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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard Connectors395-060-556-804
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395-060-556-804 - EDAC Inc.

Manufacturer Part Number
395-060-556-804
Manufacturer
EDAC Inc.
Allelco Part Number
98D-395-060-556-804
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
46,426 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 60POS 0.100
Package
Box
Data sheet
395-060-556-804.pdf

Environmental Information

EDAC REACH.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 46426
  • Unit Price: $13.067
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $13.067 $13.07
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

395-060-556-804 Tech Specifications
EDAC Inc. - 395-060-556-804 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 395-060-556-804

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Termination Rows 2
Termination Solder
Series 395
Read Out Dual
Pitch 0.100" (2.54mm)
Package Box
Operating Temperature -40°C ~ 105°C
Number of Rows 2
Number of Positions/Bay/Row 30
Number of Positions 60
Mounting Type Board Edge, Straddle Mount
Product Attribute Attribute Value
Material - Insulation Polyester Thermoplastic
Gender Female
Flange Feature Top Mount Opening, Unthreaded, 0.156" (3.96mm) Dia
Features Card Extender
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Black
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 395-060

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What card thickness range does the 395-060-556-804 connector accommodate, and how does this affect PCB design decisions?
The 395-060-556-804 supports card thicknesses between 0.054" and 0.070" (1.37mm to 1.78mm). This relatively narrow tolerance window means PCB material selection and stackup design require careful attention during layout. Cards thinner than 0.054" risk insufficient contact pressure and intermittent connections, while thicker cards may not seat properly or could damage the cantilever contacts. When designing the mating card for the 395-060-556-804, verify your laminate thickness and consider panelization methods that maintain tolerance; some manufacturers use selective thickness buildup or controlled impedance stackups that approach the upper tolerance limit.
How does the dual-row, 60-position configuration of the 395-060-556-804 differ from single-row alternatives in real-world applications?
The 395-060-556-804 organizes 60 contacts across two rows (30 positions per row) at 0.100" pitch, delivering significantly higher density than single-row connectors while maintaining 0.100" spacing—a critical advantage when board real estate is constrained. The dual-row arrangement of the 395-060-556-804 reduces the connector's longitudinal footprint compared to linear alternatives, though it demands more careful contact assignment planning to avoid crosstalk in high-speed signal routing. Applications involving parallel data buses, mixed-signal interfaces, or backplane architectures benefit most from the 395-060-556-804's dual-row configuration because signal and ground returns can be distributed more evenly between rows.
Why is the 10.0µin gold finish on the 395-060-556-804 specified, and what insertion-cycle durability should be expected?
The 0.25µm (10.0µin) gold plating on the 395-060-556-804 provides corrosion resistance and wiping action during insertion while remaining thin enough to avoid mechanical stiffness or contact-area degradation. This thickness is a standard compromise: thinner finishes (5µin) risk inadequate protection in harsh environments, while thicker finishes (25µin+) can increase contact resistance and reduce the wiping effectiveness needed for reliable connection. The 395-060-556-804's cantilever contact geometry combined with the 10.0µin gold finish typically supports 50–100 insertion cycles in controlled environments; however, in applications involving frequent insertion, thermal cycling, or exposure to corrosive atmospheres, the effective cycle life may decrease due to micro-pitting or gold layer breakdown.
What termination and mounting considerations apply when designing a PCB for the 395-060-556-804?
The 395-060-556-804 uses solder termination with a straddle-mount configuration, meaning the connector body straddles the PCB edge while the two termination rows are soldered to the board. This geometry requires PCB edge preparation (controlled thickness, smooth finish, and proper chamfering) to ensure even seating. Unlike press-fit connectors, the 395-060-556-804's solder joints are the primary mechanical and electrical interface, so thermal management during reflow becomes critical—temperature cycling can stress these joints if the card and PCB have significantly different coefficient-of-thermal-expansion (CTE) values. Planning the 395-060-556-804 into the PCB artwork early allows placement of test points, signal integrity vias, and return paths near the termination rows.
How does the -40°C to 105°C operating temperature range of the 395-060-556-804 constrain system design in industrial or aerospace applications?
The 395-060-556-804 is rated for operation from -40°C to 105°C, a range suitable for extended industrial and commercial aerospace environments but not for high-temperature avionics or automotive underhood applications. At the lower extreme, the polyester thermoplastic insulation of the 395-060-556-804 becomes stiffer, potentially increasing contact stress and insertion force; at 105°C, the insulation approaches its glass-transition region, risking dimensional drift and creep. System designers using the 395-060-556-804 must verify that signal integrity margins, contact resistance stability, and adjacent component thermal tolerance remain acceptable across this full range. Thermal transients—such as rapid ramp rates during power-on or thermal cycling during mission profiles—can accelerate aging of the 395-060-556-804's polyester insulation.
What are the practical differences between the 395-060-556-804 and other 60-position edge connectors in terms of contact reliability and maintenance?
The 395-060-556-804's cantilever contact design delivers wiping action during insertion, which helps displace light corrosion and oxidation, making it more forgiving than stamped or stamped-and-formed alternatives in moderately contaminated environments. However, the 395-060-556-804 cannot match the contact reliability of fully plated through-hole or connector designs with integral shielding. When compared to competitive dual-row 60-position connectors, the 395-060-556-804's 0.100" pitch is a standard footprint—offering compatibility with legacy systems but limiting high-speed performance compared to finer-pitch alternatives. The 395-060-556-804 requires periodic inspection in field-deployed systems because the cantilever contacts can accumulate dust and oxidation; regular insertion-cycle refreshment or contact cleaner application may extend reliability in harsh environments.
How does the 0.100" (2.54mm) pitch of the 395-060-556-804 impact signal integrity and EMI performance?
The 0.100" pitch on the 395-060-556-804 is a legacy spacing optimized for moderate data rates and discrete wiring applications; it does not inherently support controlled impedance or differential-pair routing. At frequencies above 50 MHz, the 395-060-556-804's contact-to-contact capacitance and the relatively large PCB trace routing distances create crosstalk and EMI challenges. Signal designers using the 395-060-556-804 must apply careful layout discipline: route high-speed signals away from the connector perimeter, reserve multiple ground positions for return paths, and use series termination or source-impedance control to minimize reflections. The 0.100" pitch of the 395-060-556-804 also makes it difficult to achieve <50Ω differential impedance on standard FR-4, limiting its use in modern high-bandwidth applications.
What card-extender functionality does the 395-060-556-804 provide, and in what test or diagnostic scenarios is it typically deployed?
The 395-060-556-804 is designated as a card-extender connector, meaning it can be mounted on an extension cable or test harness to bring a plugged-in card outside the equipment chassis for probing, measurement, or real-time debugging. This feature allows engineers to insert a logic analyzer, oscilloscope probe, or inline monitor while the system remains powered and operational. The dual 30-position rows on the 395-060-556-804 must maintain signal integrity over the extension cable length—typically limited to 12–36 inches depending on the application's frequency content and crosstalk tolerance. The 395-060-556-804's card-extender role requires careful cable shielding, pair twisting for sensitive signals, and sometimes active buffering to prevent signal degradation or timing errors that could mask the fault being investigated.
Is the 395-060-556-804 suitable for backplane or crate applications, and what mechanical considerations arise in such deployments?
The 395-060-556-804 can function in passive backplane roles—such as distributing power and low-speed signals across multiple plug-in cards—though its 0.100" pitch and cantilever contact geometry make it less robust than purpose-designed backplane connectors for high-insertion-cycle or shock-and-vibration environments. In backplane applications, the 395-060-556-804 must be mounted with careful alignment because misseated cards can lead to partial contacts or pin-to-pin shorts. The dual-row configuration of the 395-060-556-804 simplifies routing of power and ground across multiple card positions, but requires disciplined row assignment to prevent inadvertent coupling between signal and power return paths. Mechanical shock or vibration can cause cards using the 395-060-556-804 to migrate or rock, necessitating retention brackets or keying features not always present on standard connector configurations.
What are the RoHS and supply-chain compliance implications of specifying the 395-060-556-804?
The 395-060-556-804 is RoHS3 compliant and REACH unaffected, confirming that hazardous substances (lead, cadmium, mercury, hexavalent chromium, brominated flame retardants, and phthalates) have been eliminated from its construction. This compliance status simplifies qualification for European markets and OEMs with restricted-substance policies. However, the 395-060-556-804's ECCN classification (EAR99) and HTSUS code (8536.69.4040) indicate it may be subject to U.S. export controls and tariff classifications depending on end-use and destination. When selecting the 395-060-556-804 for a new program, verify lead time with the manufacturer (Mercury United Electronics, Inc.) and distributors, as legacy connector families like the 395 series experience longer replenishment cycles than modern alternatives, and second-sourcing options may be limited.
How do the polyester thermoplastic insulation and copper-alloy contact material of the 395-060-556-804 affect long-term reliability in storage and field deployment?
The 395-060-556-804 uses polyester thermoplastic insulation, which absorbs moisture over time and can lead to insulation resistance drift if stored in humid environments without desiccant protection. The copper-alloy contacts are plated with gold, which provides short-term corrosion protection but can undergo galvanic corrosion if exposed to salt spray or acidic vapors in coastal or industrial settings. When qualifying the 395-060-556-804 for field deployment, accelerated life testing (salt-fog, humidity bias, thermal cycling) should be performed to confirm contact resistance stability and insulation integrity over the intended service life. Stored inventory of the 395-060-556-804 should be maintained at 25°C and <40% RH with periodic re-validation of insulation resistance (minimum 100 MΩ) before installation.
What design tradeoffs should be considered when choosing the 395-060-556-804 versus higher-density or lower-density connector alternatives?
The 395-060-556-804's 60-position, dual-row configuration at 0.100" pitch occupies a middle ground: denser than 40-position single-row connectors but less dense than fine-pitch (0.05" or 0.025") alternatives that support modern high-speed interfaces. The 395-060-556-804 favors legacy systems, industrial controllers, and test equipment where 0.100" pitch is an established standard and where signal frequencies remain below 50 MHz. Moving to finer-pitch connectors to achieve higher density requires redesigned PCBs, new tooling, and re-qualification testing—costs that may not justify the space savings unless density is a critical constraint. Conversely, the 395-060-556-804 may force additional connector stages or larger form factors compared to modern integrated backplane solutions, increasing both cost and power dissipation in thermally constrained enclosures.
How should the 0.156" flange feature of the 395-060-556-804 be incorporated into the mechanical assembly and panel layout?
The 395-060-556-804 includes a top-mount opening with a 0.156" diameter unthreaded flange, intended to allow a card guide pin or ejection-handle post to pass through for mechanical retention and removal. During panel layout, this flange diameter must be accounted for in the cutout design—typically a 0.172" hole to allow clearance—and positioned to avoid interference with adjacent connectors or front-panel components. The flange feature of the 395-060-556-804 can be leveraged to implement card keying: a shaped guide bar or asymmetric ejection mechanism ensures correct card orientation and prevents accidental reversed insertion. Mechanical drawings for systems using the 395-060-556-804 must specify flange clearance, guide-bar geometry, and ejection-force requirements to prevent damage to the insulation or contacts during removal cycles.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 395-060-556-804

Product Attribute 395-060-556-808 395-060-556-504 395-060-556-802 395-060-556-807
Part Number 395-060-556-808 395-060-556-504 395-060-556-802 395-060-556-807
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Material - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Rows - - - -
Pitch - - - -
Material - Insulation - - - -
Series - - - -
Card Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Features - - - Simultaneous Sampling
Contact Finish Thickness - - - -
Contact Finish - - - -
Read Out - - - -
Contact Type - - - -
Card Thickness - - - -
Number of Positions - - - -
Number of Positions/Bay/Row - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Termination Rows - - - -
Flange Feature - - - -
Termination - - - -
Gender - - - -
Color - - - -

395-060-556-804 Datasheet PDF

Download 395-060-556-804 pdf datasheets and EDAC Inc. documentation for 395-060-556-804 - EDAC Inc..

Datasheets
395-060-556-804 Drawing.pdf
Environmental Information
EDAC REACH.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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395-060-556-804 Image

395-060-556-804

EDAC Inc.
98D-395-060-556-804

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