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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors346-040-556-858
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346-040-556-858 - EDAC Inc.

Manufacturer Part Number
346-040-556-858
Manufacturer
EDAC Inc.
Allelco Part Number
98D-346-040-556-858
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
34,083 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 40POS 0.125
Package
Box
Data sheet
346-040-556-858.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 34083
  • Unit Price: $13.433
  • Subtotal: $0.00

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Specifications

346-040-556-858 Tech Specifications
EDAC Inc. - 346-040-556-858 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 346-040-556-858

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 346
Read Out Dual
Pitch 0.125" (3.18mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions/Bay/Row 20
Number of Positions 40
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Top Mount Opening, Threaded Insert, 4-40
Features Card Extender, Card Guides
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 346-040

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the actual contact engagement depth and insertion force specification for the 346-040-556-858 card edge connector?
The 346-040-556-858 uses cantilever-type contacts with a dual-edge configuration that accommodates card thicknesses between 0.054" and 0.070" (1.37–1.78 mm). While specific insertion force values are not detailed in standard parametrics, the cantilever design of the 346-040-556-858 typically produces engagement forces in the range of 1.5–3.5 oz per contact, depending on contact spring rate and card material. The dual-edge, dual-row architecture of the 346-040-556-858 distributes contact pressure across 40 positions, reducing per-contact stress and improving repeatability across thermal cycles. Designers should verify insertion and withdrawal force acceptance with Mercury during design validation, particularly for automated card insertion scenarios.
How does the 0.125" pitch specification of the 346-040-556-858 compare to standard 0.156" pitch connectors in terms of crosstalk and signal integrity?
The 346-040-556-858 uses a 0.125" (3.18 mm) pitch, which is tighter than the industry-standard 0.156" (3.96 mm) pitch common in backplane applications. The reduced pitch of the 346-040-556-858 decreases trace routing distance and allows higher wiring density but increases parasitic capacitance between adjacent signal lines. For high-speed applications above 100 MHz, the 346-040-556-858's closer spacing may require differential pair routing discipline and controlled-impedance design to limit crosstalk to acceptable levels (typically below -30 dB). The gold plating on the 346-040-556-858 (10 µin thickness) helps maintain signal integrity by reducing contact resistance variation over connector mating cycles, but overall signal performance depends more on PCB layer stackup and trace management than connector pitch alone. Applications requiring SerDes or differential signaling should model the 346-040-556-858 in the target backplane simulation before design freeze.
Why does the 346-040-556-858 specify a card thickness range of 0.054–0.070", and what happens if a thinner or thicker card is inserted?
The 346-040-556-858 card thickness tolerance of 0.054–0.070" (1.37–1.78 mm) is mechanically defined by the cantilever contact design and the spacing between the dual rows of the connector. This range ensures that contacts on both rows of the 346-040-556-858 achieve consistent normal force and electrical contact resistance. Cards thinner than 0.054" will fail to engage the inner row of the 346-040-556-858 fully, resulting in high contact resistance or intermittent connections on half the contact positions. Cards thicker than 0.070" risk over-stroking the cantilever contacts of the 346-040-556-858, potentially causing permanent deformation, reduced contact pressure, or mechanical jam during insertion. Designers must control card thickness within specification during PCB design and fabrication to ensure all 40 positions on the 346-040-556-858 function reliably across the full operating temperature range of -40°C to 105°C.
What is the gold plating thickness on the 346-040-556-858, and does 10 µin (0.25 µm) provide sufficient wear protection for repeated insertion cycles?
The 346-040-556-858 has a gold contact finish of 10 µin (0.25 µm) thickness, which is a light flash or plating deposit intended to improve corrosion resistance and reduce contact resistance variability rather than provide bulk wear protection. At 10 µin, the gold on the 346-040-556-858 is typical for board-edge connectors in moderate-duty applications (up to 50–100 insertion cycles). The underlying copper alloy of the 346-040-556-858 will become exposed after extended mating cycles if contact wear exceeds plating thickness. For applications requiring more than 200 insertion cycles or critical reliability in humid environments, consider mechanical design that minimizes card extraction frequency or specify a connector with thicker gold plating. The polyester thermoplastic insulation of the 346-040-556-858 is compatible with standard PCB assembly processes and does not degrade the plating during soldering.
How does the dual-edge, dual-row configuration of the 346-040-556-858 affect termination soldering and rework capability?
The 346-040-556-858 is a dual-row solder-terminated connector with 20 positions per row, totaling 40 contact terminations. The two rows are spaced to straddle the card edge (straddle mount), which requires coordinated solder reflow on both sides of the PCB during assembly. This dual-sided termination of the 346-040-556-858 increases assembly complexity compared to single-row edge connectors and demands precise PCB registration during wave solder or reflow. Rework becomes difficult after initial assembly because desoldering and removing the 346-040-556-858 requires simultaneous heating of both termination rows to avoid residual stress or component damage. Designers should verify that the manufacturing process for the 346-040-556-858 includes proper solder mask design around all 40 termination points and validate thermal uniformity in the reflow profile to prevent solder bridges or cold joints. Hand rework of individual contacts on the 346-040-556-858 is generally not recommended; full connector replacement is the safer rework approach.
What mechanical and environmental advantages does the card extender and card guide feature on the 346-040-556-858 provide during system operation?
The 346-040-556-858 includes integrated card extender and card guide features that improve mechanical stability and repeatability during card insertion and extraction. The card guides on the 346-040-556-858 prevent lateral misalignment and ensure straight engagement along the connector axis, reducing the risk of contact skew or partial mating. The extender portion of the 346-040-556-858 provides physical clearance for manual card handling and reduces reaching distance into equipment bays, lowering the probability of accidental contact damage. These features are particularly valuable in backplane systems where cards are frequently swapped for maintenance or diagnostics. The threaded 4-40 insert on the top mount flange of the 346-040-556-858 allows for optional strain relief cable anchorage or interlock mechanisms to prevent unintended card removal. In combined thermal and vibration environments (typical in telecommunications or industrial equipment), the card guide structure of the 346-040-556-858 helps maintain contact normal force stability and reduces wear from fretting.
Is the 346-040-556-858 suitable for high-altitude or aerospace applications, and what certifications or approvals are required?
The 346-040-556-858 is RoHS3 compliant and REACH unaffected, indicating compliance with consumer and industrial environmental directives. The ECCN classification (EAR99) indicates the connector is not export-controlled. However, the 346-040-556-858 does not carry explicit aerospace or high-reliability qualifications (such as MIL-SPEC or DO-160G certification) in its standard specification. For high-altitude aerospace applications, the 346-040-556-858's performance is limited by the standard polyester thermoplastic insulation, which may outgas under low-pressure cabin conditions and could deposit films on nearby optical or RF components. The -40°C to 105°C operating temperature range of the 346-040-556-858 is acceptable for commercial avionics but is narrower than military-grade connectors. If aerospace certification is required, consult Mercury United Electronics or consider qualified alternatives with formal Design Assurance Level approval.
How does the non-specified dual-edge card type designation for the 346-040-556-858 affect compatibility with existing backplane standards?
The 346-040-556-858 is listed as 'Non Specified - Dual Edge' in the card type field, meaning it does not conform to a specific industry standard like VME, CompactPCI, or PICMG. This flexibility allows the 346-040-556-858 to be used in custom or proprietary backplane designs with independent electrical and mechanical specifications. However, the non-standard classification of the 346-040-556-858 means that PCB and card designs must be engineered independently without relying on published standard dimensions or contact assignments. The 0.125" pitch and dual 20-position configuration of the 346-040-556-858 may not directly interoperate with existing off-the-shelf backplane modules designed for 0.156" or 0.100" pitch connectors. Designers implementing the 346-040-556-858 must fully specify card profile, contact loading, and mechanical tolerances in design documentation and maintain detailed compatibility matrices. Migration from or to alternative edge connectors will require full re-certification and test.
What is the maximum current capacity per contact on the 346-040-556-858, and how does it affect power distribution backplane design?
Standard parametrics for the 346-040-556-858 do not explicitly list maximum current per contact, but typical cantilever-style board-edge connectors with copper alloy bases and 10 µin gold plating carry approximately 2–5 A per contact at full operating temperature (105°C), depending on contact resistance, insulation resistance to adjacent traces, and allowable voltage drop. The dual-row configuration of the 346-040-556-858 provides 40 total positions, which could theoretically support 80–200 A total current if all positions are used for power distribution. However, practical power delivery designs using the 346-040-556-858 typically reserve multiple dedicated positions per voltage rail to distribute current and reduce voltage drop across the connector. Thermal design of the 346-040-556-858 must account for resistive heating at contact interfaces, particularly in high-frequency switching environments where skin effect concentrates current near the contact surface. Validate current capacity for the 346-040-556-858 through steady-state thermal modeling or direct testing under actual application load.
How do the operating temperature limits of -40°C to 105°C for the 346-040-556-858 affect contact resistance stability and system reliability over time?
The 346-040-556-858 is rated for -40°C to 105°C, which covers most industrial and commercial equipment environments but excludes high-temperature applications (automotive under-hood, industrial furnace control). Contact resistance on the 346-040-556-858 increases with temperature due to reduced spring force in the cantilever contacts and higher intrinsic resistance of the copper alloy base material. Across the full temperature range of the 346-040-556-858, contact resistance may vary by 50–100% between -40°C and 105°C, particularly if the contact interface contains any corrosion or surface contamination. The polyester thermoplastic insulation of the 346-040-556-858 has lower thermal stability than glass-filled materials; extended operation near the 105°C limit may cause minor dimensional creep or reduced dielectric strength over years of service. For applications requiring sub-millivolt signal measurement or precision analog circuitry, the temperature coefficient of the 346-040-556-858 contacts must be characterized during design validation. Thermal cycling of the 346-040-556-858 from -40°C to 105°C can induce mechanical stress at the solder joints; reliability testing should include thermal shock or thermal cycling profiles relevant to the end application.
What are the dimensional and mechanical differences between the 346-040-556-858 and other variants in the Mercury 346 series, and how do they affect board layout?
The 346-040-556-858 is part of the Mercury 346 series base product family (346-040 core designation). Variants within the 346 series typically differ in the number of positions, pitch, or termination style. The specific 346-040-556-858 designation indicates a 40-position dual-edge configuration at 0.125" pitch with female gender and gold-plated solder termination. Layout of the 346-040-556-858 requires PCB space for both the connector footprint (approximately 5.0" × 0.50" for the dual 20-position rows) and the routing channels for the 40 signal nets. The straddle-mount feature of the 346-040-556-858 means the connector occupies edge space on both sides of the PCB, which can constrain via placement and layer transitions. Designers should review Mercury's engineering drawings for the exact 346-040-556-858 footprint, including flange overhang, before finalizing PCB layout. Using incorrect 346-series variant part numbers will result in assembly errors; verify the 346-040-556-858 part number with procurement before board fabrication.
How does the copper alloy contact material on the 346-040-556-858 compare to beryllium copper alternatives in terms of spring rate, cost, and toxicity?
The 346-040-556-858 uses copper alloy (typically brass or phosphor bronze) for the cantilever contacts, which provides moderate spring rate (suitable for the 0.054–0.070" card thickness range) and excellent cost efficiency compared to beryllium copper. Beryllium copper offers higher spring rate, allowing thinner contacts and more compact designs, but requires specialized manufacturing, higher material cost, and strict occupational health controls during machining due to beryllium toxicity. The copper alloy contacts on the 346-040-556-858 are fully RoHS3 and REACH compliant with no toxicity restrictions during manufacturing or use. The lower spring rate of copper alloy on the 346-040-556-858 means that contact pressure is more sensitive to card thickness variation and temperature cycling, so tight tolerances are essential. For applications where contact repeatability over 500+ cycles is required, beryllium copper may offer better long-term performance, but the 346-040-556-858's copper alloy is adequate for typical 50–200 cycle duty in stationary equipment.
What is the relationship between the 346-040-556-858 connector specification and the HTSUS tariff code 8536.69.4040, and does it affect supply chain or pricing?
The HTSUS code 8536.69.4040 assigned to the 346-040-556-858 classifies it as 'Electrical connectors, not elsewhere specified or included,' which carries standard import duties and trade compliance requirements. The 346-040-556-858 is subject to normal customs examination and does not qualify for any special tariff exemptions or reduced-duty classifications. Supply chain and pricing for the 346-040-556-858 may be affected by changes in trade policy, tariffs on electronics components from manufacturing origins, or restrictions on suppliers. Designers should verify the manufacturing origin of the 346-040-556-858 with Mercury or distributors if tariff-sensitive sourcing is required for cost or compliance. The EAR99 ECCN classification of the 346-040-556-858 means it is generally available for export without special license, but end-use and end-destination restrictions may apply in certain geopolitical situations. Procurement teams should monitor HTSUS and EAR classification stability for the 346-040-556-858 during the design and production phases.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 346-040-556-858

Product Attribute 346-040-556-808 346-040-556-878 346-040-556-258 346-040-556-807
Part Number 346-040-556-808 346-040-556-878 346-040-556-258 346-040-556-807
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Color - - - -
Number of Positions - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Positions/Bay/Row - - - -
Contact Finish - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Card Type - - - -
Features - - - Simultaneous Sampling
Number of Rows - - - -
Termination - - - -
Contact Finish Thickness - - - -
Pitch - - - -
Read Out - - - -
Flange Feature - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Gender - - - -
Material - Insulation - - - -
Card Thickness - - - -
Contact Material - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Type - - - -
Termination Rows - - - -
Series - - - -

346-040-556-858 Datasheet PDF

Download 346-040-556-858 pdf datasheets and EDAC Inc. documentation for 346-040-556-858 - EDAC Inc..

Datasheets
346,396 Series Ordering Guiide.pdf 346-040-556-858 Drawing.pdf
Environmental Information
EDAC REACH.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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346-040-556-858 Image

346-040-556-858

EDAC Inc.
98D-346-040-556-858

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