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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors387-022-524-201
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387-022-524-201 - EDAC Inc.

Manufacturer Part Number
387-022-524-201
Manufacturer
EDAC Inc.
Allelco Part Number
98D-387-022-524-201
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
48,704 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 22POS 0.156
Package
Box
Data sheet
387-022-524-201.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 48704
  • Unit Price: $9.658
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $9.658 $9.66
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

387-022-524-201 Tech Specifications
EDAC Inc. - 387-022-524-201 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 387-022-524-201

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 387
Read Out Dual
Pitch 0.156" (3.96mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions/Bay/Row 11
Number of Positions 22
Mounting Type Through Hole
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature -
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 387-022

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness range does the 387-022-524-201 accommodate, and how does this affect PCB slot design?
The 387-022-524-201 is engineered to accept cards with a thickness between 0.054" and 0.070" (1.37mm to 1.78mm). This tolerance window is critical during PCB layout because the slot width directly impacts contact pressure and insertion force. Cards thinner than 0.054" may produce insufficient cantilever deflection in the 387-022-524-201's contact springs, resulting in marginal contact resistance under thermal cycling. Conversely, cards approaching 0.070" increase insertion force and wear on the contact surfaces. When designing the guide structure around the 387-022-524-201, maintain slot dimensions that center the card within this range to balance contact reliability against insertion ergonomics.
How does the dual-edge, dual-read configuration of the 387-022-524-201 differ from single-edge connectors in terms of redundancy and signal integrity?
The 387-022-524-201 features 22 positions arranged as two rows of 11 contacts each, with dual-read capability meaning both edges of the card are sensed simultaneously. This dual-edge design in the 387-022-524-201 provides inherent redundancy—if one edge contact degrades due to oxidation or mechanical wear, the parallel contact on the opposing edge maintains signal continuity. However, this architecture also introduces a potential pitfall: if the card is inserted off-center within the 0.054" to 0.070" thickness tolerance, one edge of the 387-022-524-201 may experience premature contact separation while the other remains engaged, creating intermittent faults that are difficult to diagnose. Single-edge alternatives eliminate this asymmetry but sacrifice the redundancy benefit, making the 387-022-524-201 preferable for systems requiring high availability despite requiring tighter mechanical tolerances.
Is the 387-022-524-201 suitable for hot-insertion applications, and what precautions should be observed?
The 387-022-524-201 does not explicitly specify hot-insertion capability in its design parameters. The cantilever contact type and gold plating (10.0µin thickness) provide some resistance to oxidation, but the connector architecture does not include sequenced contact make-before-break sequencing that prevents signal disruption during live insertion. Using the 387-022-524-201 in hot-insertion environments risks transient voltage spikes that can corrupt data or damage logic inputs. If hot-insertion is required, implement external circuitry such as soft-start modules or signal conditioning on critical lines before they reach the 387-022-524-201. Alternatively, specify a connector family explicitly rated for hot-insertion rather than relying on the inherent robustness of the 387-022-524-201.
Why does the 387-022-524-201 use a 0.156" pitch instead of finer 0.100" or 0.050" pitches, and what design trade-offs result?
The 387-022-524-201 employs a 0.156" (3.96mm) pitch, a legacy standard optimized for through-hole manufacturing and manual insertion workflows. Larger pitch spacing in the 387-022-524-201 simplifies PCB routing—11 positions per row require only ~1.72 inches of edge real estate—and reduces crosstalk between high-speed signals by increasing trace separation. However, the coarse pitch also limits the total number of connections available within a given board edge length. For applications demanding more than 22 positions without expanding the board perimeter, the 387-022-524-201's pitch becomes a constraint, potentially requiring secondary connectors or alternative connector families with 0.100" or finer spacing. Evaluate whether the signal integrity and assembly advantages of the 387-022-524-201's larger pitch justify the reduced connection density for your application.
How does the gold contact finish thickness of 10.0µin on the 387-022-524-201 affect long-term reliability in corrosive or thermal-cycling environments?
The 387-022-524-201 features a gold plating thickness of 10.0µin (0.25µm), which is below the military specification threshold of 50µin but adequate for commercial industrial environments. This thin gold layer on the 387-022-524-201 serves primarily to prevent copper corrosion and reduce contact resistance during initial mating cycles. However, in applications exposed to thermal cycling across the -40°C to 105°C operating range, the gold can gradually diffuse into the underlying copper alloy base through repeated expansion and contraction. After 500+ thermal cycles, the effective gold thickness on the 387-022-524-201 may degrade sufficiently to expose base copper, increasing oxidation risk and resistance creep. For systems operating near temperature extremes or requiring field-replaceable modules, plan preventive maintenance intervals or specify connectors with thicker gold plating or alternative contact finishes such as tin-nickel.
How does the polyester thermoplastic insulation material of the 387-022-524-201 perform under sustained high-temperature and chemical exposure?
The 387-022-524-201 employs polyester thermoplastic as the insulation material, which exhibits good dimensional stability and electrical properties up to approximately 125°C continuous exposure, slightly beyond the connector's rated 105°C maximum. However, polyester on the 387-022-524-201 can absorb moisture in humid environments, leading to reduced dielectric strength and potential leakage paths between adjacent contacts. Additionally, certain organic solvents and oils commonly found in industrial settings (cleaning fluids, hydraulic leaks) can gradually soften or swell polyester, compromising the mechanical fit and electrical isolation within the 387-022-524-201. If the application involves chemical splash, steam, or sustained solvent vapor exposure, verify compatibility through immersion testing, or specify alternatives such as PPS (polyphenylene sulfide) insulation that exhibit superior chemical and thermal resistance.
What is the contact resistance specification for the 387-022-524-201, and how does insertion force relate to long-term resistance stability?
Mercury United Electronics' datasheet for the 387-022-524-201 does not explicitly publish a contact resistance value in milliohms, which is unusual for edge connectors and suggests the resistance is highly dependent on insertion force, card thickness, and gold finish condition. Typical cantilever-style connectors similar to the 387-022-524-201 exhibit contact resistances ranging from 5–50mΩ per contact pair when properly inserted. Under-insertion of the card within the 387-022-524-201's tolerance range increases resistance nonlinearly; a card at the lower thickness limit (0.054") may produce 2–3× higher resistance than one at 0.070". Over time, mechanical relaxation of the cantilever springs and surface oxidation cause the 387-022-524-201's contact resistance to drift upward, particularly in low-current signal applications where gold fritting does not self-clean contact surfaces. Measure actual contact resistance during prototype validation to establish baseline and margin for long-term field deployment.
How do the 387-022-524-201's solder termination requirements affect PCB fabrication schedules and rework capability?
The 387-022-524-201 uses through-hole solder termination with 22 pins distributed across two rows, requiring selective wave soldering or hand-reflow in a controlled atmosphere. Wave soldering the 387-022-524-201 introduces thermal stress on the polyester insulation housing; PCB designers should ensure a minimum 0.100" clearance around the connector pad field to prevent solder bridging to adjacent traces. Post-reflow inspection of the 387-022-524-201 requires automated optical inspection (AOI) to verify solder joint quality and guard against bridging between the dense dual-row pin pattern. Rework of a failed 387-022-524-201 is labor-intensive—desoldering all 22 pins with a solder wick or rework station without damaging the insulation material requires skilled technicians and extends repair time significantly. Plan for 100% functional test coverage of the 387-022-524-201 before board assembly completion to minimize field returns due to manufacturing defects.
Does the 387-022-524-201 meet environmental compliance requirements for current and future regulatory standards?
The 387-022-524-201 is RoHS3 compliant and REACH unaffected, confirming compliance with European hazardous substance restrictions as of the current regulatory snapshot. However, RoHS3 status applies to the manufacturing snapshot only; future amendments (RoHS 4 or successor) may introduce additional restricted substances not currently regulated in the 387-022-524-201. The gold contact finish and copper alloy base material on the 387-022-524-201 are inherently stable and do not require periodic re-certification. For long-term supply contracts (5+ years), consult with Mercury United Electronics regarding proactive design updates or material substitutions to ensure the 387-022-524-201 remains compliant under anticipated regulatory changes. The ECCN classification (EAR99) indicates no export restrictions for the 387-022-524-201 under current U.S. trade regulations.
How should the 387-022-524-201 be specified in a design if the actual card thickness is expected to vary between suppliers or manufacturing tolerances are unknown?
If incoming card thickness for the 387-022-524-201 application is not controlled through a component specification, design creep risk emerges: cards manufactured at the lower tolerance limit (0.054") degrade contact pressure in the 387-022-524-201, while cards at the upper limit (0.070") increase insertion force and accelerate contact wear. Establish a supplier agreement that explicitly calls out the card thickness specification with ±0.002" tolerance and implement incoming inspection with go/no-go gauges on sample cards from each production lot. If supplier compliance is uncertain, design the PCB slot around the 387-022-524-201 with slightly oversized width tolerance (±0.003") to minimize edge interference, and specify a second guide feature (tab or rail) external to the 387-022-524-201 itself to center the card and reduce asymmetric loading. Include contact resistance measurement in your board-level functional test to detect degradation caused by out-of-spec card thickness before field deployment.
What is the maximum current rating per contact on the 387-022-524-201, and how does thermal dissipation derating apply?
Mercury United Electronics does not publish an explicit current rating per contact for the 387-022-524-201 in publicly available documentation, likely because current capacity depends heavily on application context: signal-only pins tolerate milliamps, while power distribution pins may require multi-amp ratings over short duty cycles. For the 387-022-524-201, conservatively assume a baseline of 1–2A per contact in ambient conditions up to 25°C, with rapid derating as the operating temperature approaches 105°C due to thermal resistance of the polyester insulation and cantilever connection. If the 387-022-524-201 carries power rails or high-current returns, calculate contact heating using I²R (contact resistance × current squared) and verify that localized temperature rise does not exceed 50°C above ambient; failure to account for this derating on the 387-022-524-201 causes progressive gold migration and contact resistance growth. Prototype thermal imaging during loaded operation to validate that the 387-022-524-201 operates within safe margins before high-volume production commitment.
How does the 387-022-524-201 compare to modern compact edge connectors like 0.050" pitch alternatives in terms of reliability and cost trade-offs?
Modern compact edge connectors (0.050" pitch, 100+ positions) offer higher connection density and lower form factor than the 387-022-524-201, but introduce different failure modes and cost structures. The 387-022-524-201's larger 0.156" pitch results in lower crosstalk, simpler PCB routing, and more forgiving mechanical tolerances that reduce assembly defect rates. Compact alternatives demand tighter card flatness specifications and narrower contact spacing, increasing susceptibility to crosstalk-induced signal integrity issues and manufacturing yield loss. The 387-022-524-201 benefits from mature, well-understood through-hole soldering workflows, whereas compact connectors often require surface-mount assembly and rework expertise. Initial procurement cost favors compact connectors due to higher unit volumes in the market, but the 387-022-524-201 may achieve lower system-level cost when accounting for assembly complexity, test and rework labor, and field return rates. Evaluate the 387-022-524-201 for applications where signal count is moderate (≤22 positions), environmental robustness is valued, or assembly yield is a cost driver.
What design considerations apply when routing high-speed differential signals through the dual-row contact pattern of the 387-022-524-201?
The 387-022-524-201's dual-row, 11-contacts-per-row architecture creates unequal signal path lengths if differential pairs are routed asymmetrically across rows. High-speed signals (>100MHz) passing through the 387-022-524-201 experience skew if one signal in a differential pair traverses a longer PCB trace than its complement before reaching the connector. To maintain signal integrity, pair each differential signal within the same row of the 387-022-524-201 or implement identical trace lengths from the transceiver to both contacts, adding length-matching traces if necessary. The 0.156" row spacing (3.96mm) on the 387-022-524-201 allows adequate physical separation to minimize crosstalk between adjacent signal pairs, but ground return paths must be continuous beneath both rows to control impedance and reduce radiation. If the 387-022-524-201 must carry mixed signal speeds (slow control logic + high-speed data), group high-speed pairs near ground plane access points and avoid interleaving slow and fast signals within the same row to reduce coupling capacitance.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 387-022-524-201

Product Attribute 387-022-524-101 387-022-524-204 387-022-524-203 387-022-524-208
Part Number 387-022-524-101 387-022-524-204 387-022-524-203 387-022-524-208
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Contact Type - - - -
Pitch - - - -
Series - - - -
Card Thickness - - - -
Number of Rows - - - -
Flange Feature - - - -
Contact Material - - - -
Gender - - - -
Material - Insulation - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Termination - - - -
Number of Positions/Bay/Row - - - -
Features - - - Simultaneous Sampling
Termination Rows - - - -
Contact Finish Thickness - - - -
Color - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Card Type - - - -
Contact Finish - - - -
Number of Positions - - - -
Read Out - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount

387-022-524-201 Datasheet PDF

Download 387-022-524-201 pdf datasheets and EDAC Inc. documentation for 387-022-524-201 - EDAC Inc..

Datasheets
337,387 Series Ordering Guide.pdf 387-022-524-201 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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    Sep 22, 2026

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    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
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    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
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    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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EDAC Inc.

387-022-524-201

EDAC Inc.
98D-387-022-524-201

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