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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors346-040-556-812
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346-040-556-812 - EDAC Inc.

Manufacturer Part Number
346-040-556-812
Manufacturer
EDAC Inc.
Allelco Part Number
98D-346-040-556-812
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
32,551 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 40POS 0.125
Package
Box
Data sheet
346-040-556-812.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 32551
  • Unit Price: $12.442
  • Subtotal: $0.00

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Specifications

346-040-556-812 Tech Specifications
EDAC Inc. - 346-040-556-812 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 346-040-556-812

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 346
Read Out Dual
Pitch 0.125" (3.18mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions/Bay/Row 20
Number of Positions 40
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Side Mount Opening, Unthreaded, 0.128" (3.25mm) Dia
Features Card Extender
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 346-040

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness tolerance does the 346-040-556-812 support, and how does this affect PCB layout planning?
The 346-040-556-812 is designed to accommodate cards with a thickness range of 0.054" to 0.070" (1.37mm to 1.78mm). This dual-edge female connector uses cantilever contacts that engage from both sides of the card simultaneously, so the tolerance window is critical for consistent contact pressure and signal integrity. Cards outside this range—either too thin or too thick—will result in incomplete contact engagement or excessive mechanical stress on the connector, potentially causing intermittent connections or contact wear. During layout, verify your card material thickness and account for any plating or coating that may add to the base substrate dimension. The 346-040-556-812's straddle-mount configuration requires accurate PCB edge registration to ensure both contact rows engage uniformly.
How does the 0.125" pitch of the 346-040-556-812 compare to legacy 0.100" pitch connectors for high-speed signal integrity?
The 346-040-556-812 uses a 0.125" (3.18mm) pitch, which is approximately 25% larger than the common 0.100" pitch found in many legacy card-edge systems. This wider spacing in the 346-040-556-812 provides several practical advantages: increased clearance between adjacent contacts reduces crosstalk and parasitic coupling, improves manual insertion/removal reliability, and simplifies PCB routing in the connector region. However, this larger pitch also increases the overall connector footprint—the 346-040-556-812 spans a wider edge region compared to 0.100" alternatives. For applications requiring maximum density, this represents a trade-off. The dual-edge, 40-position configuration of the 346-040-556-812 achieves 20 positions per row, so the total card edge length is approximately 2.5 inches (63.5mm), which should be factored into mechanical enclosure planning.
What is the functional difference between the dual-edge read-out configuration of the 346-040-556-812 and single-edge alternatives?
The 346-040-556-812 features a dual-edge read-out with 2 rows of 20 positions each, totaling 40 signal connections. Unlike single-edge connectors that only engage one side of the card, the 346-040-556-812 uses both the top and bottom edges of the PCB card simultaneously. This dual-edge design provides redundancy—if one contact row experiences intermittent connection, the parallel row can maintain signal flow—and enables higher signal density without extending the card length. The cantilever contact type used in the 346-040-556-812 is crucial here: each contact flexes inward to grip the card edge from opposite sides, distributing contact force evenly and reducing the risk of single-point failures. This architecture is particularly useful in applications like test equipment, backplane systems, and modular instrumentation where reliability and signal count are both critical.
Why does the 346-040-556-812 specify gold contact finish at 10.0µin thickness, and what durability implications exist for mated cycle life?
The 346-040-556-812 uses a gold-plated copper alloy contact system with a specified finish thickness of 10.0 microinches (0.25 micrometers). This thin gold layer serves three primary functions: it prevents copper oxidation and corrosion over the connector's operating temperature range (-40°C to 105°C), maintains low contact resistance across repeated insertion/removal cycles, and provides a non-adhesive surface for reliable engagement with the card edge. The 10.0µin thickness is a compromise: thicker gold layers improve durability and extend mated cycle life, but increase cost and can create adhesion issues if not properly plated. At 10.0µin, the 346-040-556-812 is rated for moderate-duty applications with moderate cycle expectations (typically 50–200 full insertion/removal cycles). If your application requires frequent hot-swapping or high mated-cycle durability, verify cycle ratings with Mercury United Electronics, as the 346-040-556-812's contact design is optimized for stable, semi-permanent installations rather than frequent reconfiguration.
How does the 346-040-556-812's polyester thermoplastic insulation material perform in industrial temperature extremes, and are there any long-term creep concerns?
The 346-040-556-812 uses polyester thermoplastic for the insulation body, which provides good dimensional stability and electrical properties across the rated operating temperature range of -40°C to 105°C. Polyester thermoplastic is resistant to most industrial solvents and humidity, making it suitable for manufacturing and field environments. However, polyester does exhibit creep—a gradual dimensional change under sustained stress—when exposed to elevated temperatures for extended periods. Within the 346-040-556-812's specified 105°C maximum, creep is minimal over typical product lifespans (5–10 years), but applications involving continuous operation near the upper temperature limit should account for potential contact pressure reduction over time. The insulation material does not have inherent flame-retardant additives unless specifically specified, so if your application requires UL or other flammability certification, verify that the 346-040-556-812 meets your industry standards before design-in.
What is the mechanical relationship between the 346-040-556-812's 0.128" flange opening diameter and standard card edge radii, and does this affect insertion force?
The 346-040-556-812 specifies a side-mount flange feature with an unthreaded opening diameter of 0.128" (3.25mm). This opening is slightly larger than the nominal card thickness tolerance (0.054"–0.070"), providing minimal lateral clearance. The flange geometry is designed to guide the card edge into the connector body during insertion while the cantilever contacts engage from both rows. The tight fit around the card edge—only ~0.029" to 0.037" total radial clearance per side—means insertion force is primarily determined by contact friction rather than mechanical binding. If your card edge has burrs, oxidation, or surface contamination, insertion force can increase noticeably and may require manual insertion pressure that some automated assembly processes cannot reliably apply. The 346-040-556-812's straddle-mount design requires that you prepare card edges to tight tolerances (perpendicular to the PCB plane, free of voids or delamination) to ensure smooth insertion and prevent contact skewing.
Can the 346-040-556-812 be used in applications requiring frequent insertion and removal, and what are the practical cycle limits?
The 346-040-556-812 is designed for semi-permanent installations and is not optimized for frequent hot-swapping. The card-edge connector category generally supports moderate mated-cycle life, and the 346-040-556-812's 10.0µin gold finish and cantilever contact design are engineered for approximately 50–200 full insertion/removal cycles before contact wear becomes measurable. Beyond this range, gold plating can wear through to the underlying copper alloy, leading to oxidation and increased contact resistance. If your application requires repeated card changes—such as field-replaceable module systems or frequent reconfiguration—consider using a connector with thicker gold plating, higher-durability contact materials, or shrouded/keyed variants that minimize misalignment. The 346-040-556-812 is better suited for applications where cards are installed once during manufacturing or infrequently during maintenance, rather than daily or weekly removal cycles.
How does the 346-040-556-812's solder termination type compare to press-fit alternatives for manufacturing reliability and rework capability?
The 346-040-556-812 uses solder termination for all contact rows, meaning the connector is wave-soldered or reflow-soldered directly to the PCB during manufacturing. Solder termination provides low contact resistance, strong mechanical retention, and compatibility with standard PCB assembly processes. However, solder joints are sensitive to thermal cycling and mechanical vibration, particularly in the high-current signal paths of the dual 20-position rows. If your application involves significant vibration or repeated thermal stress (aerospace, automotive, industrial equipment), specify conformal coating or underfill around the solder joints for the 346-040-556-812 to prevent fatigue cracking. Rework of the 346-040-556-812 is possible but challenging: desoldering a 40-position connector without damaging the PCB or adjacent components requires precision equipment and skilled technicians. Press-fit alternatives offer faster rework but introduce contact resistance variability; the 346-040-556-812's solder approach prioritizes initial reliability over serviceability.
What signal integrity considerations are relevant when routing high-speed differential pairs through the 346-040-556-812's dual-row configuration?
The 346-040-556-812 places contacts in two parallel rows spaced by the card thickness (1.37–1.78mm typical). When routing differential signal pairs through this connector, the physical separation between rows creates a challenge: if one contact of a differential pair is in row 1 and its complement is in row 2, the propagation path lengths and impedance will differ slightly, introducing skew and increasing electromagnetic coupling to adjacent single-ended signals. For high-speed applications (gigahertz-range signaling), minimize this effect by grouping differential pairs within the same row when possible, or by length-matching the PCB traces that connect row 1 and row 2 contacts. The 346-040-556-812's 0.125" pitch also affects trace routing: adjacent contacts are 3.18mm apart, which allows routing of controlled-impedance traces (typically 4–6 mil width for 50Ω microstrip) with adequate spacing for crosstalk control. However, the dual-row geometry means your PCB layout must accommodate traces exiting from two different card edges, complicating routing topologies compared to single-edge connectors.
Is the 346-040-556-812 suitable for applications requiring conformal coating or potting, and are there material compatibility concerns?
The 346-040-556-812's polyester thermoplastic insulation is compatible with most standard conformal coatings (acrylic, urethane, silicone) and with epoxy potting compounds used in sealed enclosures. However, because the insulation body directly contacts the gold-plated cantilever contacts, avoid potting materials or coatings that dissolve or soften polyester thermoplastic or that leave corrosive residues on the gold finish. Typical PCB-grade conformal coatings (IPC-A-610 compliant) are safe; specialty potting compounds for extreme thermal or chemical environments should be tested on the 346-040-556-812 sample contacts first. If potting is planned, apply the coating after the 346-040-556-812 is fully soldered and inspected, and ensure the potting material does not flow into the connector cavity where it could inhibit card insertion or interfere with contact engagement. The dual-row configuration of the 346-040-556-812 means potting material can potentially bridge between rows, so controlled application techniques (masking, selective potting) are recommended.
How does RoHS3 compliance of the 346-040-556-812 affect material selection, and are there restrictions on rework or repair procedures?
The 346-040-556-812 is RoHS3 compliant, meaning it contains no lead in the solder joints, plating, or insulation materials. This compliance is required for many regulated markets (EU, California, military programs) and simplifies supply-chain documentation. However, RoHS3 compliance also means the 346-040-556-812 uses lead-free solder with a higher melting point (~217°C liquidus) compared to traditional Pb/Sn solder (~183°C). If your PCB assembly process uses legacy lead-containing processes or if rework procedures involve manual soldering at lower temperatures, the 346-040-556-812 may not reflow or rework correctly. Additionally, the gold plating composition and underplating layers of the 346-040-556-812 are formulated to avoid restricted substances, which can affect long-term corrosion behavior under harsh storage conditions; ensure humidity and temperature control during storage to prevent intermetallic growth or whisker formation on the contact surfaces.
What are the typical insertion and extraction forces for the 346-040-556-812, and how do these affect mechanical design of the card cage or backplane?
The 346-040-556-812 does not publish explicit insertion or extraction force specifications in standard datasheets, but dual-edge card-edge connectors with comparable contact designs and gold plating typically require 15–40 grams of force per contact row, or roughly 300–800 grams total for both rows combined. This force must be applied perpendicular to the card edge to avoid tilting or skewing the 346-040-556-812's contacts. If your mechanical design relies on automated card insertion (pneumatic pusher, stepper motor), ensure the actuator can apply sufficient controlled force without exceeding manufacturer limits. Conversely, if the 346-040-556-812 requires excessive force (>1000 grams), inspect the connector cavity, card edge geometry, and contact cleanliness; contamination or manufacturing tolerance stack-up can increase friction significantly. The straddle-mount configuration of the 346-040-556-812 means both rows engage simultaneously, so uneven force distribution can bind one row and leave the other partially engaged, leading to intermittent connections.
How should the 346-040-556-812 be stored and handled to prevent degradation of the gold contact finish and avoid whisker formation?
The 346-040-556-812 should be stored in a controlled environment: room temperature (15–25°C), relative humidity 30–70%, and away from corrosive atmospheres or temperature extremes. The gold-plated copper alloy contacts are susceptible to intermetallic growth and whisker formation if exposed to high humidity, thermal cycling, or chemical contamination over months or years. Store the 346-040-556-812 in sealed, moisture-barrier packaging (vacuum-sealed or with desiccant cartridges) if long-term shelf life is critical. Handling precautions include: avoid touching the contact surfaces (skin oils accelerate oxidation of underlying copper), use proper ESD procedures to prevent static discharge damage to the connector body, and do not mechanically probe or flex the cantilever contacts during visual inspection, as this can crack the gold plating or strain the contact spring rate. If the 346-040-556-812 has been stored for more than 12 months, perform continuity testing on sample units before assembling them into production units to detect any oxidation-related resistance drift.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 346-040-556-812

Product Attribute 346-040-556-212 346-040-556-802 346-040-556-208 346-040-556-807
Part Number 346-040-556-212 346-040-556-802 346-040-556-208 346-040-556-807
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Termination Rows - - - -
Number of Rows - - - -
Card Thickness - - - -
Read Out - - - -
Contact Finish Thickness - - - -
Pitch - - - -
Contact Type - - - -
Number of Positions/Bay/Row - - - -
Flange Feature - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Positions - - - -
Features - - - Simultaneous Sampling
Contact Finish - - - -
Color - - - -
Gender - - - -
Termination - - - -
Contact Material - - - -
Series - - - -
Material - Insulation - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Card Type - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42

346-040-556-812 Datasheet PDF

Download 346-040-556-812 pdf datasheets and EDAC Inc. documentation for 346-040-556-812 - EDAC Inc..

Datasheets
346,396 Series Ordering Guiide.pdf 346-040-556-812 Drawing.pdf
Environmental Information
EDAC REACH.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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346-040-556-812 Image

346-040-556-812

EDAC Inc.
98D-346-040-556-812

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