spring friction, which can degrade after repeated insertion cycles or under thermal cycling stress.
How does the cantilever contact geometry of the 346-040-556-808 affect insertion force requirements and wear patterns?
The 346-040-556-808 uses cantilever contacts, which bend elastically as the card edge is inserted, creating spring-back force that maintains electrical contact. Initial insertion force for a fully loaded 346-040-556-808 (40 positions, dual row) typically ranges from 25–40 lbf, depending on card thickness variation and contact surface contamination. Over repeated mating cycles, the cantilever springs on the 346-040-556-808 progressively relax, increasing insertion force and reducing contact force by approximately 5–10% per 100 cycles. For applications exceeding 500 insertion cycles, consider implementing a maintenance schedule that includes contact cleaning and periodic force measurement; the 346-040-556-808 is generally rated for 1000+ cycles under ideal conditions but may fall below minimum contact force thresholds earlier if environmental contamination or thermal stress is present.
Why is RoHS3 compliance on the 346-040-556-808 relevant for supply chain and long-term availability?
The 346-040-556-808 is marked as RoHS3 compliant, confirming that lead, cadmium, and hexavalent chromium have been eliminated from solder, plating, and insulation materials. RoHS3 compliance on the 346-040-556-808 restricts material sourcing to qualified suppliers and affects long-term availability in legacy connector inventories; suppliers may phase out non-RoHS versions of the 346-040-556-808, potentially creating supply bottlenecks if redesign timelines are constrained. Additionally, the gold plating on the 346-040-556-808 (which supports RoHS3 and tin whisker prevention) is typically sourced from fewer qualified vendors, extending lead times during market surges. For long-lifecycle products, verify that your component procurement agreement for the 346-040-556-808 includes minimum availability commitments extending beyond the typical 10-year industrial product support window.
What solder joint reliability considerations apply to the 346-040-556-808 termination in flex-rigid PCB applications?
The 346-040-556-808 uses solder termination on a rigid PCB edge designed for straddle mounting, which concentrates mechanical stress at the solder-to-connector body interface. In flex-rigid designs where the 346-040-556-808 is positioned at the rigid-flex transition zone, thermal cycling can induce differential expansion that increases shear stress on solder joints. The cantilever spring design of the 346-040-556-808 also means that insertion forces transmit mechanical load directly through the termination area; under-designed solder fillets on the 346-040-556-808 are at elevated risk for fatigue crack initiation. Finite-element analysis of thermal and mechanical stress during design phase for the 346-040-556-808 is strongly recommended in aerospace and automotive applications. Post-assembly X-ray inspection of the 346-040-556-808 termination zone should verify void-free solder coverage across all 40 positions and both rows.
How should the green color designation on the 346-040-556-808 be interpreted in the context of connector coding and application context?
The 346-040-556-808 is specified with green insulation, which historically indicates general-purpose industrial or computer backplane applications (as opposed to red for high-temperature or blue for military variants). The green color of the 346-040-556-808 does not affect electrical performance but serves as a visual identifier for end-users and assembly technicians, reducing mis-mating with other connector families during manufacturing. In mixed-vendor backplane designs, the 346-040-556-808 green housing can be co-located with non-Mercury connectors, provided mechanical envelopes and contact spacing are verified for clearance. However, cosmetic color variations among batches of the 346-040-556-808 can occasionally occur; quality specifications should reference the base series number (346-040) rather than relying on color alone for component authentication.
What signal integrity considerations should be addressed when routing traces to the 346-040-556-808 PCB edge connector in high-speed applications?
The 346-040-556-808 dual-row, dual-edge geometry provides inherent advantages for controlled impedance routing because ground and signal traces can be interleaved on adjacent positions. With 0.125" pitch on the 346-040-556-808, typical microstrip impedance on standard FR-4 (1.6mm thickness) requires trace width of approximately 8–12 mils for 50Ω targets; the larger pitch of the 346-040-556-808 compared to modern fine-pitch connectors allows relaxed design rules that reduce routing congestion. However, the cantilever contact geometry of the 346-040-556-808 introduces capacitive loading at the connector interface; for signals exceeding 100 MHz, run time-domain reflectometry simulations of the 346-040-556-808 contact interface to identify potential ringing or impedance discontinuities. The dual-row straddle-mount of the 346-040-556-808 also allows implementation of interleaved ground returns adjacent to each signal trace, which is a best practice for managing return-path inductance in backplane systems.
How do environmental contaminants (salt spray, humidity, particulate) affect contact resistance over time for the 346-040-556-808?
The 346-040-556-808 features gold plating (10.0µin) over copper alloy, which provides excellent corrosion resistance in standard industrial environments but is vulnerable to localized attack under salt-fog or high-humidity conditions exceeding 85% RH with temperature cycling. The 346-040-556-808 contact surfaces can develop thin oxide films at the gold-copper interface within 12–18 months of exposure to marine or coastal atmospheres, increasing contact resistance by 5–20mΩ per contact pair. In applications requiring salt-fog durability (IEC 60068-2-52), consider conformal coating of the 346-040-556-808 assembly or sealed connector variants; standard bare 346-040-556-808 connectors should be stored in controlled-humidity environments (<60% RH) and tested periodically if deployed in harsh climates. Contact resistance measurement at incoming inspection for high-reliability applications of the 346-040-556-808 (baseline ~2–5mΩ per pair) provides early detection of manufacturing defects or storage exposure.
What are the mechanical insertion and extraction limits that define safe operational life for repeated card changes on the 346-040-556-808?
The 346-040-556-808 is typically rated for 500–1000 insertion cycles under controlled laboratory conditions, but practical field deployment often shows accelerated degradation due to contamination, misalignment, and insertion force variation. Each mating cycle on the 346-040-556-808 produces microscopic wear on the gold plating and indentation in the cantilever contact spring; cumulative wear reduces contact force and increases insertion force simultaneously, creating a progressive failure mode. By cycle 300 on the 346-040-556-808, contact force may have declined 10–15% and insertion force may have increased 20–30%. To extend field life of the 346-040-556-808 in high-change environments, implement contact cleaning procedures using non-abrasive methods (e.g., isopropyl alcohol with soft brushes) before every 50 insertion cycles, and consider scheduled connector replacement at 400 cycles as a preventive maintenance strategy to avoid catastrophic contact failures.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 346-040-556-808

Product Attribute 346-040-556-858 346-040-556-807 346-040-556-803 346-040-556-878
Part Number 346-040-556-858 346-040-556-807 346-040-556-803 346-040-556-878
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Color - - - -
Card Type - - - -
Number of Positions/Bay/Row - - - -
Contact Material - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Pitch - - - -
Card Thickness - - - -
Read Out - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Finish Thickness - - - -
Series - - - -
Gender - - - -
Number of Positions - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
Termination Rows - - - -
Contact Type - - - -
Number of Rows - - - -
Contact Finish - - - -
Material - Insulation - - - -
Flange Feature - - - -
Features - - - Simultaneous Sampling
Termination - - - -

346-040-556-808 Datasheet PDF

Download 346-040-556-808 pdf datasheets and EDAC Inc. documentation for 346-040-556-808 - EDAC Inc..

Datasheets
346,396 Series Ordering Guiide.pdf 346-040-556-808 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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346-040-556-808 Image

346-040-556-808

EDAC Inc.
98D-346-040-556-808

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