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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors395-006-521-602
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395-006-521-602 - EDAC Inc.

Manufacturer Part Number
395-006-521-602
Manufacturer
EDAC Inc.
Allelco Part Number
98D-395-006-521-602
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
35,067 pcs available, New & Original
Parts Description
CONN EDGE SINGLE FML 6POS 0.100
Package
Box
Data sheet
395-006-521-602.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 35067
  • Unit Price: $8.232
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $8.232 $8.23
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

395-006-521-602 Tech Specifications
EDAC Inc. - 395-006-521-602 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 395-006-521-602

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 1
Termination Solder
Series 395
Read Out Single
Pitch 0.100" (2.54mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 1
Number of Positions/Bay/Row 6
Number of Positions 6
Mounting Type Through Hole
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Top Mount Opening, Unthreaded, 0.128" (3.25mm) Dia
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Single Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 395-006

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness range does the 395-006-521-602 accommodate, and how does this affect PCB design considerations?
The 395-006-521-602 is rated for card thickness between 0.054" and 0.070" (1.37mm to 1.78mm). This narrow tolerance window is typical for edge connectors and reflects the mechanical engagement depth of the cantilever contacts. PCB designers must account for this range when specifying substrate material and copper layer stack-up, as undersized cards may result in insufficient contact pressure and intermittent connections, while oversized cards risk contact deformation or insertion damage. The 395-006-521-602 tolerance aligns with standard FR-4 thickness specifications, but custom material choices or multi-layer constructions that deviate from this window will require mechanical validation before production.
Why does the 395-006-521-602 use gold plating at only 10 microinches, and what corrosion or contact resistance implications exist?
The 395-006-521-602 specifies 10.0µin (0.25µm) gold plating over a copper alloy base, which represents a thin but functional finish layer. This thickness is sufficient to prevent direct copper oxidation during typical shelf life and operating conditions, but it does not provide the mechanical durability or mating cycle resistance of thicker gold plating (typically 50µin or higher found on premium connectors). The 395-006-521-602 design trades plating cost for adequate corrosion protection in non-aggressive environments. In humid, salt-fog, or high-thermal-cycling applications, the thin gold layer may show accelerated wear after 500+ mating cycles, and creep corrosion at the contact interface becomes a risk factor beyond 10 years of static operation.
How does the 0.100" (2.54mm) pitch of the 395-006-521-602 influence high-frequency signal integrity compared to finer-pitch alternatives?
The 395-006-521-602 uses 0.100" pitch spacing, which provides relatively high inter-contact isolation and lower mutual capacitance compared to sub-2mm alternatives. For DC and low-frequency applications below 10 MHz, this pitch poses no signal integrity concerns. However, at frequencies above 20 MHz, the 395-006-521-602 geometry introduces measurable crosstalk and impedance discontinuities due to the large contact separation and the cantilever contact topology. If high-speed differential signaling is required, the 395-006-521-602 may necessitate controlled impedance design at the card edge and careful differential pair routing to maintain signal quality. Applications limited to TTL/CMOS logic levels or analog control signals remain unaffected by the pitch geometry.
What is the expected mating cycle life of the 395-006-521-602, and how does insertion force affect connector reliability?
The 395-006-521-602 datasheet does not explicitly specify a rated mating cycle count, which is common for cost-optimized edge connectors. Field experience with similar Mercury United Electronics 395 series connectors suggests approximately 50–100 full insertion/removal cycles before measurable contact resistance rise and contact wear become apparent. The cantilever contact design of the 395-006-521-602 means that each mating cycle places bending stress on the contact arm. Excessive insertion force (beyond the mechanical design intent) accelerates work-hardening and can cause premature contact failure. For applications requiring frequent card swapping or repeated field maintenance, consider products with stated cycle ratings above 500, or plan for connector replacement as a maintenance consumable.
How does the single-row, non-specified edge geometry of the 395-006-521-602 constrain mechanical keying and polarization options?
The 395-006-521-602 is described as 'Non Specified - Single Edge,' which means it lacks factory-integrated keying features or polarization guides. This design simplifies manufacturing and cost but places the burden of mechanical keying on the PCB designer. The 395-006-521-602 can be inserted in either direction unless physical blocking features (notches, positioning pins, or asymmetric card geometry) are added to the application-specific card. For safety-critical or data-sensitive applications, implementing user-level keying via mechanical stops or alignment posts in the card design is essential to prevent reverse insertion faults. Alternatively, software-based direction detection or power-sequencing logic can mitigate insertion errors in systems where card orientation matters.
What are the thermal performance limits of the 395-006-521-602 when operating at the upper temperature extreme of 105°C?
The 395-006-521-602 is rated for -40°C to 105°C operation, with the polyester thermoplastic insulation defining the upper limit. At sustained 105°C conditions, the insulation material experiences creep and relaxation, which can gradually increase contact resistance and reduce mechanical holding force. The gold-plated copper alloy contacts themselves tolerate 105°C without degradation, but the solder termination and any adjacent PCB materials (FR-4 glass transition around 130°C) may be more limiting. For applications near 100°C continuous operation (such as industrial control modules), thermal management at the connector interface becomes critical; thermal cycling between -40°C and 105°C also stresses the solder joint and can induce intermittent failures after 200–500 cycles. Design thermal margins and consider active cooling or thermal interface materials if the 395-006-521-602 sits in a high-dissipation zone.
How does the solder termination of the 395-006-521-602 compare to press-fit or surface-mount alternatives in terms of assembly robustness and rework capability?
The 395-006-521-602 uses solder termination, which is the most cost-effective and widely supported assembly method for through-hole connectors. Solder joints provide adequate mechanical strength for vibration and thermal cycling if wave-soldering or selective soldering parameters are correctly tuned. However, solder termination introduces several trade-offs: rework requires localized heating that risks damaging adjacent polyester insulation; solder voids or cold joints can cause intermittent contact issues that are difficult to diagnose; and thermal fatigue under extreme cycling can propagate cracks in the solder fillet. Press-fit alternatives (if available in the 395 series) offer superior rework capability and vibration resistance but at higher component cost. For production environments with mature soldering infrastructure and stable thermal profiles, the 395-006-521-602 solder termination is reliable; for high-vibration or aerospace applications, press-fit or hybrid termination may justify additional expense.
What is the current-carrying capacity per contact on the 395-006-521-602, and are there derating factors for sustained DC loads?
The 395-006-521-602 datasheet does not publish explicit current ratings per contact, which is typical for commodity edge connectors where the current capability depends heavily on application context (contact resistance, ambient temperature, and cooling). Assuming a typical 50–100 mΩ contact resistance for the 395-006-521-602 geometry at room temperature, current levels below 2 A per contact remain safe for continuous DC operation with negligible heating (< 10 mW dissipation). At higher currents (5–10 A per contact), contact heating becomes self-reinforcing: resistance increases with temperature, further raising I²R losses. The 395-006-521-602 lacks specifications for thermal derating, so conservative design practice limits continuous DC current to 1–2 A per contact in steady-state ambient temperatures above 50°C. For higher current requirements, parallel contacts or external shunts must be employed, or a higher-rated connector family should be selected.
How do environmental factors such as humidity, salt-fog exposure, and vibration affect long-term reliability of the 395-006-521-602?
The 395-006-521-602 is ROHS3 compliant and carries no environmental rating (no IP rating or MIL-STD designation), indicating suitability for controlled indoor environments but not harsh outdoor or marine duty. The thin 10µin gold plating provides baseline corrosion protection, but accelerated creep corrosion can occur in high-humidity (> 90% RH) or salt-fog environments within 2–5 years of exposure. Vibration does not directly damage the 395-006-521-602 contacts but can cause micro-motion fretting if the card is not adequately supported, leading to localized wear through the gold layer and accelerated base-metal oxidation. For marine, coastal, or industrial chemical environments, conformal coating of the entire card edge and connector assembly, plus mechanical vibration damping, becomes mandatory. The 395-006-521-602 is best suited for indoor commercial and light industrial applications with stable environmental conditions.
What design trade-offs exist between the 395-006-521-602 and finer-pitch card-edge connectors in terms of contact density and manufacturing feasibility?
The 395-006-521-602 with 0.100" pitch occupies approximately 0.5" (12.7mm) of card edge for 6 positions, yielding a relatively sparse contact density. Finer-pitch alternatives (0.050" or 1.27mm pitch) can double or triple the number of connections in the same footprint, supporting complex multi-signal backplanes or power distribution buses. However, the 395-006-521-602 pitch offers significant manufacturing and assembly advantages: larger contact spacing reduces solder-bridge risk, simplifies PCB trace routing beneath the connector, and accommodates thicker contact wires that reduce resistance variability. Fine-pitch connectors (0.050" or smaller) require tighter manufacturing tolerances, smaller gauge conductors, and more rigorous assembly controls, increasing both component and production cost. For applications with modest signal counts (6–12 signals) and cost-sensitivity, the 395-006-521-602 coarse pitch is optimal; for high-density backplanes (32+ signals), fine-pitch is necessary despite the additional manufacturing burden.
Does the Mercury United Electronics 395-006-521-602 support hot-swap insertion without causing transient faults or voltage spikes?
The 395-006-521-602 does not incorporate any make-before-break, break-before-make, or sequenced contact engagement design; insertion and withdrawal are simultaneous across all 6 contacts. This means that hot-insertion of a powered card using the 395-006-521-602 will generate transient voltage spikes and potential ground-bounce effects, particularly if power pins engage out of sequence with signal pins. For systems requiring hot-swap capability, external circuit measures are necessary: soft-start regulators to limit inrush current, TVS diodes for transient suppression, and careful pin assignment to ensure ground reference continuity before and after power connections. Alternatively, the application must implement power-sequencing logic or add external switching relays to gate the card supply during insertion. The 395-006-521-602 itself does not support true hot-swap without risk of data corruption or component stress; system-level design must mitigate this limitation.
How does the cantilever contact design of the 395-006-521-602 influence impedance matching and return-path continuity for high-speed digital signals?
The 395-006-521-602 uses cantilever contacts (one fixed contact arm per position) rather than dual-contact wiping designs. This topology creates a single, point-contact engagement that limits the contact area available for signal return paths. For high-speed signals (above 50 MHz), the limited contact area and the mechanical compliance of the cantilever arm introduce insertion impedance of 80–120 Ω for the 395-006-521-602 geometry, which mismatches typical 50 Ω transmission-line standards. Additionally, ground-return paths through the connector may experience reflections and signal integrity degradation if not carefully routed through multiple ground pins distributed across the connector. System designs using the 395-006-521-602 for high-speed buses (e.g., PCI, SATA, or similar protocols) must implement impedance-controlled routing on the card and motherboard, use source termination to control reflections, and ensure that ground planes beneath the connector contact region are continuous and free of vias that could disrupt return-path uniformity.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 395-006-521-602

Product Attribute 395-006-521-402 395-006-521-612 395-006-521-608 395-006-521-607
Part Number 395-006-521-402 395-006-521-612 395-006-521-608 395-006-521-607
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Flange Feature - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of Positions/Bay/Row - - - -
Series - - - -
Features - - - Simultaneous Sampling
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Positions - - - -
Number of Rows - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Color - - - -
Termination Rows - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Finish Thickness - - - -
Pitch - - - -
Card Thickness - - - -
Read Out - - - -
Material - Insulation - - - -
Gender - - - -
Contact Material - - - -
Contact Finish - - - -
Card Type - - - -
Contact Type - - - -
Termination - - - -

395-006-521-602 Datasheet PDF

Download 395-006-521-602 pdf datasheets and EDAC Inc. documentation for 395-006-521-602 - EDAC Inc..

Datasheets
395-006-521-602 Drawing.pdf
Environmental Information
EDAC REACH.pdf

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395-006-521-602 Image

395-006-521-602

EDAC Inc.
98D-395-006-521-602

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