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HomeProductsConnectors, InterconnectsD-Sub Connector Assemblies638-078-630-043
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638-078-630-043 - EDAC Inc.

Manufacturer Part Number
638-078-630-043
Manufacturer
EDAC Inc.
Allelco Part Number
98D-638-078-630-043
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
43,783 pcs available, New & Original
Parts Description
CONN D-SUB RCPT 78POS VERT T/H
Package
Data sheet
638-078-630-043.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 43783
  • Unit Price: $12.772
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $12.772 $12.77
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Specifications

638-078-630-043 Tech Specifications
EDAC Inc. - 638-078-630-043 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. - 638-078-630-043

Product Attribute Attribute Value
Manufacturer EDAC Inc.
Wire Gauge -
Voltage Rating -
Termination Solder
Shell Size, Connector Layout 5 (DD, D) High Density
Shell Material, Finish Steel, Nickel Plated
Series 638
Package -
Operating Temperature -55°C ~ 85°C
Number of Rows 4
Number of Positions 78
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Ingress Protection -
Product Attribute Attribute Value
Flange Feature Mating Side, Female Screwlock (4-40)
Features Shielded
Dielectric Material Polyester Thermoplastic
Current Rating (Amps) 3A per Contact
Contact Type Signal
Contact Material Copper Alloy
Contact Form -
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold
Connector Type Receptacle, Female Sockets
Connector Style D-Sub, High Density
Color Black
Base Product Number 638-078
Backset Spacing -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the Mercury 638-078-630-043 78-position D-Sub receptacle and standard 37-position or 50-position D-Sub connectors for high-density applications?
The Mercury 638-078-630-043 offers 78 contact positions within a D-Sub form factor, providing significantly higher signal density compared to conventional 37-position or 50-position configurations. This allows engineers to consolidate multiple connector types into a single high-density receptacle, reducing PCB footprint and improving mechanical reliability by minimizing connector count. The 638-078-630-043 vertical through-hole mounting enables direct integration into standard PCB assembly processes without requiring daughter boards or adapters, making it suitable for applications requiring parallel signal transmission, multi-channel data acquisition, or complex instrumentation where space constraints favor density over modularity.
How does the vertical through-hole design of the Mercury 638-078-630-043 affect PCB layout and signal integrity compared to right-angle or surface-mount alternatives?
The vertical through-hole orientation of the 638-078-630-043 positions the connector perpendicular to the PCB surface, enabling straightforward trace routing to adjacent components and minimizing trace length between the receptacle and signal conditioning circuits. This geometry reduces signal path capacitance and inductance compared to right-angle variants where signals must traverse horizontal traces. For the 78-position density of the 638-078-630-043, vertical mounting also simplifies layer stack-up management, as engineers can route a substantial portion of traces on inner layers directly beneath the connector footprint rather than routing around the component perimeter. The through-hole construction provides mechanical robustness for high-cycle mating applications, though it requires via planning to accommodate the full pin count within the receptacle footprint.
What typical environmental and EMI challenges should be considered when implementing the Mercury 638-078-630-043 in industrial or aerospace applications?
The Mercury 638-078-630-043, with its 78 female socket positions, concentrates a large number of signal pathways in a compact receptacle, creating potential cross-talk and EMI coupling if trace routing is not carefully managed. Industrial environments with high RF noise or switching transients require shielded or segregated signal paths around the 638-078-630-043 receptacle. Aerospace applications must account for temperature cycling effects on the connector body material and contact resistance stability; female sockets in the 638-078-630-043 are susceptible to oxidation in high-humidity or salt-fog environments, necessitating conformal coating or hermetic sealing strategies. The vertical mounting of the 638-078-630-043 exposes the connector face to direct environmental contamination, so cable strain relief and connector cap retention are critical for long-term reliability. Thermal cycling from -40°C to +85°C or beyond can induce differential expansion between the socket contacts and the mating pins, potentially increasing contact resistance over time.
Can the Mercury 638-078-630-043 be reliably used in applications requiring repeated mating and unmating cycles, and what contact wear considerations apply?
The female socket contact design of the 638-078-630-043 is engineered for multiple mating cycles, but contact life depends on pin material, insertion force, and environmental factors. Typical D-Sub female sockets are rated for 50 to 500 insertion cycles before measurable contact resistance degradation occurs. The 638-078-630-043's 78-position density means contact wear is distributed across many pins, reducing the likelihood of catastrophic failure in any single signal path, though simultaneous wear across all contacts can collectively increase connector resistance. Test insertion under worst-case conditions (misaligned pins, excessive force) can accelerate wear; the 638-078-630-043 requires precision connector bodies and guide pins to minimize side-loading. For applications exceeding 200 mating cycles annually, consider protective measures such as connector caps, contact lubrication compatible with the socket material, or transition to sealed circular connectors if environmental tolerance allows.
How should the Mercury 638-078-630-043 be integrated into a backplane or mother board design to optimize signal routing and minimize crosstalk among the 78 signal paths?
The 638-078-630-043's 78-position density requires disciplined layer stack-up planning to segregate signal classes (analog, digital, power return) and minimize crosstalk. Recommended practice is to dedicate inner PCB layers to ground planes immediately adjacent to the 638-078-630-043 receptacle, with signal traces routed on outer layers and immediately transitioned to inner layers via stitching vias near the connector footprint. Within the 638-078-630-043 pin assignments, alternate signal pins with ground or shield connections where possible; this reduces coupling between adjacent traces. High-speed differential pairs associated with the 638-078-630-043 should maintain consistent impedance (typically 90–100 ohms for differential pairs in standard FR-4) and be separated from single-ended signals by at least 3× the trace width. Power and return pins integrated into the 638-078-630-043 footprint must be distributed strategically to prevent localized voltage drop; treating the 638-078-630-043 as a multi-pin current node requires careful supply rail decoupling on the receiving end. Escape routing from the 638-078-630-043 should avoid vias directly beneath signal traces to prevent impedance discontinuities.
What is the relationship between the Mercury 638-078-630-043 contact pitch and standard PCB via diameters, and how does this affect routing density in the landing pattern?
D-Sub high-density receptacles, including the 638-078-630-043, typically operate at a 0.050-inch (1.27 mm) pitch or finer, depending on the specific density class. The 638-078-630-043's 78-position configuration implies a contact spacing that requires careful via placement within the landing pattern. Standard PCB processes support 0.008-inch (0.2 mm) minimum via diameter with 0.012-inch (0.3 mm) outer pad diameter; routing escape vias from the 638-078-630-043 landing pattern must respect electrical rule checks that prevent vias from overlapping adjacent pads. This constraint often forces via escape routing to occur on a secondary row or offset pattern, increasing trace length and signal path complexity. Multi-layer stackups with blind or buried vias can improve escape routing density around the 638-078-630-043, though at increased PCB fabrication cost. Designers should coordinate with manufacturing early to confirm via stub control and via-in-pad capabilities, which can enable higher-density routing around the 638-078-630-043 at the cost of additional reliability testing.
How does the Mercury 638-078-630-043 compare in reliability and cost to alternative high-density connector technologies such as micro-miniature D-Sub or circular mil-spec connectors for military applications?
The Mercury 638-078-630-043 D-Sub receptacle represents a cost-effective solution for high-density applications, typically 40–60% less expensive than equivalent mil-spec circular connectors (MS3106 or similar) providing comparable pin counts. The 638-078-630-043 standardized D-Sub form factor enables off-the-shelf mating cables, reducing procurement lead times and enabling rapid prototype iteration. Micro-miniature D-Sub variants (such as 0.025-inch pitch) offer higher density than the 638-078-630-043 but introduce assembly complexity and higher defect rates in high-volume manufacturing. For military or aerospace environments, the 638-078-630-043 must be evaluated against sealed circular connector alternatives; circular connectors typically offer superior environmental sealing and vibration resistance, but the 638-078-630-043's vertical through-hole mount and standardized mating harness ecosystem may offset environmental limitations through redundancy or secondary sealing. Long-term supply chain risk favors the 638-078-630-043 due to multiple sources for D-Sub components, whereas mil-spec circular connectors face narrower supplier bases.
What testing and qualification protocol should be applied to the Mercury 638-078-630-043 before production release in applications involving safety-critical or high-reliability systems?
Safety-critical applications (automotive, medical, avionics) require qualification of the 638-078-630-043 beyond standard datasheet validation. IPC-TM-650 Section 2.6.3.1 (contact resistance measurement) should be performed on representative 638-078-630-043 samples across incoming inspection, mid-production, and end-of-life lots to establish baseline and drift trends. Thermal cycling from -40°C to +85°C over 10–20 cycles should be performed on populated 638-078-630-043 receptacles with monitored contact resistance; discontinuities exceeding 10% of baseline suggest solder joint or contact degradation. Environmental stress screening (ESS) including humidity chamber exposure (85°C/85% RH for 168 hours) followed by thermal cycling validates long-term reliability. For the 638-078-630-043, vibration testing per MIL-STD-810H Method 514 (broadband random vibration, 20–2000 Hz) should confirm that the connector body does not shift within the PCB footprint and that contact resistance remains stable. Contact force verification on mating and de-mating cycles, using pull-force test fixtures calibrated to the 638-078-630-043 pin specifications, should confirm that socket contacts maintain engagement force within manufacturer tolerance. Reliability predictions using Telcordia or MIL-HDBK-217F methodologies should estimate failure rates for the 638-078-630-043 under system duty cycle conditions.
Are there specific design guidelines for the Mercury 638-078-630-043 when used in high-temperature applications, and how do contact materials and connector body composition affect performance above 70°C?
The Mercury 638-078-630-043 connector body material, typically polycarbonate or thermoplastic composite, exhibits modulus reduction and dimensional creep above 70°C, which can degrade contact retention force and increase contact resistance variation. High-temperature applications (85°C sustained, 125°C intermittent) require verification that the 638-078-630-043 socket contact springs maintain minimum engagement force throughout the operating range; many standard D-Sub connectors are rated only to 70°C nominal. Contact materials in the 638-078-630-043 female sockets are typically nickel or gold-plated copper; gold plating provides superior corrosion resistance but offers lower hardness, whereas nickel plating tolerates higher contact force. For temperatures exceeding 85°C, the 638-078-630-043 should be paired with mating pins constructed from materials with matching thermal expansion coefficients (typically copper alloy with plating compatible to the socket); mismatched expansion rates induce mechanical stress on contacts during thermal cycling. Connector body ventilation and thermal dissipation around the 638-078-630-043 installation location must be ensured to prevent localized hot-spots exceeding material glass transition temperatures. Testing the 638-078-630-043 under bias (loaded pins carrying rated current) at elevated temperature reveals additional stress on socket contacts and can identify premature wear modes not apparent in dry contact testing.
What is the recommended approach for integrating the Mercury 638-078-630-043 with modern high-speed digital interfaces (USB, Ethernet, PCI Express), and are there impedance or signal integrity constraints?
Integrating the Mercury 638-078-630-043 into high-speed applications requires careful evaluation of the connector's parasitic characteristics. Standard D-Sub connectors exhibit trace inductance of 2–5 nanohenries per pin and inter-pin capacitance on the order of 1–3 picofarads, which can introduce impedance discontinuities in high-speed signal paths. For high-speed digital protocols routed through the 638-078-630-043, impedance control over the connector transition must be maintained through careful trace routing, ground via placement, and possibly selective use of controlled-impedance footprints. USB or Ethernet applications using the 638-078-630-043 should isolate differential pairs from single-ended signals and provide dedicated ground returns to minimize common-mode coupling. PCI Express or other multi-gigabit interfaces are generally not recommended directly through the 638-078-630-043 due to propagation delay and jitter accumulation; instead, the 638-078-630-043 should carry lower-speed side-band signals or power distribution, with high-speed signals routed via dedicated connectors (Mini DisplayPort, LVDS, optical) or daughter board interfaces. If legacy designs require high-speed operation through the 638-078-630-043, equalization (active or passive) on the receiving end may compensate for insertion loss, though design validation through time-domain reflectometry (TDR) and S-parameter measurement is essential. The 638-078-630-043 maximum signal frequency is typically limited to 100–250 MHz for unequalized single-ended signals, well below modern high-speed protocol requirements.
How should the Mercury 638-078-630-043 be properly stored, handled, and protected from oxidation and contamination before assembly to ensure contact reliability?
The Mercury 638-078-630-043 female socket contacts are susceptible to oxidation if exposed to humid or corrosive atmospheres during storage. Best practice includes storing the 638-078-630-043 in sealed ESD-safe packaging with desiccant packs; relative humidity should be maintained below 40% throughout the supply chain. Upon receipt, the 638-078-630-043 should be inspected under magnification for contact discoloration, corrosion, or mechanical damage before being added to inventory. Storage duration for the 638-078-630-043 should be limited to 12 months from manufacture under controlled conditions; extended storage (beyond 18–24 months) may require contact cleaning or re-plating verification prior to assembly. Handling of the 638-078-630-043 during PCB assembly must include ESD precautions (wrist straps, conductive work surfaces) to prevent electrostatic discharge that could damage integrated circuits connected downstream. The 638-078-630-043 should not be exposed to soldering fumes or flux residue that could coat socket contacts; wave-soldering or manual solder touch-up near the 638-078-630-043 footprint should be minimized. If the 638-078-630-043 is subjected to storage in corrosive environments (salt-fog, high-humidity regions), contact resistance should be verified with ohm-meter measurement on incoming inspection lots; contact resistance exceeding 100 milliohms at 1 ampere typically signals oxidation requiring contact cleaning or connector replacement prior to assembly.
What are the mechanical tolerancing and alignment requirements for the Mercury 638-078-630-043 PCB landing pattern to ensure consistent mating performance and avoid pin skew or damage during connector insertion?
The Mercury 638-078-630-043 landing pattern must adhere to IPC-7351 standards for D-Sub connector footprints, with positional tolerance typically ±0.005 inches (0.127 mm) for the primary mounting holes and contact pad locations. Datum alignment from the two mounting screw holes is essential; the 638-078-630-043 mating receptacle relies on these reference points for guide pin alignment, and PCB layout errors exceeding ±0.010 inches can induce pin skew during insertion. The 638-078-630-043 contact pads must be sized to accommodate solder fillets without bridging to adjacent pins; IPC-A-600 Class 2 or 3 soldering standards apply, with annular ring minimums of 0.005 inches around each via in the 638-078-630-043 pad pattern. Through-hole plating thickness (typically 0.001–0.003 inches) must be uniform across all 78 positions of the 638-078-630-043 to ensure consistent lead insertion force and contact retention. CTE (coefficient of thermal expansion) mismatch between the PCB and the 638-078-630-043 connector body can induce stress during thermal cycling; specifying the 638-078-630-043 body material with CTE matched to FR-4 PCB (both nominally 15–17 ppm/°C) mitigates mechanical stress. Test fixtures for assembly should be validated to confirm that the 638-078-630-043 seats fully and evenly on the PCB surface; uneven seating can cause contact misalignment and inconsistent resistance across the pin array.

Parts with Similar Specifications

The three parts on the right have similar specifications to EDAC Inc. 638-078-630-043

Product Attribute 638-078-630-042 638-078-630-047 638-078-630-049 638-078-630-046
Part Number 638-078-630-042 638-078-630-047 638-078-630-049 638-078-630-046
Manufacturer EDAC Inc. EDAC Inc. EDAC Inc. EDAC Inc.
Number of Rows - - - -
Contact Finish Thickness - - - -
Shell Size, Connector Layout - - - -
Connector Type - - - -
Voltage Rating - - - -
Dielectric Material - - - -
Contact Material - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Type - - - -
Color - - - -
Ingress Protection - - - -
Material Flammability Rating - - - -
Termination - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Connector Style - - - -
Flange Feature - - - -
Current Rating (Amps) - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Shell Material, Finish - - - -
Series - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Features - - - Simultaneous Sampling
Contact Form - - - -
Contact Finish - - - -
Number of Positions - - - -
Wire Gauge - - - -
Backset Spacing - - - -

638-078-630-043 Datasheet PDF

Download 638-078-630-043 pdf datasheets and EDAC Inc. documentation for 638-078-630-043 - EDAC Inc..

Datasheets
638-078-630-043 Drawing.pdf 637,638 Series Ordering Guide.pdf

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638-078-630-043 Image

638-078-630-043

EDAC Inc.
98D-638-078-630-043

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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